ficonTEC, Hermes Testing target CPO testing scale-up with INS-2 platform

, Taipei

Oct 2, 2026, 16:34 0

CPO’s complex 3D integration creates new challenges for wafer-level optoelectronic testing. Credit: DIGITIMES

ficonTEC, a maker of optoelectronic automation assembly and test equipment, has announced a strategic partnership with Hermes Testing Solutions Inc. (HTSI) to support Taiwan's rapidly expanding co-packaged optics (CPO) ecosystem...

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