Packaging and testing houses expect demand to pickup from May

We have recently changed our search engine. Check the Advanced options to learn the new search rules.

Comments from readers

Amy Lee, Hsinchu; Rodney Chan, DIGITIMES Asia

Monday 6 March 2006

Add your comments

Can we post your comment and/or question anonymously on this page (for anyone to read)?
Yes No

Related stories

Second-tier packaging-and-testing houses benefiting from industry-wide tight capacity (Apr 4, 2006)
ASE and SPIL see order visibility into 4Q (Apr 3, 2006)
IEK: ASE and SPIL grab 40% of Taiwan’s backend IC production in 2005 (Mar 30, 2006)
Chartered Semiconductor said to be raising prices for Taiwan packaging and testing capacity (Mar 30, 2006)
Intel said to be releasing northbridge packaging and testing orders (Mar 24, 2006)
ChipMOS to budget over US$250 million for expansion of memory and LCD-driver-IC test capacity (Mar 16, 2006)
DDR2 market rebound said to be short lived (Mar 7, 2006)
Novatek considers negotiating prices with testing houses in 2Q, LCD-driver-IC ASPs may slide (Feb 24, 2006)
Chipbond to cut prices amid order drainage; LCD driver IC packaging demand to pick up in 2Q (Feb 23, 2006)
Industry speculates that SPIL’s China investment is for memory card assembly (Feb 22, 2006)
Driver IC testing and packaging orders to grow 30-40% from April (Feb 20, 2006)
SPIL chairman: Packaging and testing sector to see growth this year (Feb 10, 2006)
SPIL doubles profits in 2005 (Feb 9, 2006)
ASE said to be investing US$200 million to expand substrate capacity (Feb 8, 2006)
Taiwan testing and packaging firms confident about 1Q (Feb 7, 2006)
SPIL to expand packaging and testing capacity on driver IC orders from Himax (Jan 26, 2006)
ASE may be recovering its PBGA capacity but rivals express doubts (Jan 26, 2006)
SPIL looking more aggressive than ASE in wire bonder expansion (Oct 6, 2005)

Microsoft's custom chip sets new industry benchmark while deepening AI partnerships across sectors
As Microsoft transitions from a software giant to a cloud leader, with its cloud business now accounting...

Inside TSMC: Morris Chang's Journey
TSMC founder Morris Chang's second autobiography volume unveils a tapestry of milestones, including his influential comeback, rekindled alliances with...

CSP in-house development of ASIC accelerators

Google TPUs will see a share of over 70% in the in-house developed cloud ASIC accelerator market in 2024; an all-optical network...

AI chip market outlook 2023-2028: Insights from demand and supply perspectives

The growing demand for AI computational power is accelerating advancements in hardware and chip technology, necessitating innovation...

Automotive CIS tech development, 2024

The popularization of autonomous driving is boosting demand for automotive CIS with LFM and HDR being mainstream development...

10 days cloud