中文網
繁體
简体
SUBSCRIBE
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
Middle East
RESEARCH
OPINIONS
Opinions Home
Interviews
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
Electronica
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
Apple
Huawei
Nvidia
AI Search
Scaling AI Glasses
Inference Era AI
Advanced Packaging
Trending
SUBSCRIBE
CONNECT WITH US
Home
Opinions
Topics
DIGITIMES ASIA 2024 OUTLOOK
ASIAN PERSPECTIVES
BIZ FOCUS
Sep 24, 08:00
FSP Debuts World's First 80 PLUS Ruby ATX PSU
Wednesday 23 September 2026
The Robot in the Supply Chain
Tuesday 22 September 2026
AT&S Unveils Strategy to Drive AI Growth
Tuesday 22 September 2026
GUC Announces 2nm 16 Gbps HBM4E IP
MOST-READ
7 DAYS NEWS
Update: ABF substrate maker Unimicron searched in origin-labeling probe
Qualcomm's HBC play pulls Samsung and SK hynix into a new race beyond HBM
Google TPU pays back investment in 1 year, creating upside for MediaTek, Broadcom ASIC revenues
ASML lines up Intel, TSMC and Samsung behind 12-inch masks — TSMC alone sets a timeline
TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity
Microsoft to invest US$10B in Middle East AI infrastructure, despite war risks
Xi's US visit stirs alarm over a possible Chinese auto push into America
Trump-Xi pre-summit watch: H20 setbacks and Ascend gains reshape China's Nvidia calculus
SK Hynix Indiana HBM plant faces lawsuit
Alibaba Zhenwu V900 joins Huawei Ascend 960 in race to fill Nvidia's China AI compute gap
Full list
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first