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    Huawei reportedly shifts AITO partnership to Seres-led model
    Sep 15, 19:08
    China's FAW to become GAC's second-largest shareholder as auto consolidation talk returns
    Sep 15, 19:08
    Column: China tightens rare earth controls, and Taiwan must guard supply chain flexibility
    Sep 15, 19:08
    Analysis: Behind China's CNY30 trillion electronics plan—can AI and robotics outrun a maturing market?
    Sep 15, 19:08
    China’s wafer fabs boost local equipment buying, pressuring South Korean suppliers
    Sep 15, 19:08
    NEWS TAGGED 2030
    Tuesday 15 September 2026
    SiPh shifts optical module bottleneck upstream: from device manufacturing to laser-grade substrate supply

    The market value of optical modules used in data centers is projected to grow from US$12.6 billion in 2025 to US$45.4 billion by 2030...

    Friday 11 September 2026
    Chipmaking equipment spending could hit US$270 billion by 2030, Futurum says
    Global wafer fab equipment (WFE) spending could reach about US$270 billion in 2030 as data center expansion drives demand for advanced logic, high-bandwidth memory (HBM), DRAM and...
    Friday 11 September 2026
    CIOE 2026: Automotive optical-module demand could rival FTTx shipments by 2030
    Automotive optical-module demand could approach the scale of the established FTTx market by around 2030 as increasingly data-intensive vehicles shift high-bandwidth connections from...
    Monday 7 September 2026
    Model fatigue, China's price pressure, and a profit horizon still years away
    The AI industry's release calendar has compressed to the point where a single week can carry five frontier or near-frontier launches, but the acceleration is not a sign of confidence...
    Monday 31 August 2026
    Musk tackles key AI power bottleneck with in-house turbine foundry
    A move by SpaceX to manufacture turbine blades in-house could ease a global bottleneck in AI infrastructure, where power equipment is now as constrained as chips. If successful, the...
    Wednesday 26 August 2026
    China fusion consortium targets 25T superconducting magnet prototype by 2030
    China's nuclear fusion supply chain is stepping up work on high-temperature superconducting magnet technology. At the 2026 Fusion Energy Conference on August 25, China Fusion Energy...
    Wednesday 26 August 2026
    Driving the future: Malaysia's strategic automotive evolution at GATE 2026
    The Global Automotive and Technology Expo 2026 (GATE 2026) officially opened on August 26, spotlighting efforts to deepen Malaysia's local supply chain, accelerate technology adoption...
    Monday 24 August 2026
    Etron chair sees memory boom extending to 2028-2030
    The memory industry is undergoing a structural shift as AI demand surges, and Etron Technology chairman Nicky Lu said the sector's boom will stretch beyond 2027, with shortages likely...
    Monday 24 August 2026
    India weighs new capital subsidies to build domestic polysilicon capacity
    India is preparing a new capex-based subsidy scheme to support domestic polysilicon manufacturing, as the government seeks to reduce import dependence and build a more integrated solar...
    Monday 24 August 2026
    AI compute race heads toward space as MediaTek executive says 1 million H100s will be mid-tier by 2030
    Speaking at DIGITIMES' "AI on Chips: Semiconductor Industry Outlook Forum," MediaTek senior director Bor-Sung Liang said AI development is shifting from individual large language models...
    Monday 24 August 2026
    Agentic AI opens new era for humanoid robots, shipments to jump fourfold by 2030

    Humanoid robots have entered a clear new phase since agentic AI emerged in 2025, with DIGITIMES analyst Zouhao Shen saying the category...

    Friday 21 August 2026
    Samsung holds off on High-NA EUV until 1nm production
    Samsung Electronics does not expect to move High-NA EUV lithography into volume production until its 1nm-class generation, a timeline that points to around 2030, after it had earlier...
    Friday 14 August 2026
    SanDisk lays out multiyear NAND roadmap and AI storage targets at investor day

    SanDisk Corp used its August 13, 2026 investor day to detail a technology roadmap and a set of financial targets it says will carry...

    Friday 14 August 2026
    Rapidus targets 8-reticle interposers by 2030
    Rapidus expects interposers for high-performance chips to reach eight-reticle scale by around 2030, as larger chiplets and high-bandwidth memory (HBM) push advanced packages toward...
    Thursday 13 August 2026
    Samsung delays High-NA EUV adoption until 1nm production in 2030
    Samsung Electronics plans to introduce high-numerical-aperture extreme ultraviolet (High-NA EUV) lithography into mass production at its 1nm node around 2030, according to South Korean...
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    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
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