中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    NEWS TAGGED 2NM
    Thursday 2 April 2026
    Samsung ramps Texas fab as engineers gather for 2nm push

    Samsung Electronics has reportedly moved into the equipment installation and testing phase at its foundry in Taylor, Texas, transitioning...

    Wednesday 1 April 2026
    Samsung's 2nm Exynos 2600 loses to Qualcomm's 3nm on battery and thermals
    Samsung's Exynos 2600 application processor (AP), built on the company's 2nm process, lags in battery endurance behind Qualcomm's Snapdragon 8 Elite Gen 5 — a 3nm chip —...
    Tuesday 31 March 2026
    Samsung targets 1nm production by 2030, challenges TSMC with new chiplet technology
    Samsung Electronics is aiming to launch its 1nm semiconductor process by 2030 as part of a direct technological competition with rival TSMC. The move seeks to secure leadership in...
    Wednesday 25 March 2026
    Samsung's 2nm yield surpasses 60%, tripling in 6-month span
    Samsung Electronics has reportedly raised the yield of its 2nm wafer foundry process above 60%, a significant jump from around 20% in the second half of 2025. Industry analysts say...
    Wednesday 25 March 2026
    Commentary: How Taiwan's chip talent flow is shifting—lessons from SMIC and Terafab
    Tesla CEO Elon Musk has launched the "Terafab" 2nm wafer fab project and initiated a global recruitment drive targeting high-level semiconductor talent, including engineers from Taiwan...
    Saturday 21 March 2026
    Analysis: Samsung's Exynos chip rebounds with mixed performance in 2nm era
    Samsung Electronics' self-developed mobile application processor (AP) series, Exynos, long criticized for poor performance and overheating issues, is showing signs of revival. The...
    Thursday 19 March 2026
    Rapidus scales back US 2nm R&D early, raising timeline and funding concerns
    With support from the Japanese government, Rapidus has been advancing R&D and pilot production testing to mass-produce 2nm chips by 2027. However, due to funding constraints and...
    Friday 13 March 2026
    Samsung targets 2nm process for HBM4E base die to boost AI chip edge
    Samsung Electronics is reportedly planning to adopt a 2-nanometer (nm) process for the base die of its next-generation high-bandwidth memory (HBM), HBM4E, aiming to enhance its technological...
    Tuesday 10 March 2026
    TSMC expansion triggers filter material shortage and price surge
    As the global semiconductor manufacturing process advances below 2nm, wafer fabs are demanding increasingly stringent cleanroom environments. This has rapidly boosted demand for airborne...
    Tuesday 10 March 2026
    MAtek's testing business grows with AI-era chip complexity, but profits fall
    MAtek reported record quarterly revenue in the fourth quarter of 2025 amid rising outsourced demand for materials analysis and reliability assurance, but net income after tax declined...
    Friday 6 March 2026
    Samsung reports faster-than-expected 2nm yield gains, aims to triple HBM revenue
    Samsung Electronics announced that its 2nm process yield is improving faster than expected, signaling strong progress in semiconductor manufacturing. The company also revealed plans...
    Friday 6 March 2026
    Tesla to reportedly double AI6 chip orders, boosting Samsung Texas plant utilization

    The semiconductor industry had widely expected Samsung's Taylor fab to begin large-scale production before the end of 2026. However, the...

    Tuesday 3 March 2026
    Rapidus to partner with Canon on 2nm image-processing chips, raising supply and investment implications
    Rapidus will co-develop 2nm image-processing semiconductors with Canon for cameras and surveillance devices, Nikkei reported, and will trial-produce chips at Rapidus's Chitose,...
    Monday 2 March 2026
    Rapidus raises US$1.7 billion to support 2nm mass production by 2027
    Japan's state-backed chip venture Rapidus announced on February 27 that it has secured a total of JPY267.6 billion (about US$1.7 billion) in new funding from both government and private-sector...
    Monday 2 March 2026
    Insight: Broadcom delivers 2nm 3.5D AI processor, expanding custom chip push against Nvidia

    Broadcom has begun shipping the industry's first 2nm custom compute SoC built on its 3.5D eXtreme Dimension System in Package (XDSiP) platform...

    1/28 pages
    Research Report Database
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
    biz
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook