Samsung has announced plans to expand its support for DSPs (Design Service Partners) to help South Korean IC design companies deepen their presence in the HPC (High-Performance Computing)...

Samsung's recent announcement of securing a 2nm chip order from Japan's AI accelerator developer Preferred Networks (PFN) has sparked discussions about the actual production progress...

Applied Materials introduced the industry's first use of ruthenium in high-volume production, enabling copper chip wiring to scale to the 2nm node and beyond while reducing resistance...

According to Bloomberg citing UBS forecasts, Taiwan Semiconductor Manufacturing Company (TSMC) could spend up to US$37 billion in capex in 2025, marking a 15.6%...

Samsung Electronics has announced that it will provide turnkey semiconductor solutions using the 2-nanometer (nm) foundry process and the advanced 2.5D packaging technology Interposer-Cube...

Samsung Electronics' wafer foundry in Taylor, Texas, initially set to mass-produce 4nm process technology, is reportedly shifting to 2nm processes.

Synopsys has announced that its AI-driven digital design and analog design flows have achieved certification on Samsung Foundry's SF2 process with multiple test chip tape-outs.

Nvidia CEO Jensen Huang attended Computex 2024 in Taipei last week, sparking an AI frenzy in Taiwan.

Semiconductor foundry companies have started to compete in the 2nm process shortly after their 3nm production lines started humming to mass produce for customers. There is something...

As previous subsidies of a total of JPY920 billion (nearly US$6 billion) may not be sufficient to help Rapidus achieve its goal of mass-producing 2nm chips, Japan's Ministry of Economy,...

Samsung Electronics is reportedly investing in developing 2nm mobile Application Processors (AP), a technology that has yet to be commercialized.

Japanese semiconductor foundry Rapidus, aiming to mass-produce 2nm chips, has announced a collaboration with US-based AI chip startup Esperanto Technologies to jointly develop desi...

Japan's semiconductor foundry startup Rapidus, now on a mission to mass produce 2nm chips by 2027, is developing advanced packaging and chiplet technologies, with a particular focus...

Synopsys has disclosed extensive EDA and IP collaboration with TSMC for advanced node designs, which have been used in a wide range of AI, high-performance computing, and mobile applications...

At the 2024 North America Technology Symposium, TSMC demonstrated its latest semiconductor process, advanced packaging, and 3D IC technologies, which will drive the next wave of AI...