News tagged adoption at DIGITIMES

NEWS TAGGED ADOPTION

Friday 28 August 2026

Foxconn eyes higher margins with push beyond contract manufacturing

AI adoption continues to expand, but putting the technology to work and integrating it into everyday operations remain key hurdles. Speaking at the 2026 Taiwan Sustainability Summit,...

Friday 28 August 2026

Renesas opens physical AI, robotics lab in Beijing

Renesas Electronics has opened a physical AI and robotics lab in Beijing, a move that could speed the development of safer, smarter machines for factories, logistics, and homes worldwide...

Thursday 27 August 2026

MiniMax revenue surges 283% as enterprise adoption increases

Chinese AI startup MiniMax Group reported a 283.1% increase in revenue, rising from US$30.4 million for the six months ended June 30, 2025, to US$116.6 million for the six months ended...

Wednesday 26 August 2026

Deloitte Taiwan sees slow physical AI adoption despite high expectations

Deloitte Taiwan said global companies are rushing to discuss physical AI, but only a small share have embedded it into day-to-day operations, highlighting a widening gap between ambition...

Friday 21 August 2026

800VDC adoption in AI data centers is set to reshape power chip demand

A shift to 800VDC power architectures in next-generation AI data centers is gathering pace, with implications for GPU planning, power semiconductor demand, and rack design. Many vendors...

Thursday 20 August 2026

Commentary: How iPad Air became a catalyst for IT OLED expansion

Apple kicked off the tablet OLED era in 2024, introducing Tandem OLED in the iPad Pro to overcome bottlenecks in display lifespan and brightness. The iPad mini followed, set to adopt...

Wednesday 19 August 2026

China's new automotive chip rules target the last mile to vehicle adoption

China has introduced five automotive chip certification and accreditation industry standards aimed at easing a key obstacle to domestic...

Tuesday 18 August 2026

Rockchip profit jumps 62% as edge AI chips scale across devices

China AIoT chip designer Rockchip posted record first-half 2026 results, with revenue rising 40.6% year on year to CNY2.88 billion (US$427...

Tuesday 18 August 2026

AI pays off for 80% of Taiwan enterprises — but data gaps loom, study found

Data analytics firm Dun & Bradstreet released its "Taiwan Enterprise AI Momentum Index" for the third quarter of 2026, revealing...

Sunday 16 August 2026

TV slowdown accelerates panel makers' shift to IT OLED, UBI Research found

With global TV demand slowing and panel prices continuing to fall, display makers are facing intensifying profit pressure. Analysts...

Saturday 15 August 2026

Asia Vital Components sees stronger AI server demand and faster liquid cooling adoption

Asia Vital Components expects global AI server demand to strengthen in the second half, with liquid cooling adoption becoming more...

Friday 14 August 2026

Samsung and SK hynix push AI deeper into fabs as semiconductor manufacturing enters autonomous era

As the world enters an AI-powered era where the persistent need for more complex architectures is driven by rising demands for higher computing performance, one bottleneck confronting...

Thursday 13 August 2026

Samsung delays High-NA EUV adoption until 1nm production in 2030

Samsung Electronics plans to introduce high-numerical-aperture extreme ultraviolet (High-NA EUV) lithography into mass production at its 1nm node around 2030, according to South Korean...

Thursday 13 August 2026

SK Hynix expands EUV roadmap with High-NA tools and PSM adoption

SK hynix said it is advancing its use of extreme ultraviolet (EUV) lithography for the mass production of next-generation DRAM, with high-numerical-aperture (High-NA) EUV equipment...

Thursday 13 August 2026

409.6T switches could push industry toward CPO, Arista says

Co-packaged optics (CPO) has become a major focus of the optical networking industry, but pluggable modules remain the mainstream choice for optical interconnects. At a silicon photonics...

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Aug 27, 08:00

ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026

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