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    LG Electronics's three strategies to counter competition from Chinese brands
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    China's SeeYA wins Meta’s MR panel order as BOE misses certification
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    Qualcomm says HBC memory architecture offers better value than HBM as hyperscalers show interest
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    InP enters a capacity race as TCL moves into indium phosphide laser chips
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    Taiwan’s semiconductor materials sector sees opportunity in advanced packaging and CPO
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    Huawei lifted R&D spending to push AI chips and semiconductor self-reliance
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    NEWS TAGGED ASIC
    Tuesday 1 September 2026
    Nvidia and MediaTek link AI technologies in bid to accelerate custom data center chip adoption
    Nvidia and MediaTek are widening a global AI partnership that could reshape data center, edge, and PC hardware markets. MediaTek's US$3.9 billion overseas convertible bond sale, largely...
    Tuesday 1 September 2026
    Nvidia targets HBM race with custom NVHBM, expands NVLink Fusion
    As trillion-parameter large language models (LLMs) and agentic AI become mainstream, the AI infrastructure bottleneck is shifting from raw compute power toward system-level integration...
    Monday 31 August 2026
    Repon to ship Vera Rubin rails in August, ramp ASIC in September
    Server rail maker Repon began shipping Nvidia's Vera Rubin rack products in August 2026, with ASIC server rack rails set for mass production in September. The higher average selling...
    Friday 28 August 2026
    ASIC makers see CSP orders stay strong through 2028
    The four major US cloud service providers (CSPs) have already rewritten their 2026 capital expenditure records, and ASIC vendors are increasingly confident that demand will remain...
    Thursday 27 August 2026
    Google, MediaTek embrace advanced packaging diversification
    Google and MediaTek are moving toward advanced packaging diversification, as Intel's embedded multi-die interconnect bridge (EMIB) gains traction after Google's TPU was confirmed to...
    Wednesday 26 August 2026
    Google's TPU v10 turns multi-vendor, deepening MediaTek's ASIC role
    Google's expanding list of TPU partners has sparked widespread industry discussion, centering on whether current IC design suppliers Broadcom and MediaTek will see their orders imp...
    Tuesday 25 August 2026
    Anthropic bets on in-house chips, reshaping ASIC orders
    Anthropic confirmed on August 5 that it is building an internal silicon team to design custom chips for its Claude models, signaling a sharper push into self-developed AI hardware...
    Tuesday 25 August 2026
    Vera Rubin transition gap eases as ASIC, general servers rescue supply chain
    As Nvidia's next-generation Vera Rubin platform enters deployment, Taiwan's server supply chain is finding ways to bridge the transition gap before ramping up volume production. Ongoing...
    Tuesday 25 August 2026
    Commentary: Nvidia's 15% hike piles pressure on the AI supply chain, lifts ASIC prospects
    Nvidia has reportedly notified major customers that server systems using its AI chips will rise by more than 15%, with the new pricing set to apply to models shipping from early 2027,...
    Monday 24 August 2026
    MediaTek, GUC, Alchip escalate funding war as global ASIC race demands deep capital
    Custom Application-Specific Integrated Circuit (ASIC) chips backed by hyperscalers are set for a mass-production boom starting late 2026, with next-generation projects already in full...
    Monday 24 August 2026
    Research Insight: ASIC shipments projected to overtake GPU by 2027 as AI reshapes memory
    ASIC and GPU shipments will reach a "golden cross" in 2027, with ASIC shipments expected to surpass GPU shipments for the first time at 15.3 million units, DIGITIMES Intelligence analyst...
    Friday 21 August 2026
    Google, Marvell long-term deal keeps Broadcom at bay, limits MediaTek impact

    Marvell filed a Form 8-K with the US Securities and Exchange Commission on August 19, 2026, revealing that it signed a commercial agreement...

    Thursday 20 August 2026
    PGC Helps Startups Accelerate ASIC Development with Turnkey Services

    With more than 35 years of experience in ASIC design services, Progate Group Corporation (PGC, TPEx: 8227), a member of the TSMC Design Center Alliance (DCA) and a Synopsys...

    Thursday 20 August 2026
    Chroma's Proprietary ASIC Technology Reshapes the Semiconductor Test Landscape

    As demand for AI servers, high performance computing (HPC), and data center infrastructure accelerates, the semiconductor and power electronics test equipment market...

    Wednesday 19 August 2026
    Google's v10 TPU opens door to AMD without sidelining Broadcom, MediaTek

    Market speculation that AMD is working with Google on technology for its v10-generation tensor processing unit (TPU) has prompted questions...

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    BIZ FOCUS
    Sep 1, 08:00
    Rising Packaging Complexity Elevates Glass in Semiconductor Manufacturing
    Monday 31 August 2026
    NewPower Worldwide expands credit facility to $750M for growth
    Monday 31 August 2026
    Tescan Connects Buried Defect Localization to Nanoscale Analysis at SEMICON
    Thursday 27 August 2026
    ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026
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