The ongoing COVID-19 pandemic has caused bottlenecks in labor relations, transport, and logistics operations worldwide, which may lead to delays in foundries' installation of new...

The Shanghai municipal government has newly released a package of generous incentives to encourage investments in the development and production of semiconductor materials and equipment,...

Intel has made its first purchase order for ASML's TWINSCAN EXE:5200 system, marking the next step on the path to EUV 0.55 NA (High-NA) introduction.

ASML has provided an update on the fire that occurred inside a part of its factory in Berlin, Germany on January 3, and expects the incident to have a limited impact on production...

Taiwan-based IC backend equipment specialists, particularly those specializing in advanced packaging equipment, are poised to generate record-high sales in 2021, buoyed by robust...

TSMC's equipment and materials suppliers including All Ring Tech, Foxsemicon Integrated Technology, Kinik, Marketech International and Nova Technology are expected to enjoy brisk...

TSMC's ecosystem partners, particularly equipment makers, are poised to embrace strong growth momentum, as the foundry will be expanding its fab capacities over the next three years,...

China-based foundry house Semiconductor Manufacturing International (SMIC) has approved the departure of Chiang Shang-Yi, who submitted his resignation as company vice chairman.

With Intel announcing plans to adopt ASML's high-NA EUV machines in its post-nanometer process technology that is expected to be ready for production by 2025, ASML has disclosed it...

Micron Technology has seen manufacturing yield rates for its 1α (1-alpha) DRAM and 176-layer NAND process nodes reach mature levels.

TSMC's equipment suppliers remain optimistic about demand from the foundry, which has been stepping up its pace of advanced technology development and capacity expansion, according...

Intel has revealed the roadmap of its process and packaging innovations that will power the next wave of products through 2025 and beyond.

ASML expects to post an around 35% revenue increase in 2021, with gross margin reaching between 51% and 52%.

Micron Technology has disclosed plans to start implementing extreme ultraviolet (EUV) technology in the manufacture of DRAM chips by 2024.

Pure-play foundry TSMC is expected to kick off equipment move-in at its new advanced 5nm fab in the US state of Arizona as early as mid 2022, according to industry sources.