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Wednesday 8 April 2026
Compal launches Sylux in US to expand automotive infrared safety solutions
Compal Electronics has officially registered its Sylux brand in the US, marking a key milestone in accelerating its automotive business, as the company aims to grow non-PC revenue...
Wednesday 8 April 2026
Innolux's CarUX debuts next-gen smart cockpit at Touch Taiwan 2026 after Pioneer merger
Innolux subsidiary CarUX completed its merger with Pioneer on December 1, 2025, combining their visual and acoustic expertise to accelerate next-generation in-car innovation. The combined...
Wednesday 8 April 2026
Corning to showcase breakthrough tech at Touch Taiwan 2026
Corning will present materials and connectivity innovations at Touch Taiwan 2026 in support of global AI infrastructure, semiconductor packaging, and consumer electronics supply chains,...
Wednesday 8 April 2026
Commentary: How Taiwan is becoming a strategic partner in America's auto reindustrialization
Recently, the American Institute in Taiwan (AIT) has made a series of unusually high-profile appearances at promotional events for US automakers such as Jeep and Ford. The rare visibility...
Tuesday 7 April 2026
From components to systems: Ennostar to highlight optical comms, automation tech at Touch Taiwan
As the optoelectronics industry shifts from competition in individual components toward systems integration and higher value-added applications, optoelectronics solution provider Ennostar...
Monday 6 April 2026
India roundup: India ramps up electronics and chip ambitions with new approvals, local fabs, and supply chain curbs

India is accelerating its push to build a self-reliant electronics and semiconductor ecosystem,...

Thursday 2 April 2026
Dixon launches India's first homegrown display module fab with broad capacity expansion
Dixon Technologies is accelerating its push into display module manufacturing, backed by an INR11 billion (US$118.74 million) investment in a new facility in the Noida–Greater...
Thursday 2 April 2026
Denso targets US$54 billion revenue, Rohm deal faces Toshiba-Mitsubishi alliance hurdle
Japan's auto parts supplier Denso on March 31 unveiled a mid-term business plan through March 2031, targeting revenue of JPY8 trillion (approx. US$54 billion) and a return on equity...
Wednesday 1 April 2026
Analysis: In Japan's EV race, aggression costs Honda while Nissan learns to adapt

A year ago, the Japanese automotive world watched Honda, the financially robust "second brother," attempt to assert dominance over its...

Wednesday 1 April 2026
SDI targets AI and heat spreader growth
Power leadframe manufacturer SDI said it is benefiting from the gradual ramp-up of new applications related to artificial intelligence (AI), with around 40 new AI product projects...
Wednesday 1 April 2026
Malaysia defends EV policy as BYD weighs assembly pullout
Malaysia's EV industrial policy is creating tension with foreign automakers, as export-driven and localization rules prompt BYD to reassess a planned plant. At the same time, authorities...
Wednesday 1 April 2026
China memory firms secure two-year wafer deals, tightening DRAM and NAND supply outlook

As AI demand drives high-performance computing and device upgrades, the global memory market is entering an upswing. China-linked players,...

Wednesday 1 April 2026
China memory chip designer GigaDevice posts record 2025 earnings, locks in US$825 million DRAM supply
GigaDevice Semiconductor reported stronger full-year 2025 results, supported by AI-driven demand and a recovery in the memory cycle. Revenue rose 25.12% year on year to CNY9.2 billion...
Tuesday 31 March 2026
Lens Technology shifts beyond iPhone into AI servers, robotics, and aerospace
China-based Lens Technology is accelerating a shift beyond consumer electronics, positioning itself across AI terminals, server infrastructure, robotics, and commercial aerospace as...
Tuesday 31 March 2026
Taiwan's auto industry goes digital as chips eclipse carmaking
Taiwan's automotive industry is undergoing a profound transformation, shifting away from traditional mechanical assembly toward what analysts describe as a semiconductor- and ICT-driven...