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    NEWS TAGGED BANDWIDTH
    Tuesday 27 January 2026
    Microsoft launches Maia 200 AI chip, mass production progress draws attention
    Microsoft officially introduced its second-generation AI accelerator, Maia 200, on January 27, marking its continued efforts in chip development since 2019. The new chip emphasizes...
    Friday 23 January 2026
    HBF likely overtaking HBM market by 2038 as commercialization speeds up

    High-Bandwidth Flash (HBF) is likely to reach commercialization sooner than previously expected and could become a key technology supporting...

    Wednesday 21 January 2026
    China races to catch up with memory chip leaders in LPDDR6
    China's semiconductor supply chain is accelerating plans to bring sixth-generation low-power DRAM, known as LPDDR6, into commercial use in 2026, seeking to close a long-standing technology...
    Monday 19 January 2026
    China's Innosilicon launches LPDDR6 IP with commercial shipments
    As AI smartphones and AI PCs surge, end devices demand unprecedented memory bandwidth. Recently, Chinese interface IP provider Innosilicon announced that its self-developed LPDDR6/5X...
    Thursday 15 January 2026
    PlayNitride teams up with Brillink to build optical interconnect platform
    As Micro LED moves into non-display application opportunities, PlayNitride Technologies announced a partnership with Brillink Technologies, a leader in two-dimensional array optical...
    Thursday 15 January 2026
    Samsung reportedly files new HBM trademarks as HBM4 advances
    Samsung Electronics has reportedly filed a series of new trademarks related to high bandwidth memory as it advances preparations for its sixth-generation HBM4 products.
    Tuesday 6 January 2026
    Supermicro expands manufacturing, liquid-cooling capacity for Nvidia Vera Rubin AI platforms
    Supermicro announced expansions in manufacturing and liquid-cooling capabilities to support the deployment of data center-scale systems optimized for the Nvidia Vera Rubin and Rubin...
    Monday 5 January 2026
    Samsung reportedly pitches bundled solutions to Google and AMD
    As major corporations expand investments in artificial intelligence (AI), memory suppliers have seen a flood of orders. According to the latest reports from South Korean media, Samsung...
    Tuesday 23 December 2025
    IntoPIX Delivers Real-Time, Low-Power Video Technologies At CES 2026

    As devices evolve toward 4K, 8K, multi-camera sensing, immersive displays, autonomous perception, and AI-driven vision, uncompressed video has become increasingly difficult...

    Sunday 21 December 2025
    Taiwan academics seek to break through SiPh yield bottlenecks
    Cloud computing, GenAI, and high-performance computing continue to drive bandwidth and energy efficiency demands. Line rates have now been pushed beyond 100–200Gbps. The intense...
    Friday 19 December 2025
    Samsung to supply SOCAMM2 LPDDR modules to Nvidia
    Samsung Electronics has moved ahead in the race to supply next-generation AI server memory, providing Nvidia with samples of its SOCAMM2 LPDDR-based modules. The development signals...
    Thursday 18 December 2025
    Samsung and SK Hynix push PIM-enabled memory to address AI bottlenecks
    As AI inference workloads grow and models expand rapidly, Samsung Electronics and SK Hynix are advancing high-bandwidth memory (HBM) technologies while integrating processing-in-memory...
    Friday 5 December 2025
    Samsung to command the AI inference market with GDDR7
    Samsung Electronics' latest-generation GDDR7 has received the 2025 Korea Technology Awards Presidential Award, and its importance is growing as Nvidia adopts the memory for AI inference...
    Thursday 4 December 2025
    Chunghwa Telecom expands Southeast Asia presence
    Chunghwa Telecom (CHT) officially established its Malaysia subsidiary, Chunghwa Telecom Malaysia Sdn. Bhd., on December 1. CHT chairman Chih-Cheng Chien said during a digital empowerment...
    Monday 1 December 2025
    Samsung and SK Hynix to unveil next-gen memory tech at ISSCC 2026
    At the upcoming International Solid-State Circuits Conference (ISSCC) 2026 in February, Samsung Electronics and SK Hynix are set to unveil significant advances in high-performance...
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    Research Report Database
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
    biz
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook