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    Commentary: Episil-Precision fire raises concerns over epitaxial wafer supply
    Oct 28, 22:59
    Server CPU shipments set to rise 46% and exceed 52.6 million units in 2027
    Oct 28, 22:59
    NEWS TAGGED BANDWIDTH
    Monday 12 October 2026
    Microsoft to scale Maia AI chips to multi-gigawatt deployments, unveils TSMC N2P-based Maia 300
    Microsoft will scale its in-house Azure Maia AI accelerators to multi-gigawatt deployments starting in 2027, making Maia the primary AI inference system for its products and services...
    Monday 12 October 2026
    Memory wall reshapes chip performance as large-capacity SRAM becomes a focal point in autonomous driving SoC design
    DIGITIMES observed that as AI computing has hit a bottleneck from the memory wall, data storage and data movement have become extensions of the computing task, also reshaping the role...
    Wednesday 7 October 2026
    Huawei's NPO bet challenges CPO's path to AI scale
    Huawei is backing near-packaged optics (NPO) rather than co-packaged optics (CPO) for its next-generation AI infrastructure, arguing that NPO offers a better balance of cost, manufacturability,...
    Wednesday 7 October 2026
    Nokia, ICEYE turn Europe's satellite autonomy push into an ownership model
    Europe's push for sovereign satellite connectivity is moving beyond simply securing access to bandwidth, as Nokia and ICEYE prepare a new low Earth orbit (LEO) system that would let...
    Monday 5 October 2026
    DIGITIMES Insight: AI data demand surges as power and cooling become new bottlenecks
    As the number of AI computing transistors integrated within a single CoWoS package rises rapidly, DIGITIMES observes that moving massive volumes of data to compute chips fast...
    Friday 2 October 2026
    Inside Volantis's photonic bid to break AI's memory wall after US$88 million raise
    Semiconductor startup Volantis has raised US$88 million in Series A funding to develop an AI inference architecture that uses photonic interconnect technology to address memory bottlenecks...
    Friday 2 October 2026
    Micron eyes NVHBM profits with TSMC custom HBM push
    Micron is using an externally manufactured base die in NVHBM, a custom high-bandwidth memory (HBM) product it is co-developing with Nvidia, as the company bets that customization can...
    Thursday 1 October 2026
    DIGITIMES Insight: AI scaling is moving from chip shrinkage to system integration
    TSMC said the next phase of AI performance growth will depend less on shrinking a single chip and more on combining multiple chips, memory, and advanced packaging inside larger systems...
    Thursday 1 October 2026
    Applied Materials and Kioxia team up on AI-era memory tech
    Applied Materials and Kioxia are joining forces at a Silicon Valley research hub to develop next-generation memory technologies that could shape AI systems used worldwide. The collaboration...
    Tuesday 29 September 2026
    Behind CoWoS (part 2): How TSMC turned a niche packaging experiment into an industry standard
    As chip design enters the AI era, heterogeneous integration is driving foundry giants like TSMC, Samsung, and Intel to bring advanced front-end fab capabilities into back-end packaging...
    Thursday 24 September 2026
    SK Hynix Indiana HBM plant faces lawsuit

    SK Hynix's high-bandwidth memory (HBM) production site under construction in Indiana has been drawn into local litigation as the race...

    Wednesday 23 September 2026
    Samsung LPDDR6 validated by Qualcomm for next-gen Snapdragon platform
    AI workloads are pushing cloud, edge, and mobile devices toward tighter power budgets and heavier data traffic, making memory efficiency a growing global issue. Samsung is positioning...
    Wednesday 23 September 2026
    Lightmatter launches an optical module that cuts AI cluster fiber in half
    US photonics company Lightmatter has launched an optical module that sends and receives data over a single strand of fiber. The company says this halves the cabling needed to connect...
    Monday 21 September 2026
    DIGITIMES Insight: AI chip upgrades shift substrate supply bottleneck from upstream materials to equipment
    DIGITIMES Intelligence has observed that as the performance of AI accelerators and server CPUs continues to advance, chips are increasing not only in compute core counts and...
    Saturday 19 September 2026
    CXL adds memory capacity, but HBM retains its bandwidth edge

    Growing memory requirements are increasing interest in Compute Express Link (CXL) as a way to add capacity beyond locally attached memory...

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    Oct 29, 08:00
    STMicroelectronics to propose the reappointment of Jean-Marc Chery as President & CEO
    Wednesday 28 October 2026
    SK hynix Announces 3Q26 Financial Results
    Wednesday 28 October 2026
    CES Asia Unveiled Expands to Hong Kong for CES 2027
    Wednesday 28 October 2026
    GMIF2026 Exhibition Recap: Innovation Across AI Memory and Storage Chain