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    Exclusive: China SiC substrate suppliers cut prices as losses persist amid oversupply
    11h 15min ago
    Exclusive: SiC substrate prices stay depressed as 800V HVDC demand rises
    11h 15min ago
    Memory boom driven by DRAM now, but HBM will decide the future
    11h 15min ago
    Huawei's Tau Law puts glass substrates at the center of advanced packaging
    11h 15min ago
    Memory shortage drags down PC market as Apple’s MacBook Neo stands out
    11h 15min ago
    NEWS TAGGED CAPACITY
    Friday 22 May 2026
    AI memory crunch pushes Nanya Technology toward 2027 fab ramp

    Nanya Technology plans to raise 2026 capital expenditure above NT$52 billion (US$1.64 billion), with chairman Tzou Ming-jen saying the...

    Friday 22 May 2026
    French AION consortium to bid for EU funding to build ?10B AI data center campus
    A French consortium called AION said it would bid for EU AI infrastructure funding to build a large AI data center campus in France worth as much as EUR10 billion (US$11.6 billion)...
    Thursday 21 May 2026
    AMD commits over US$10 billion to Taiwan ecosystem to expand AI packaging and infrastructure capacity
    AMD said on May 21 that it plans to invest more than US$10 billion across Taiwan's semiconductor ecosystem to deepen strategic partnerships and expand advanced packaging capacity for...
    Thursday 21 May 2026
    AI chip boom strains ABF substrate supply chain
    AI is shifting the semiconductor supply chain's next bottleneck from wafer fabrication and HBM memory to ABF substrates — a lower-profile but critical packaging material used...
    Thursday 21 May 2026
    OpenAI offers 1-3 year reserved AI capacity with discounts to attract enterprise contracts
    OpenAI launched a Guaranteed Capacity program that lets enterprise customers reserve one to three years of AI computing resources in advance, aiming to provide a stable supply for...
    Thursday 21 May 2026
    SK Hynix reportedly shifts Cheongju mask fab toward HBM yield push
    SK Hynix is reportedly moving to reshape part of its Cheongju campus around wafer testing, a shift that underscores how high-bandwidth memory, or HBM, is putting new pressure on the...
    Thursday 21 May 2026
    China uses iron-fist policies to expel inefficient TOPCon capacity from solar supply chain
    China's top-down policies are creating a tech elimination battle in its solar supply chain. Because of severe oversupply in the mainstream N-type tunnel oxide passivated contact (TOPCon)...
    Thursday 21 May 2026
    Tokuyama to build second high-purity IPA plant in Taiwan to bolster global semiconductor supplies
    In a press release on May 20, Japan-based Tokuyama Corporation said it will build a second high-purity isopropyl alcohol plant in Kaohsiung through its joint venture with Formosa Plastics,...
    Thursday 21 May 2026
    TSMC's cautious capex is averting an AI bubble, says investor
    TSMC's restrained expansion strategy is helping the global market avoid an AI bubble, according to veteran semiconductor investor Gavin Baker, the chief investment officer at Atreides...
    Thursday 21 May 2026
    Limited joint-load capacity threatens humanoid robots' ability to replace human labor
    Humanoid robot developers and suppliers are increasingly focused on joint-module load-bearing capabilities as a key barrier to replacing human workers, according to supply-chain sources...
    Wednesday 20 May 2026
    Tech Forum 2026: AI server racks push liquid cooling into mainstream
    META Green Cooling Technology (MGC) president Clyde Chu said Nvidia's chip roadmap shows that cooling requirements are doubling in less than a year, with the NVL72 rack based on the...
    Wednesday 20 May 2026
    Microsoft advances India data center timeline within expanded regional investment framework
    Microsoft's data center expansion in India represents the continuation of a strategic regional investment trajectory, updating previously announced capital commitments rather than...
    Wednesday 20 May 2026
    Amazon's AI chip push gains ground as Nvidia remains central to AWS

    Amazon's yearslong push to build a credible alternative to Nvidia's AI chips is beginning to gain traction, as software improvements,...

    Wednesday 20 May 2026
    Gaia Motors rolls out Rapide 3 electric three-wheeler network across Taiwan
    Gaia Motors has launched a nationwide channel rollout in Taiwan for its Rapide 3 electric three-wheeler, expanding the vehicle's availability from enterprise fleets to broader commercial...
    Wednesday 20 May 2026
    Google and Blackstone could lift ASIC demand with TPU leasing joint venture
    Recent media reports say Google is set to team up with Blackstone to form a new cloud computing leasing company, with Blackstone as the main shareholder. The new venture aims to build...
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    Research Report Database
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    Thursday 28 May 2026
    VIA Labs Announces Hub Controllers for Multi-Display USB-C Docking
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook