Lite-On Technology is showcasing an 800 VDC power architecture, NVIDIA Vera Rubin-compatible power racks and integrated liquid-cooling systems at the 2026 Open Compute Project (OCP)...
Taiwan's rail-kit and thermal suppliers posted broad year-over-year revenue growth in September 2026, but sequential performance revealed uneven shipment schedules. All eight tracked...
The Open Compute Project (OCP) Global Summit 2026 recently took place in San Jose, California, as Taiwan suppliers joined the global AI infrastructure race with offerings spanning...
Asia Vital Components (AVC) unveiled new liquid-cooling solutions, including direct liquid cooling (DLC) and an In-Row CDU, at the Open Compute Project (OCP) Global Summit, held October...
Broadcom's Frank Ostojic said semiconductor firms need joint innovation across equipment, materials, and design to overcome bottlenecks that affect AI chips worldwide. He warned that...
As AI cluster sizes grow, networking systems face challenges beyond higher bandwidth, including power consumption, cooling, cross-site coordination, and large-scale device operations...
Qualcomm is pushing to cut edge AI's energy cost as phones, cars, and other devices face tighter power and cooling limits than data centers. At the opening of Applied Materials' EPIC...
Samsung Electronics and LG Electronics showcased their AI strategies at KES 2026 in South Korea, with Samsung focusing on smartphones, TVs, and home appliances while emphasizing an...
Y.S. Tech said automotive product orders were visible through the first quarter of 2028 as the automotive electronics and technology systems maker expanded its automotive and high-performance...
AMD has introduced Helion, an open rack architecture designed for agentic AI workloads that could change how data centers allocate compute, power, and cooling. The system targets hyperscale...
Microloops, a thermal module maker, reported September 2026 consolidated revenue of NT$421 million (approx. US$13.2 million), up 25.12% year-over-year but down 17.88% month-over-month,...
LG Electronics' third-quarter results show a company whose mature businesses are generating steady cash, but not enough to meet raised expectations. The company says it will channel...
As AI applications gradually expand from the cloud to enterprise private clouds, smart factories, logistics centers, and edge nodes, enterprise compute density continues...
LG Electronics has signed a long-term agreement to supply chillers for data center projects totaling more than 5GW of capacity in the US and Canada, giving the South Korean company...
Samsung Electronics is expanding its thermal-management efforts for high-bandwidth memory (HBM) beyond the memory stack as increasingly large chip packages raise heat-management ch...
