Y.S. Tech will open a high-performance computing liquid-cooling laboratory at its new Renwu plant in Kaohsiung by the end of 2026, strengthening its ability to develop high-efficiency,...
Space-based data centers could open a new market for low-power AI chips, but moving computing workloads into orbit presents challenges involving radiation, cooling, and hardware reliability...
South Korea plans to develop small, medium, and large data centers in orbit under its K-Moonshot initiative, aiming to conduct its first in-orbit demonstration in 2028 and lay the...
Higher memory prices caused by tight supply weakened demand for consumer electronics, while investment in Wah Hong Industrial's thermal management division weighed on overall third-quarter...
Samsung SDS has begun construction of a 60MW AI data center in Gumi, South Korea, to support industrial robots and other AI applications. The project marks the first concrete step...
As switch chips move toward 400G per channel, the gold-finger connectors used in current pluggable modules are approaching their high-frequency limits. The pluggable optics camp introduced...
At Hon Hai Tech Day 2026 (HHTD 26), Foxconn showcased the Nvidia DSX POD containerized solution. By leveraging factory pre-building, electromechanical integration, and pre-testing,...
Memory prices have surged for several consecutive quarters, leaving consumer applications grappling with cooling buying interest and weak demand. Kioxia has taken a more conservative...
Google's plan to invest US$15 billion in Malaysia over 2027 and 2028 deepens its bet on what AFP calls Southeast Asia's fastest-growing data center hub, and ties the expansion to commitments...
As AI data centers expand, Taiwan is facing challenges in securing power supply, battery backup, and cooling systems, with the state-run Taiwan Power Company (Taipower) requiring about...
The boom in generative AI is rapidly driving demand for data center construction, making power supply, cooling, and energy management central challenges for AI infrastructure. Speaking...
Foxconn subsidiaries Foxconn Interconnect Technology (FIT) and Foxconn Industrial Internet (FII) are combining their expertise in computing, connectivity, power delivery and cooling...
Taiwan already manufactures much of the physical infrastructure on which the AI boom depends. Advanced logic, packaging, substrates, testing, power delivery, cooling, and server assembly...
The AI hardware race is usually measured in nanometers, memory bandwidth, and accelerator performance. But another constraint is emerging much earlier in the development process: whether...
Hon Hai (Foxconn) and TECO Electric & Machinery showcased a jointly developed modular data center at Hon Hai Tech Day 2026, highlighting a factory-built approach to AI infrastructure...
