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    Xiaomi-backed RISC-V chip designer Nuclei starts IPO process
    7h 10min ago
    Xpeng expands Turing chip from EVs into humanoid robots
    7h 10min ago
    Corning sees CPO and glass core as new semiconductor battlegrounds
    7h 10min ago
    China optical transceivers avoid US FCC curbs as NPO and CPO compete in high-speed links
    7h 10min ago
    China's AIDC token costs hinge on access to advanced GPUs
    7h 10min ago
    NEWS TAGGED COOLING
    Monday 14 September 2026
    Foxconn subsidiary broadens AI interconnect role as 1.6T enters deployment
    AI data centers are moving decisively toward 1.6T connectivity, with 800G now mainstream in AI clusters and 400G remaining common in general cloud and enterprise deployments.
    Monday 14 September 2026
    AI infrastructure race shifts to Grid-to-Chip as Foxconn, Delta, Flex converge on the same track

    As computing power and per-rack power density for AI servers continue to climb, industry competition is expanding beyond GPUs, servers,...

    Saturday 12 September 2026
    Analysis: Speed built Colossus, yet redundancy may decide whether SpaceX can scale it

    Much of the industry attention surrounding AI infrastructure buildouts is now inextricably tied to sheer compute power, with market...

    Thursday 10 September 2026
    ITRI to showcase 3.2T silicon photonics and AI data center cooling
    Taiwan's 2026 Innovation Technology Expo will run from September 17 to 19 at Taipei World Trade Center Hall 1. The Ministry of Economic Affairs Industrial Development Administration...
    Thursday 10 September 2026
    Flex's EPC Power deal points to a broader shift in AI infrastructure
    Flex has recently agreed to buy US power conversion specialist EPC Power for US$4.4 billion, a move that highlights how competition in AI infrastructure is extending beyond servers...
    Wednesday 9 September 2026
    Y.S. Tech's Renwu plant lifts August sales
    Y.S. Tech reported August 2026 revenue of NT$331 million, up 2.36% year-over-year, as new capacity at its Renwu plant helped offset the traditional summer shipment lull for automakers...
    Wednesday 9 September 2026
    China GPU developer Biren expands AI chip R&D into optical interconnects, advanced cooling
    Chinese GPU developer Biren Technology has teamed up with Shanghai University to establish an Integrated Circuit Intelligent Chip Joint Laboratory, expanding their cooperation into...
    Monday 7 September 2026
    Eaton expands AI data center stack from grid to chip
    As AI data centers scale rapidly, Eaton is expanding beyond traditional power management into modular power deployment, next-generation DC conversion and liquid cooling, positioning...
    Monday 7 September 2026
    Orphans of the liquid cooling age: xMEMS targets data center 'hot spots,' eyes 2027 smartphone and smartglasses cooling ports
    As the world's most powerful enterprise data centers undergo a massive migration to liquid cooling to support high-power artificial intelligence processors, a Silicon Valley chipmaker...
    Monday 7 September 2026
    AI racks move toward MW scale as power, cooling converge
    As AI computing power surges, the energy consumption of AI servers has become a major bottleneck that must be solved. The issue is spreading from chips into power delivery systems...
    Sunday 6 September 2026
    Taiwan thermal supplier I-Chiun launches AI chip cooling venture targeting US$19.2B liquid-cooling market
    I-Chiun Precision Industry and Taiwan's Industrial Technology Research Institute (ITRI) have established Huizhi Advanced, the country's first startup focused on AI chip thermal design,...
    Saturday 5 September 2026
    Topco targets optical comms, cooling as copper gives way
    System integration remains a key hurdle as the AI chip industry pushes for higher power efficiency and faster transmission speeds, drawing intense attention to when short-reach optical...
    Friday 4 September 2026
    Lite-On makes US$170 million strategic investment in DCX for AI cooling push
    Lite-On Technology announced a strategic investment in Polish liquid cooling solutions provider DCX Polska, also known as DCX Liquid Cooling Systems. The deal will give Lite-On approximately...
    Thursday 3 September 2026
    Niching validates 500-ton press for large heat spreaders
    Niching Industrial is expanding its heat-spreader capacity as AI and high-performance computing demand pushes up orders across the global semiconductor supply chain. The company said...
    Thursday 3 September 2026
    TRUMPF targets advanced packaging as AI chip makers chase higher density, better cooling
    As AI chips grow more powerful, the race is shifting beyond transistor scaling to packaging, glass substrates, and thermal control. For global readers, that means the next gains in...
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    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
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