中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    Regional manufacturing lifts automation demand for Foxconn, Nvidia AI hardware
    1min ago
    BOE chairman expected to meet Samsung executive as LCD panel prices rise
    2min ago
    iPhone Duo shines on GIS September revenue; 4Q26 set to challenge full-year high
    2min ago
    Hua Yang, Zeiss launch COSMA-M for chip metrology
    3min ago
    Kingston retains 62% memory module share as B2B AI demand surges
    3min ago
    Repon revenue slips in September as Vera Rubin, ASIC slide rail shipments ramp up
    4min ago
    Chunghwa Telecom, New Taipei fire department launch drone-based medical supply transport pilot program
    4min ago
    Column: Robots have learned to move. They haven't learned to think
    5min ago
    Catcher lifts AI server shipments as medical, drone products ramp up
    6min ago
    Nan Pao pitches water-based resins as Taiwan textile shipments surge
    6min ago
    Transcend September revenue rebounds on IPC, networking project shipments
    6min ago
    Beyond AI: Starcloud tests whether orbital compute can stay busy enough to pay
    7min ago
    Nvidia-backed Reflection AI unveils Beam, pitching an efficient US open model against Chinese rivals
    7min ago
    Nokia, ICEYE turn Europe's satellite autonomy push into an ownership model
    7min ago
    Samsung Electro-Mechanics secures 2027 AI server MLCC demand as supply pressure builds
    8min ago
    Analysis: Kioxia's NAND pedigree meets an AI-era SSD gap
    8min ago
    Smaller batteries, smarter roads: Honda tests different EV cost model
    9min ago
    Samsung tests Chemtronics glass interposer samples
    9min ago
    DIGITIMES Insight: AI servers will carry nearly twice as many CPUs per accelerator by 2027
    11min ago
    Monitor brands raise prices as panel makers prepare follow-on hikes
    Oct 6, 18:30
    Commentary: Huawei and Qualcomm patent deal signals broader push into semiconductor IP
    Oct 6, 18:30
    Samsung to counter memory price pressure with AI, services and older models
    Oct 6, 18:30
    Exclusive: GaN keeps fast-charging edge as SiC pushes into consumer power
    Oct 6, 18:30
    Exclusive: Chinese notebook ODMs win HP and Dell orders, pressuring Taiwanese suppliers
    Oct 6, 18:29
    NEWS TAGGED COOLING
    Wednesday 7 October 2026
    Chunghwa Telecom's Simplified Modular Data Center delivers fast turnkey deployment

    As AI applications gradually expand from the cloud to enterprise private clouds, smart factories, logistics centers, and edge nodes, enterprise compute density continues...

    Tuesday 6 October 2026
    LG lands 5GW North American data center cooling deal
    LG Electronics has signed a long-term agreement to supply chillers for data center projects totaling more than 5GW of capacity in the US and Canada, giving the South Korean company...
    Tuesday 6 October 2026
    Samsung steps up HBM cooling as TSMC expands CoWoS
    Samsung Electronics is expanding its thermal-management efforts for high-bandwidth memory (HBM) beyond the memory stack as increasingly large chip packages raise heat-management ch...
    Tuesday 6 October 2026
    Schneider Electric's deal to buy PTC is the next step in its software push
    Schneider Electric has agreed to purchase software company PTC in a deal valuing its equity at around US$22.6 billion. The all-cash acquisition marks the French energy and tech company's...
    Monday 5 October 2026
    DIGITIMES Insight: AI data demand surges as power and cooling become new bottlenecks
    As the number of AI computing transistors integrated within a single CoWoS package rises rapidly, DIGITIMES observes that moving massive volumes of data to compute chips fast...
    Friday 2 October 2026
    LG Electronics, LS Electric target AI data center bottlenecks with US cooling capacity, 345kV power deals
    South Korea's LG Electronics and LS Electric are expanding deeper into AI data center infrastructure, targeting two of the fastest-growing bottlenecks around high-density computing:...
    Thursday 1 October 2026
    Qualcomm, Samsung redesign chip packaging as heat limits phone performance
    Qualcomm and Samsung Electronics are redesigning how memory is packaged with flagship smartphone processors, as rising chip performance puts greater pressure on the limited cooling...
    Thursday 1 October 2026
    Jabil targets US$17.5 billion in data center revenue as it builds out power, cooling, and networking
    Jabil's plan for fiscal 2027 puts a price tag on its move from building servers to building the power, cooling, and networking systems around them. The company expects about US$17.5...
    Thursday 1 October 2026
    DIGITIMES Insight: AI scaling is moving from chip shrinkage to system integration
    TSMC said the next phase of AI performance growth will depend less on shrinking a single chip and more on combining multiple chips, memory, and advanced packaging inside larger systems...
    Wednesday 30 September 2026
    Apple A20 Pro ditches PoP memory packaging for WMCM
    Apple's A20 Pro chip has dropped traditional package-on-package (PoP) packaging in favor of Wafer-Level Multi-Chip Module (WMCM), with memory and processor dies laid out side by side...
    Wednesday 30 September 2026
    Tatung pivots to AI infrastructure integration
    Amid continued debate over AI, demand for computing power keeps climbing. Tatung Co. on September 30 unveiled its AI infrastructure solution, "TTG AIDC CUBE," at a launch event titled...
    Wednesday 30 September 2026
    Tatung targets 180-day AI data center deployment
    To showcase its competitiveness in AI infrastructure, Tatung Group on September 30 held the "Power Ready for AI" forum and unveiled a modular AI data center (AIDC) built around the...
    Tuesday 29 September 2026
    LG expands AI data center cooling ties with Microsoft, SK Enmove
    LG Electronics has expanded its push into the AI data center cooling market through cooperation with Microsoft, SK Enmove, and overseas heating, ventilation, and air conditioning (HVAC)...
    Tuesday 29 September 2026
    Samsung invests US$1 billion in ex-AWS chief's AI data center venture, joining Nvidia as a founding investor
    Six Samsung companies will invest a combined US$1 billion in Helix Digital Infrastructure, a company set up by investment firm KKR to build data centers and the power supply they need...
    Thursday 24 September 2026
    LG sharpens focus on data centers, robotics, chip materials

    LG Group is sharpening its focus on data centers, robotics, semiconductor materials, and enterprise AI as the South Korean conglomerate...

    1/48 pages
    Research_DB
    BIZ FOCUS
    Oct 6, 08:07
    Singapore Launches SG Semiconductor to Boost its Global Chip Role
    Tuesday 6 October 2026
    Hackathon Team Builds Trusted AI Agent for Smarter Investment Decisions
    Monday 5 October 2026
    AI Family Digital Twins Bridge Elder Care Gaps
    Friday 2 October 2026
    Digital Divide: Hackathon Team Debuts Senior-Friendly 'AI Butler'