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Friday 12 June 2026
Amphenol to raise connector prices by 5% in July 2026
Amphenol, a global leader in electronic and fiber-optic connectors, cables, and interconnect systems, has notified customers that it will raise prices by 5% on selected products starting...
Friday 12 June 2026
Catcher maintains cautious outlook for 2026 as supply bottlenecks and cost pressures persist
Catcher Technology, a metal chassis maker, said it remained cautiously conservative about its 2026 operations due to ongoing supply-chain bottlenecks, rising costs and uncertain end-market...
Thursday 11 June 2026
Applied Materials CEO: AI reshapes semiconductor innovation
Applied Materials said artificial intelligence (AI) is reshaping the global semiconductor industry and could drive years of heavy investment in chipmaking, packaging, and materials...
Wednesday 10 June 2026
SuperAI Singapore: Frontier of AI shifts from model strength to deployment, cost, and applications
The frontier of AI is shifting from model training and accuracy to real-world deployment and other emerging factors, according to a panel held on June 10 comprising AI leaders in Asia...
Friday 5 June 2026
China's EV makers are learning that growth comes at a cost
After briefly flirting with profitability late last year, China's leading electric-vehicle (EV) startups have once again slipped into the red, highlighting the mounting challenges...
Friday 5 June 2026
India faces PCB supply squeeze as raw material shocks, AI demand, and import dependence drive costs higher
India's PCB industry is facing mounting supply constraints and cost pressures, driven by a combination of raw material inflation, logistics disruptions, and a structural reliance on...
Friday 5 June 2026
HBM is too expensive, DRAM can't scale — Kioxia tells Computex SSDs are the answer for agentic AI
Koichi Fukuda, technology executive for applied SSD technology at Kioxia, used a Computex 2026 forum session on June 4 to argue that as enterprise AI shifts toward agentic systems,...
Friday 5 June 2026
Marvell says SerDes and packaging are key hurdles in switch chip development
Marvell says the next gains in switch chip performance will depend on faster SerDes and better packaging — issues that affect network capacity, signal quality, and cost across...
Thursday 4 June 2026
Taiwan's Walsin Technology gains pricing power from AI demand

Walsin Technology, one of Taiwan's leading manufacturers of multilayer ceramic capacitors (MLCCs), has notified distributors that it will...

Wednesday 3 June 2026
Micron's HBM4 push signals bigger Nvidia supply role
Micron Technology may supply more HBM4 memory for Nvidia's next-generation Vera Rubin platform than the market currently expects, as the US memory maker ramps up equipment investment...
Wednesday 3 June 2026
Microsoft expands its model lineup and management tools at Build 2026
At Microsoft Build 2026 on June 2, Microsoft broadened the range of AI models available through its Foundry platform, adding four first-party models, deepening partner access, and...
Wednesday 3 June 2026
Middle East war drives LME aluminum to 4-year high, squeezing chip equipment margins
Rising global geopolitical risk and tightening supply in some markets have pushed London Metal Exchange (LME) aluminum prices higher in volatile trading, adding cost pressures to industries...
Tuesday 2 June 2026
Huawei's Tau Law faces its hardest test: chip yield, not theory
Huawei has introduced Tau Law, a semiconductor design framework built around LogicFolding, as a potential route for China to improve chip performance under US technology restrictions...
Saturday 30 May 2026
Terafab explained: SpaceX outlines space-optimized chips and AI megafab plan in IPO filing
SpaceX's IPO prospectus details an early-stage "Terafab" initiative to build large-scale AI chip manufacturing capacity. Still, the company warns of significant execution uncertainty,...
Thursday 28 May 2026
China's LLM price war puts DeepSeek, Xiaomi on a collision course with OpenAI
China's large language model (LLM) market is coming under mounting pricing pressure, as domestic AI model developers cut fees closer to cost, while the gap with international model...