Tongfu Microelectronics, a leading Chinese semiconductor packaging and testing company, made a significant leap in advanced packaging after acquiring 85% of AMD's Suzhou and Penang...

Arm is strengthening its ecosystem for next-generation AI applications by adding partners across firmware, ASIC design, networking, and packaging. The company is also advancing chiplet...

Apple has announced its latest system-on-chip (SoC), the M5, marking a major step forward in the company's in-house silicon roadmap. Built on third-generation 3nm process technology,...

Alcor Micro Corporation, a subsidiary of Egis Technology, is showcasing its latest Arm architecture CPU platform, Mobius100 (CSS V3), at the 2025 Open Compute Project (OCP) Global...