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Wednesday 24 March 2021
Wire-bonding capacity to sustain full utilization throughout 2021
IC backend houses are expected to run their mainstream wire-bonding packaging lines at full capacity through the end of the year to meet strong demand for automotive and consumer...
Monday 22 March 2021
Chenbro expects orders from datacenters to pick up in April
Taiwan-based server chassis maker Chenbro Micom expects demand for datacenters from the US and China to begin rising in April as new server CPU platforms will launch and clients'...
Thursday 11 March 2021
Taiwan ABF substrate makers to gain from China homegrown CPU development
Taiwan's IC substrate makers with their strong technological prowess are in pole position to explore business opportunities from China's ongoing homegrown CPU development campaign,...
Wednesday 10 March 2021
Taiwan OSATs post revenue increases in February
Taiwan-based OSAT providers including ASE Technology, King Yuan Electronics (KYEC) and Tong Hsing Electronic Industries have posted on-year revenue increases for February 2021, and...
Friday 5 March 2021
Nan Ya to spend NT$8 billion on IC substrate capacity expansion
Nan Ya PCB has disclosed plans to spend at least NT$8 billion (US$287.5 million) in 2021, compared to a capex of NT$7.35 billion for 2020, for capacity expansions at its plants in...
Tuesday 2 March 2021
Arm pushing into HPC and datacenter markets, says Digitimes Research
With its advantages in edge computing and mobile device applications, Arm has been expanding its server solution offerings, heading towards high performance computing instead of staying...
Wednesday 24 February 2021
Qualcomm may switch to TSMC 4nm node in 2022
Qualcomm will continue to fabricate its next-generation 5G mobile chip, tentatively dubbed Snapdragon 895, at Samsung Electronics built using an upgraded 5nm process, but may switch...
Tuesday 23 February 2021
IC testing service providers benefit from surging demand for cryptocurrencies
Surging prices of Ethereum has boosted demand for graphics cards used to mine the cryptocurrecny, which is benefiting Taiwan-based IC testing services providers, according to sources...
Friday 5 February 2021
Taiwan notebooks, 4Q 2020

Introduction

Tuesday 2 February 2021
Kinsus swings to profit in 2020 on robust BT, ABF substrates sales
IC substrate supplier Kinsus Interconnect Technology swung to net profit of NT$541 million (US$19.3 million) in 2020 from loss of NT$2.025 billion a year earlier, mainly driven by...
Monday 1 February 2021
Global server market, 4Q 2020

Introduction

Friday 29 January 2021
Backend partners see clear order visibility for AMD chips till 3Q21
Backend houses including Taiwan's ASE Technology and China's Tongfu Microelectronics have seen the visibility of orders for packaging AMD's processors extended to mid third-quarter...
Wednesday 27 January 2021
Kenmec sees bright shipment prospects for 2021
Taiwan-based Kenmec Mechanical Engineering, dedicated to smart automation, logistics and storage systems as well as datacenter liquid cooling solutions, is expected to see its shipments...
Wednesday 27 January 2021
Cooling module makers expect shipments for new-gen servers to boost ASPs
Cooling module makers expect shipments for new-generation servers based on Intel's 10nm Ice Lake processors to push up their product ASPs.
Tuesday 26 January 2021
ABF substrate suppliers see clear order visibility stretch into 2H21
Taiwan-based IC substrate providers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology have seen the visibility of orders for ABF substrates extend to second-half...