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    Samsung launches first tri-fold phone, focusing on strategic impact over sales
    7min ago
    Apple poised to overtake Samsung in 2025 smartphone shipments
    9min ago
    Starlink's debut in South Korea marks shift toward next-gen communications
    14min ago
    SK Hynix reportedly delays HBM4 mass production amid Nvidia Rubin AI accelerator launch plans
    22min ago
    NEWS TAGGED DEMAND
    Thursday 30 October 2025
    Glass substrates edge toward prime time in PCB and chip packaging sector

    As Moore's Law nears its physical and commercial limits, advanced packaging has become the new battleground defining the evolution of...

    Wednesday 29 October 2025
    WPG launches smart warehousing to strengthen semiconductor supply chain services
    In response to the surge in AI- and HPC-driven market demand, WPG Holdings' board of directors has approved an adjustment to its investment structure to further advance its semiconductor...
    Wednesday 29 October 2025
    Apple's foldable shadow looms over the market Samsung built
    The foldable phone market is finally hitting its stride. After years of false starts and skeptical consumers, the segment is experiencing genuine momentum. Counterpoint Research projects...
    Wednesday 29 October 2025
    Powertech secures full FOPLP bookings ahead of US$1B expansion
    Powertech Technology Inc. (PTI), a leading memory packaging and testing provider, is fast-tracking its move into fan-out panel-level packaging (FOPLP). Chairman DK Tsai said the company's...
    Wednesday 29 October 2025
    Hanmi eyes AI chip packaging amid HBM market challenges
    Hanmi is expanding beyond its leading position in high-bandwidth memory (HBM) bonding equipment to enter the system semiconductor equipment sector, driven by growing demand and technological...
    Wednesday 29 October 2025
    High smartphone panel utilization drives mixed price trends
    As holiday seasons approach, including China's Singles' Day and Black Friday in Europe and the US, the smartphone panel market has maintained high utilization rates in the fourth...
    Wednesday 29 October 2025
    AI server liquid cooling demand surges, heat dissipation firms race to expand capacity
    Nvidia plans to launch its Vera Rubin architecture AI servers in 2026, significantly increasing the share of liquid cooling solutions. In response, heat dissipation manufacturers...
    Wednesday 29 October 2025
    SK Hynix's AI hot streak: record earnings, HBM4 next
    SK Hynix achieved its strongest quarterly results on record in the third quarter of 2025, driven by surging demand for AI-related memory and higher DRAM and NAND prices. The company...
    Wednesday 29 October 2025
    SK hynix Announces 3Q25 Financial Results

    SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has recorded 24.4489 trillion won in revenues, 11.3834 trillion won in operating profit (with...

    Tuesday 28 October 2025
    Hon Precision ramps AI GPU and ASIC testing equipment with orders through 1H26
    Semiconductor IC testing equipment manufacturer Hon Precision has, in recent years, successfully entered high-power application markets such as AI, high-performance computing (HPC),...
    Tuesday 28 October 2025
    Cadence reports strong 3Q25 results as AI and HPC demand fuel growth
    US electronic design automation (EDA) software company Cadence Design Systems posted third-quarter 2025 revenue of US$1.34 billion, up 10% from a year earlier and slightly above analysts'...
    Tuesday 28 October 2025
    SK Hynix M15X completion expected by end of 2025
    To meet the growing demand for HBM, SK Hynix is accelerating the construction of its DRAM production base, M15X plant in Cheongju, South Korea. According to Yonhap News and...
    Tuesday 28 October 2025
    Memory shortage hits 70% order fulfillment; server DRAM prices surge 50%
    The memory chip shortage has escalated into a severe crisis as upstream international manufacturers finalize contract prices for the fourth quarter of 2025. Intense competition for...
    Tuesday 28 October 2025
    Winbond boosts memory production capex over fivefold amid tight supply
    Taiwan-based memory manufacturer Winbond Electronics Corp. has approved a capex budget of NT$35.509 billion (US$1.16 billion) to restructure its memory production capacity in response...
    Tuesday 28 October 2025
    China's CXMT, YMTC power into AI memory super cycle
    The global memory market is entering a "super cycle" driven by the booming adoption of AI, data center upgrades, and growing demand for high-performance computing (HPC). With inventories...
    28/167 pages
    Research Report Database
    BIZ FOCUS
    Nov 26, 08:00
    Facing the rise of AI, how does Global Instrument Technology leverage Chunghwa Telecom's IDC for the manufacturing industry's AI-driven transformation
    Wednesday 26 November 2025
    GaNrich Delivers Portfolio from 40V to 1200V For the Data Center HVDC Architecture
    Wednesday 26 November 2025
    Smart dining transformation accelerates: ASUS IoT IoRT solutions enhance operational efficiency in chain restaurants
    Tuesday 25 November 2025
    ASUS IoT AISEHS raises intelligent security standards, helping semiconductor industry move from passive to active protection
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