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Thursday 4 September 2025
Anthropic raises US$13 billion in series F round, valuation triples to US$183 billion
US artificial intelligence (AI) startup Anthropic has secured US$13 billion in its series F funding round, tripling its valuation to US$183 billion and positioning it as the world's...
Thursday 4 September 2025
China's new electric bike standard takes effect, driving trade-in boom

The electric bike market in China has entered a new phase. Starting September 1, the mandatory national standard "Safety Technical Specification...

Thursday 4 September 2025
AMD, Anritsu partner to standardize high-speed testing for AI data centers
Japan's Anritsu has teamed up with US chipmaker AMD to launch an automated testing platform for next-generation high-speed transmission, targeting the surging demand from AI data...
Thursday 4 September 2025
China’s AI server market surges to US$22B, set to top US$100B by 2029
China is ramping up efforts to build an integrated nationwide computing network as the global race for artificial intelligence (AI) intensifies. The State Council's "AI+" strategy...
Wednesday 3 September 2025
Global smartphone, 2Q 2025

Introduction

Wednesday 3 September 2025
Sluggish China market fuels global smartphone sales pessimism
China's smartphone shipments fell nearly 4% in the first half of 2025 compared to the same period in 2024, despite government initiatives aimed at stimulating demand through purchase...
Wednesday 3 September 2025
Why TSMC is holding back on advanced packaging despite soaring demand
TSMC's CoWoS capacity remains in high demand, securing its dominant position in advanced semiconductor packaging with rumored gross margins nearing 80%. However, TSMC is proceeding...
Wednesday 3 September 2025
China's OSAT leaders Tongfu, JCET advance co-packaged optics for AI data centers
Surging demand for AI, large language models (LLMS), and high-performance computing is propelling co-packaged optics (CPO) into the spotlight of the semiconductor industry. The technology...
Wednesday 3 September 2025
Micraft System Plus Unveils Proprietary Thermo-Compression Bonder, Expands into Advanced Packaging Market

With the rapid expansion of artificial intelligence (AI), high-performance computing (HPC), and data center applications, the demand for high-speed chip-to-chip interconnects...

Wednesday 3 September 2025
SK Hynix installs first high-NA EUV lithography system at Icheon fab
SK Hynix announced that it has successfully assembled the industry's first high-NA extreme ultraviolet (EUV) lithography system for mass production at its M16 fabrication plant in...
Wednesday 3 September 2025
Taiwan's economy struggles with New Taiwan dollar appreciation and export sector downturn
The appreciation of the New Taiwan dollar in the second and third quarters of 2025 has exerted significant pressure on Taiwan's export industries, with many manufacturing sectors...
Tuesday 2 September 2025
LCD monitor panel shipments expected to decline in 3Q25 despite seasonal peak
Industry insiders anticipate a softer third quarter for LCD monitor panels in 2025, with shipments expected to fall about 5% compared to the second quarter, despite this period usually...
Tuesday 2 September 2025
Image processing supply chain eyes rising demand from drones
The growing demand for unmanned vehicles, especially amid the current wave of AI upgrades, heavily relies on advanced image processing capabilities. For drones, various image processing...
Tuesday 2 September 2025
China's urgent TV orders boost panel manufacturers' utilization rates
As China continues to implement dynamic production cuts, the output reduction has stabilized LCD TV panel prices in August. Meanwhile, major Chinese TV brands such as TCL and Hisense...
Tuesday 2 September 2025
Decline of smartphone camera lens: Manufacturers shift to high-performance and auto markets
Smartphone manufacturers have reduced the number of camera lenses to make devices thinner, focusing on performance and image correction instead. This trend has led suppliers like...