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    Analysis: Why ASML's layoffs focused on Europe and US but not China
    9h 1min ago
    Chip cooling pioneers: The 1981 patent keeping today's AI servers alive
    9h 2min ago
    Dutch restrictions on Nexperia sounds alarm for European semiconductor industry
    9h 2min ago
    Samsung notebook and smartphone prices rise amid chip inflation era
    9h 2min ago
    Chinese panel makers' production cuts drive TV panel price rise in February
    9h 2min ago
    Exclusive: Tesla's AI ecosystem boosts space solar energy interest among Taiwan suppliers
    9h 2min ago
    NEWS TAGGED DEMAND
    Thursday 30 October 2025
    Samsung 3Q25 marks the reset of the global memory hierarchy
    Samsung Electronics staged a strong rebound in the third quarter of 2025 and set the tone for the next phase of the memory cycle, where AI infrastructure, premium product mix, and...
    Thursday 30 October 2025
    Microsoft's AI engine accelerates with record growth and expanding partnerships
    Microsoft kicked off its 2026 fiscal year with another blockbuster quarter. First quarter fiscal 2026 revenue reached US$77.7 billion, up 18% year-over-year, while operating income...
    Thursday 30 October 2025
    Celestica delivers record third-quarter results on strong AI infrastructure demand, raises full-year outlook
    Celestica reported strong financial results for the third quarter of 2025, driven by sustained demand from key hyperscale customers investing heavily in artificial intelligence data...
    Thursday 30 October 2025
    Samsung 3Q25 profit surges on AI chip demand, beats estimates
    Samsung reported consolidated revenue of KRW86.1 trillion (US$59.8 billion) and operating profit of KRW12.2 trillion for the quarter ended September 30, 2025, beating both its own...
    Thursday 30 October 2025
    Flex posts record quarter as it pivots toward higher-margin, AI-focused business

    Flex, a global manufacturing and supply-chain solutions company, reported record earnings for its fiscal second quarter, buoyed by strong...

    Thursday 30 October 2025
    Commentary: China's JCET bets on AI to challenge global packaging giants
    Artificial intelligence (AI) is reshaping the global semiconductor supply chain and accelerating transformation in IC packaging and testing. As Qualcomm moves into the AI data center...
    Thursday 30 October 2025
    JCET unveils Singapore blueprint for next-gen semiconductor packaging
    Rising demand for AI, 5G, and high-performance computing (HPC) chips is turning advanced packaging into a key front in the semiconductor race. China's largest OSAT provider and the...
    Thursday 30 October 2025
    Texas Instruments sees 50% YoY data center growth amid signs of slower recovery
    As US semiconductor companies race to expand domestic manufacturing capacity, Texas Instruments (TI) and Micron Technology are emerging as the most aggressive investors, committing...
    Thursday 30 October 2025
    Glass substrates edge toward prime time in PCB and chip packaging sector

    As Moore's Law nears its physical and commercial limits, advanced packaging has become the new battleground defining the evolution of...

    Wednesday 29 October 2025
    WPG launches smart warehousing to strengthen semiconductor supply chain services
    In response to the surge in AI- and HPC-driven market demand, WPG Holdings' board of directors has approved an adjustment to its investment structure to further advance its semiconductor...
    Wednesday 29 October 2025
    Apple's foldable shadow looms over the market Samsung built
    The foldable phone market is finally hitting its stride. After years of false starts and skeptical consumers, the segment is experiencing genuine momentum. Counterpoint Research projects...
    Wednesday 29 October 2025
    Powertech secures full FOPLP bookings ahead of US$1B expansion
    Powertech Technology Inc. (PTI), a leading memory packaging and testing provider, is fast-tracking its move into fan-out panel-level packaging (FOPLP). Chairman DK Tsai said the company's...
    Wednesday 29 October 2025
    Hanmi eyes AI chip packaging amid HBM market challenges
    Hanmi is expanding beyond its leading position in high-bandwidth memory (HBM) bonding equipment to enter the system semiconductor equipment sector, driven by growing demand and technological...
    Wednesday 29 October 2025
    High smartphone panel utilization drives mixed price trends
    As holiday seasons approach, including China's Singles' Day and Black Friday in Europe and the US, the smartphone panel market has maintained high utilization rates in the fourth quarter...
    Wednesday 29 October 2025
    AI server liquid cooling demand surges, heat dissipation firms race to expand capacity
    Nvidia plans to launch its Vera Rubin architecture AI servers in 2026, significantly increasing the share of liquid cooling solutions. In response, heat dissipation manufacturers are...
    61/183 pages
    Research Report Database
    BIZ FOCUS
    Jan 28, 08:00
    Ministry of Economic Affairs Launches 2026 Best AI Awards
    Wednesday 28 January 2026
    Lightmatter and GUC Partner to Produce CPO Solutions for AI Hyperscalers
    Wednesday 28 January 2026
    Seoul Business Agency Hosts Global Innovation Forum Showcasing Startup Ecosystem
    Thursday 22 January 2026
    MOSS Introduces an AI-Assisted DAW Built to Support Human Creativity
    Special Report
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook