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Friday 4 July 2025
China's local CPU and GPU companies cultivate talent alliances with universities
With the rapid development of artificial intelligence (AI) technology, the demand for computing power continues to rise, placing AI chips at the heart of global tech competition....
Friday 4 July 2025
Intel's new AI accelerator may adopt HBM4? SK Hynix stresses no confirmed details
Intel recently held its AI Summit in South Korea, sharing the latest trends in artificial intelligence (AI) technology and innovative applications across various industries. The event...
Friday 4 July 2025
Infineon targets 4Q25 for 12-inch GaN sample rollout as scaling accelerates
Infineon Technologies AG has announced progress in its scalable gallium nitride (GaN) semiconductor manufacturing using 12-inch wafers, aiming to supply customer samples by the fourth...
Friday 4 July 2025
Taiwan's URE partners with AbonMax for 80MW solar expansion
United Renewable Energy signed a cooperation agreement with AbonMax Green Energy to develop solar projects across Taiwan, Thailand, and Vietnam, combining manufacturing and development...
Friday 4 July 2025
China-India rivalry forces Foxconn to rethink manpower strategy
As 2025 begins under President Donald Trump's second term, rising trade tensions and tariffs are pushing regionalized manufacturing. In this context, Foxconn is reportedly recalling...
Friday 4 July 2025
Central Taiwan Science Park sees two new companies in precision machinery cluster
Two new precision machinery companies, Theta Precision and EQUIPTOP, have joined Central Taiwan Science Park (CTSP), with a combined total investment of NT$173 million (US$6 million)...
Thursday 3 July 2025
Samsung completes development of 1c DRAM, paving way for HBM4 rollout

Samsung Electronics has successfully developed its sixth-generation DRAM, known as 1c DRAM, built using a 10nm class process. The product...

Thursday 3 July 2025
Intel plans to abandon in-house glass substrate development, shift to external procurement
According to Computerbase, under the leadership of new CEO Lip-Bu Tan, Intel might no longer push forward with in-house R&D of glass substrates but instead turn to purchasing...
Thursday 3 July 2025
Microsoft cuts 9,000 workers in second wave of major layoffs
Microsoft Corp. began job cuts that will impact about 9,000 workers, its second major wave of layoffs this year as it seeks to control costs while ramping up on artificial intelligence...
Thursday 3 July 2025
Political gridlock threatens Taiwan's defense ambitions amid budget cuts
Taiwan's defense companies face funding volatility and bureaucratic delays that undermine business confidence despite government pledges to boost military spending in response to...
Thursday 3 July 2025
Congatec acquires Kontron subsidiaries to strengthen embedded and edge computing portfolio
Kontron AG, a subsidiary of industrial PC manufacturer Ennoconn, has agreed to sell its stakes in two subsidiaries, Kontron America Modules LLC and Kontron Asia Embedded Design Sdn...
Thursday 3 July 2025
Wolfspeed bankruptcy no surprise as product development lags Chinese rivals
US-based silicon carbide (SiC) giant Wolfspeed officially filed for bankruptcy this week following a series of rumors, initiating restructuring proceedings. Industry players in power...
Thursday 3 July 2025
China's EV leaders switch gears from horsepower to chip power
As global automakers advance deeper into electrification and intelligent mobility, China's top EV brands—BYD, Nio, and Xiaomi—are fast-tracking the development of self-designed...
Thursday 3 July 2025
Nio spins off chip division with new 5nm auto SoC under volume production
China's first-tier electric vehicle (EV) manufacturer Nio has taken a significant step forward in its chip self-sufficiency strategy, announcing that its chip division has officially...
Thursday 3 July 2025
ByteDance expands AI hiring spree into humanoid robotics
ByteDance is recruiting heavily for humanoid robot development as the TikTok parent accelerates its push beyond social media into cutting-edge artificial intelligence (AI) applicat...