Nvidia has introduced Rubin CPX, a next-generation GPU designed for massive-context AI, enabling systems to handle million-token software coding and generative video at unprecedented...
Foundries lead in FOPLP advanced packaging development due to their integrated processes, followed by testing firms that leverage existing wafer architectures. Panel fabs face precision...
Switzerland has unveiled Apertus, an open-source large language model created through collaboration between the Swiss Federal Institute of Technology in Lausanne (EPFL), the Swiss...
Tesla has announced plans to establish a new R&D center in Kopenick, Berlin, Germany. Positioned between Tesla's existing Gigafactory in Grunheide, Brandenburg, and central Berlin,...
To break through the technical, mass production, and yield challenges in advanced packaging processes such as 3D IC and CoWoS, SEMI, together with TSMC and ASE Holdings, has established...
After two consecutive years of losses, Anli reported consolidated revenue of NT$171 million (approx. US$5.62 million) in August 2025, ranking as the company's third-highest monthly...
Malaysia's IC design firm Oppstar has entered into two MoUs with Inventec to collaborate on next-generation AI chips and form a joint venture (JV), according to documents filed with...
Concerns have emerged that AI development concentrated in major powers like the US and China could widen global wealth gaps. However, recent reports indicate that Asia-Pacific countries...
LG Electronics is planning to launch the initial public offering (IPO) of its Indian subsidiary in October 2025, aiming to raise approximately INR150 billion (US$1.7 billion). The...
The government has long provided research and development subsidies to share the risks of innovation among manufacturers, a key strategy driving Taiwan's industry. As many as 53 companies...
Taiwan's semiconductor sector continues to assert its significance globally, with surging demand for advanced processing and packaging technologies driving industrial PC (IPC) manufacturers...
Following TSMC's confirmation in February 2025 that it will include 310×310 mm panels in its chip-on-panel-on-substrate (CoPoS) mass production, supply chain players—including...
Drones have proven their value in a wide range of applications, including agricultural spraying, bridge and infrastructure inspection, deep-sea fish scouting, high-voltage tower insulator...
In the face of global challenges such as traffic congestion, air pollution, and rising oil prices, electric two-wheelers are rapidly becoming an important transportation choice due...
Many believe that generative AI will replace various creative jobs, but AI-generated content often contains flaws, which has unexpectedly given rise to a new gig economy focused on...
