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NEWS TAGGED EUV
Thursday 18 December 2025
Intel completes high-NA EUV validation for 14A, advances 2D transistor tech
Intel has completed acceptance testing of the industry's first commercial high-NA EUV lithography system with a numerical aperture of 0.55, the ASML Twinscan EXE:5200B, laying the...
Thursday 18 December 2025
China's EUV prototype forces a rethink of the AI chip order
China has quietly crossed a psychological and potentially strategic threshold in the global semiconductor race. In a tightly controlled laboratory in Shenzhen, Chinese scientists...
Wednesday 17 December 2025
Tokyo Ohka ramps up South Korea investment for advanced chip materials

Tokyo Ohka Kogyo plans to accelerate investment in South Korea and expand production of materials critical to generative AI semiconductors,...

Saturday 6 December 2025
Huawei patent reveals DUV method to replicate 2nm-class chipmaking without EUV
A newly released filing from China's National Intellectual Property Administration (CNIPA) shows Huawei submitted a patent in June 2022 outlining a method to achieve 2nm-class metal...
Saturday 29 November 2025
CXMT's high-end DRAM push narrows China's gap with South Korea to one year
China's leading DRAM maker CXMT has unveiled new DDR5 and LPDDR5X chips with performance now viewed as comparable to Samsung Electronics and SK Hynix. The launch has unsettled South...
Wednesday 26 November 2025
Micron to expand advanced DRAM development at Hiroshima site
Micron Technology announced plans to expand its DRAM memory development at its Hiroshima facility, with significant backing from the Japanese government. This move aims to boost output...
Saturday 22 November 2025
ASML opens first US technical training center to support domestic chipmaking revival
ASML has inaugurated a technical training center in Phoenix, Arizona, designed to train more than 1,000 engineers annually for the expanding semiconductor industry in the US. The...
Thursday 20 November 2025
ASML expands into advanced CoWoS packaging with new I-line system
Kuan-Cheng Hsu, ASML's Taiwan and Southeast Asia customer marketing head, highlighted that AI-driven semiconductor demand is entering its strongest growth cycle ever, accelerating...
Wednesday 19 November 2025
Pat Gelsinger showcases semiconductor innovations for Taiwan visit; discusses AI and post-Intel adjustments
Pat Gelsinger, after stepping down as Intel's CEO, continues to influence the semiconductor sector through his role as a venture capitalist. On November 18, he led seven portfolio...
Thursday 13 November 2025
Mecal High-Tech Systems - provide anti-vibration solutions to EUV and high - tech equipment and foundries

Mecal High-Tech Systems is an independent global high end contracting engineering company that specializes in anti-vibration and shielding technologies for high-precision...

Wednesday 12 November 2025
ASML opens South Korea campus to deepen Samsung, SK Hynix ties
ASML CEO Christophe Fouquet visited South Korea to mark the opening of the company's new campus in Dongtan, Hwaseong City, Gyeonggi-do province. The facility is designed to accelerate...
Wednesday 12 November 2025
TSMC offloads older tools to VIS as it repurposes fabs for next-gen tech
Taiwan Semiconductor Manufacturing Company (TSMC) approved its third-quarter 2025 business report and financial statements during a board meeting on November 11. The company also...
Wednesday 5 November 2025
Samsung's Taylor fab preparation signals EUV expansion as ASML assembles specialized team
Samsung Electronics appears to be accelerating its US wafer fabrication plans, with global semiconductor equipment leader ASML reportedly assembling a dedicated team to support the...
Tuesday 28 October 2025
China sets first national standard for EUV photoresists in drive for semiconductor self-sufficiency

China has taken a major step toward localising advanced semiconductor materials. The Standardisation Administration of China has released...

Thursday 23 October 2025
SK Hynix poised to benefit fully from DRAM demand as 'FOMO' rises
SK Hynix is positioned to thoroughly capitalize on the ongoing memory supercycle, driven by its superior DRAM technology and mass production capabilities, according to analysts.