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Friday 21 August 2026
SK Chairman warns of 2027 memory shortage, ties expansion to long-term orders
SK Group Chairman Tae-Won Chey said in a recent interview with CNBC that memory demand is surging explosively and that the most severe "memory shortage" will hit in 2027. He also apologized...
Friday 21 August 2026
Power supply lags behind AI compute growth: chips, optical interconnects battle for energy efficiency

At the "AI on Chips: Semiconductor Industry Trends Forum" hosted by DIGITIMES in Taipei on August 20, semiconductor, investment, and...

Friday 21 August 2026
Explainer: Why South Korea's semiconductor concentration may fare better than Taiwan's
As South Korea's semiconductor exports continue to power its economic expansion, market concerns are growing regarding the risks of excessive concentration in the tech sector. Recent...
Friday 21 August 2026
Kenmec surges on AI, advanced packaging to record orders, revenue

Fueled by robust global demand for artificial intelligence and the rapid expansion of semiconductor advanced packaging capacity, Kenmec...

Thursday 20 August 2026
AMEC profit jumps 300%: China chip equipment maker expands beyond etch with US$520M plan
Advanced Micro-Fabrication Equipment Inc. China (AMEC) posted a 300% surge in first-half 2026 profit and announced a CNY3.5 billion (US$520 million) capacity expansion, accelerating...
Thursday 20 August 2026
AI drives network equipment demand as parts shortages deepen
AI data center expansion and rising demand for enterprise network upgrades continue to lift the network equipment market, giving several vendors better order visibility. But surging...
Thursday 20 August 2026
Jusung, PSK China sales plunge over 40% amid China's chip self-sufficiency drive

Jusung Engineering and PSK each lost more than 40% of their China revenue in 2025. The similarity ends there.

Thursday 20 August 2026
OpenAI signals IPO could wait until 2027 as Anthropic weighs listing

OpenAI told employees it could go public in 2027, though an earlier listing remains possible if operating conditions improve. According...

Thursday 20 August 2026
Samsung to break ground on KRW6 trillion Onyang HBM packaging plant in September
Samsung Electronics will break ground in September on a KRW6 trillion (approx. US$4.31 billion) HBM production and advanced-packaging facility at its Onyang campus in Asan, South Korea,...
Thursday 20 August 2026
Asia Optical eyes Metalens, CPO, and AI cooling opportunities; digital camera shipments to surpass 4 million units
Asia Optical delivered strong second-quarter financial results while accelerating its strategic expansion across optical technologies. Key growth drivers include Metalens and Co-Packaged...
Thursday 20 August 2026
Intel Malaysia packaging expansion draws HBM flows from Taiwan

South Korean export data showed a sharp shift in high-bandwidth memory, or HBM, shipments toward Malaysia and away from Taiwan, according...

Wednesday 19 August 2026
Commentary: Tsinghua Unigroup distances itself from failed US$15 billion Dongguan chip-cloud project

Tsinghua Unigroup's former "chip-to-cloud" expansion strategy unraveled after a debt crisis in 2020 and subsequent bankruptcy restructuring...

Wednesday 19 August 2026
Everlight Electronics to sell Miaoli plant as Thailand expansion, AI demand reshape growth outlook

LED packaging maker Everlight Electronics said it will sell its Tongluo plant in Miaoli to Sinbon for NT$3.458 billion (US$108.5 million),...

Tuesday 18 August 2026
Arm faces capacity squeeze as CPU demand tops US$2 billion

Arm Holdings' expansion from asset-light IP licensing into finished data center processors is putting the company into direct competition...

Tuesday 18 August 2026
Eiso Enterprise's Guishan plant expansion doubles PCB capacity, eyes AI, aerospace, defense markets

Niche printed circuit board (PCB) manufacturer Eiso Enterprise has officially opened the second-phase expansion of its new plant in...