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Tuesday 27 October 2026
SoftBank eyes US$50B Malaysia AI data-center expansion
SoftBank Group founder and CEO Masayoshi Son has selected investment sites in Malaysia and plans to invest US$50 billion in technology, Malaysian Prime Minister Anwar Ibrahim said...
Tuesday 27 October 2026
AMD, Nvidia target substrate capacity amid 4x expansion constraints
AMD and Nvidia have separately invested in supply-chain capacity expansion, making substrates, packaging, and testing key priorities as AI demand diversifies. The moves show that chipmakers...
Tuesday 27 October 2026
AI data center boom risks squeezing power chip supplies for auto, electronics
The rapid expansion of AI data centers is driving demand beyond GPUs, memory chips, and advanced packaging. As power consumption in GPU clusters rises, data centers need not only more...
Tuesday 27 October 2026
Amkor turns to customer prepayments as global packaging investment accelerates
Amkor Technology is using customer prepayments and longer-term commitments to support an expanding manufacturing network across the US, South Korea, and Vietnam, as demand for advanced...
Tuesday 27 October 2026
Celestica's AI growth puts capacity in focus as revenue outlook reaches US$40 billion
Celestica's latest results suggest that its next challenge will be expanding production fast enough to serve AI infrastructure customers while keeping cash requirements under control...
Friday 23 October 2026
Taiwan's top telecom spins off AI surveillance unit, plans global push with local hardware makers
Chunghwa Telecom (CHT) has established a new subsidiary, CHT Intelligent Vision Solutions (IVS), spinning off an internal team focused on smart security and intelligent video analytics...
Friday 23 October 2026
JCET's AI profit surge sets up US$2.73 billion advanced packaging expansion
JCET Group lifted third-quarter revenue 13.53% year-over-year to CNY11.43 billion (approx. US$1.71 billion) and net profit attributable to shareholders 59.99% to CNY773 million. For...
Friday 23 October 2026
Tesla, Nvidia reportedly invest KRW3.7 trillion to secure Samsung Electro-Mechanics ABF capacity
Tesla and Nvidia are reportedly investing a combined KRW3.7 trillion (US$2.8 billion) to help Samsung Electro-Mechanics expand Ajinomoto Build-up Film (ABF) substrate production facilities...
Friday 23 October 2026
Why is TSMC suddenly looking at Texas?
TSMC is scouting Texas for possible new US capacity, even as it builds out its advanced-process fabs in Arizona. Chairman C.C. Wei confirmed that a team has been sent to Texas to assess...
Thursday 22 October 2026
Tesla's Megapack boom meets AI power crunch, but margin gains raise questions
While Tesla is expanding its ambitions in autonomous transportation and embodied AI, developments in its energy-storage business are drawing attention following a mixed set of financial...
Thursday 22 October 2026
Intel begins Arizona Fab 62 equipment installation, advances Ohio project as AI CPU demand surges
Intel is accelerating work on its long-delayed US semiconductor manufacturing projects, with equipment installation underway at its Fab 62 facility in Arizona and construction progressing...
Thursday 22 October 2026
Tesla's Robotaxi test enters harder phase: turning autonomous miles into transport business
Tesla's Robotaxi expansion is entering a new phase as the company increases unsupervised autonomous mileage, deploys its purpose-built Cybercab and works to expand fleet operations...
Thursday 22 October 2026
Nvidia's AI factory strategy points to a broader shift in computing, industry
Nvidia is positioning the expansion of artificial intelligence as an infrastructure and industrial shift, not simply a software trend. At GTC Berlin, CEO Jensen Huang described an...
Thursday 22 October 2026
Nvidia lines up six suppliers to expand substrate, packaging, and testing capacity
Nvidia said on October 21 that it is working with six supply chain partners to expand manufacturing capacity for substrates, advanced packaging, testing, and optical engines to meet...
Thursday 22 October 2026
China's IC designers expand into AI server memory interconnects beyond DDR5
China's IC designers are expanding into high-speed interconnect technologies as AI inference and agent applications fuel demand for server CPUs, memory modules and connectivity chips...