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NEWS TAGGED EXPANSION
Monday 12 October 2026
How 'Filter Moore's Law' is doubling revenue for a Taiwan chip filter maker
Under what the industry terms the "Filter Moore's Law," each process node shrink lowers tolerance for airborne molecular contaminants, causing filtration demand to grow exponentially...
Monday 12 October 2026
Taiwan's UMT extends 50%-plus revenue growth streak as LEO satellite deployments accelerate
Taiwan-based Universal Microwave Technology (UMT) reported September 2026 revenue of NT$292 million (US$9.15 million), up 52.49% year-over-year, extending its streak of monthly year-over-year...
Monday 12 October 2026
AI racks approach megawatt power levels as SiC, GaN, silicon divide power delivery roles
The rapid expansion of AI infrastructure is driving demand for higher power and voltage levels, pushing power semiconductor development toward greater efficiency, higher power density,...
Monday 12 October 2026
SK Hynix's US$299 billion chip plan faces military base hurdle
SK Hynix's proposed KRW400 trillion (approx. US$299 billion) semiconductor expansion in southwestern South Korea faces a major obstacle as the company races to increase memory production...
Saturday 10 October 2026
Zhen Ding posts record September sales on mobile demand and AI applications
Zhen Ding Technology said September 2026 consolidated revenue reached NT$26.358 billion (US$825.13 million), up 36.13% year over year and 27.54% from August, setting a monthly record...
Saturday 10 October 2026
Semco moves glass substrates to package-level testing
Samsung Electro-Mechanics (Semco) has reportedly completed initial reliability testing of its 100mm glass substrates and moved to package-level verification using customer chips, marking...
Saturday 10 October 2026
JNTC bets US$259 million on glass substrates ahead of 2028 ramp
South Korea's JNTC plans to invest KRW347 billion (approx. US$259 million) in glass substrate manufacturing as it reports a sharp reduction in copper-filling time for thick glass cores,...
Friday 9 October 2026
Formosa Smart Energy teams up with CXIT on AI data center push
Formosa Smart Energy (FSET) is moving into AI data centers and will partner with Chuang-Xi Information and Technology (CXIT) to build one at Formosa Plastics Group's Mailiao industrial...
Thursday 8 October 2026
Bloom Energy SOFC system to support AOI's Taiwan expansion

Taiwan-based energy solutions provider Leadray Energy has partnered with Bloom Energy to deploy a solid oxide fuel cell (SOFC) on-site power generation...

Thursday 8 October 2026
Hanmi wins rare Samsung order amid US$5 billion chip substrate expansion
South Korea's Hanmi Semiconductor has secured a KRW24.48 billion (approx. US$18.3 million) equipment order from Samsung Electro-Mechanics, a rare deal with a Samsung Group affiliate...
Thursday 8 October 2026
Viking Tech lead times stretch to 6 months; orders seen into 2H27
Viking Tech said demand from AI, data centers, server power, military, and aerospace applications has kept capacity fully loaded as it enters the fourth quarter of 2026, with its book-to-bill...
Thursday 8 October 2026
Doosan bets big on China as CCL prices climb
South Korea's Doosan is directing more than half of its record KRW968.4 billion (approx. US$724 million) copper-clad laminate (CCL) investment to China, positioning itself closer to...
Thursday 8 October 2026
GlobalWafers September revenue rises 7.65% on stronger demand
GlobalWafers' September and third-quarter sales showed a mixed picture for the semiconductor materials supplier, with artificial intelligence (AI)-related demand helping offset a lingering...
Thursday 8 October 2026
Laster revenue falls as AI-driven component shortage delays automotive shipments
Laster said shortages of key components have delayed automotive order shipments, underscoring how global demand for AI-related parts is rippling into other industries. The impact trimmed...
Wednesday 7 October 2026
DIGITIMES Insight: HBM expansion raises the bar for memory offload
The boundary for adopting external capacity is changing, as workloads that previously needed memory offload because of insufficient high-bandwidth memory (HBM) can now run directly...