News tagged glass substrate at DIGITIMES

NEWS TAGGED GLASS SUBSTRATE

Thursday 2 July 2026

BOE, Chinese panel makers' chip push tightens the squeeze on South Korea

China's display makers, led by BOE Technology (BOE), are pushing deeper into semiconductors, with BOE advancing glass substrates, and...

Wednesday 24 June 2026

Global market for advanced chip packaging set for rapid expansion

The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global...

Wednesday 24 June 2026

JEDEC reportedly approves SPHBM4 standard to broaden HBM4 packaging and boost glass substrate prospects

JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources...

Monday 22 June 2026

TSMC glass substrate rollout unlikely before 2030

The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving...

Tuesday 16 June 2026

TSMC reportedly teams with Ibiden, Innolux to push CoPoS, glass substrates

TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in...

Thursday 4 June 2026

Huawei's Tau Law shifts AI chip race to glass substrates, advanced packaging

Huawei's recently proposed "Tau Law" suggests that reducing signal transmission distance, combined with heterogeneous integration and system-level optimisation, can enhance computing...

Tuesday 2 June 2026

Display to semiconductor: Panel makers weaponize large glass substrates for FOPLP

Introduction

Saturday 30 May 2026

Intel makes first major move into India's semiconductor ecosystem with advanced glass substrate manufacturing MoU

India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state...

Tuesday 26 May 2026

Intel's Rio Rancho fab becomes test case for AI-era chip packaging

Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on advanced packaging and glass substrate technologies as it positions...

Sunday 19 April 2026

Corning leads glass substrate race as South Korea's KCC and LX Glass face steep challenges

Glass core substrates, valued for their low dielectric loss and warpage reduction, are key to next-generation advanced semiconductor packaging. In South Korea, traditional glass makers...

Tuesday 14 April 2026

Glass substrates move toward mass production as Intel, Samsung Electro-Mechanics step up efforts

Glass substrates are entering a critical pre-mass production phase as demand for high-performance AI chips accelerates. As AI workloads require larger chip sizes and higher bandwidth,...

Tuesday 27 January 2026

China reportedly enters semiconductor glass substrate market

China is moving into the semiconductor glass substrate market, with both chip-related suppliers and display makers entering the field, according to Korean industry reports.

Tuesday 20 January 2026

Eternal Precision secures position in AI with glass substrate, panel-level packaging equipment

Eternal Precision Mechanics (EPM), a subsidiary of Eternal Materials, made its official market debut on January 16, listing shares at an underwriting price of NT$125 (approx. US$3....

Tuesday 13 January 2026

Macroblock advances Micro LED glass substrate applications towards mass production

LED driver IC designer Macroblock stated that Micro LED applications based on PCB substrates have been rolled out one after another, while Micro LED applications using glass substrates...

Monday 12 January 2026

AGC completes restructuring by exiting small glass substrate business for mobile phones

Japanese glass manufacturer AGC Corporation announced the completion of a major restructuring initiative, exiting the small-glass-substrate business for mobile phones. This move signals...

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