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NEWS TAGGED HUAWEI
Friday 30 October 2026
Memory price surge clouds peak season; Chinese brands' 4Q26 smartphone shipments to drop over 35%
Despite new smartphone launches from Apple, Huawei, Oppo, Vivo, and Xiaomi, rising memory prices are weakening sales momentum and prompting Chinese smartphone brands to adjust their...
Thursday 29 October 2026
Huawei deploys Tau Law in base-station design, rolling out new wireless baseband overseas
Huawei has extended its semiconductor-focused "Tau (τ) Law" framework to 5G base station design, using co-design across algorithms, chip architectures, and high-speed interconnects...
Wednesday 28 October 2026
Huawei elevates consumer chief Gang He to board as consumer unit gains strategic weight
Huawei Technologies has reshuffled its top leadership, appointing Consumer Business Group (BG) CEO Gang He to its 17-member board. The move follows the departure of former board member...
Friday 23 October 2026
First chip-level device on the list: US FCC bans two devices with Huawei HiSilicon chips under new rule
The US Federal Communications Commission (FCC) has banned two electronic devices from entering the US market because both contain surveillance chips made by Huawei's HiSilicon. The...
Friday 23 October 2026
Mounting R&D and memory costs push Huawei to borrow US$2.3B from six Chinese banks
Huawei Technologies has secured a seven-year, CNY15 billion (approx. US$2.3 billion) offshore yuan loan from six Chinese banks, as rising research spending and memory costs weigh on...
Thursday 22 October 2026
Charts: Nvidia's China AI chip lead shrinks 80% as Huawei closes in
Nvidia's lead over Huawei in China's AI accelerator market has narrowed by 80% in a year, bringing CEO Jensen Huang's warnings about losing the country's US$50 billion AI chip market...
Tuesday 20 October 2026
DeepSeek-Huawei chip co-design could shift AI training away from Nvidia
DeepSeek is reportedly working closely with Huawei to influence the design of its future AI chips, a link reportedly closer than typical supplier-customer relationships. The collaboration...
Tuesday 20 October 2026
Huawei-Chery Luxeed gains independent EV license
China’s Luxeed EV brand, jointly developed by Chery Auto and Huawei, has obtained independent vehicle manufacturing qualifications and plans to pursue a standalone listing. Production...
Monday 19 October 2026
Samsung targets Exynos 2700 expansion as Huawei advances Kirin chips
Samsung Electronics is developing the Exynos 2700 for broader use across its Galaxy S27 lineup in 2027, while Huawei has moved its next-generation Kirin chips into testing. The competing...
Monday 19 October 2026
China probes Huawei-JAC Maextro V800 over brake pedal failure
China's premium electric vehicle (EV) market is facing renewed safety scrutiny following product defect concerns. Maextro, an ultra-luxury automotive brand jointly developed by Huawei...
Friday 16 October 2026
Chinese chip toolmakers buy into hybrid bonding as Huawei looks beyond transistor shrinking
China's largest chip equipment makers are buying their way into hybrid bonding, the advanced packaging step that global players from Besi to ASML are also chasing. For Chinese firms,...
Thursday 15 October 2026
Commentary: Huawei's 2027 Kirin roadmap — can LogicFolding overcome chipmaking constraints?
On October 13, Huawei unveiled the detailed architecture of its Kirin 9050 Pro chip for the first time at its Lianqiu Lake research center in Shanghai, outlining advances in LogicFolding...
Thursday 15 October 2026
HiSilicon expands DDI push across all display sizes

Huawei subsidiary HiSilicon is actively expanding its display chip footprint, with its display driver IC (DDIC) development once again capturing...

Wednesday 14 October 2026
China's smartphone slump: Can Apple's new lineup light a spark?
China's smartphone market faces dual pressures as weakening consumer spending and rising component costs continue to weigh on the handset sector. According to third-quarter data from...
Wednesday 14 October 2026
Huawei's Kirin 9050 Pro delivers 53.5% density gain; tighter 3D bonding next for 2027
Huawei has begun mass-producing its Kirin 9050 series with LogicFolding, a 3D chip architecture that improves transistor density and computing efficiency without relying solely on...