Enovix, a next-generation 3D silicon-lithium battery design and manufacturing company founded in 2007, is a global leader in high-performance battery technology. On August 8, it announced...
Infineon has built a new plant in Kulim Hi-Tech Park, Malaysia, dedicated to generating 8-inch silicon carbide (SiC) wafers. Here are five major takeaways from the new facility's...
Infineon has a solid basis in SiC production technology capabilities and intends to mitigate potential market oversupply and other market headwinds by capitalizing on its superior...
Infineon Technologies is set to unveil a new silicon carbide (SiC) wafer fab at its plant site in Kulim, Malaysia, which aims to move from 6-inch to 8-inch production in 2025. Malaysia's...
Infineon Technologies has completed the sale of its two backend manufacturing sites, one in Cavite, Philippines, and one in Cheonan, South Korea, to two fully owned subsidiaries of...
Infineon Technologies has unveiled a new microcontroller unit (MCU) series for automotive system-on-chip (SoC) solutions, focusing on applications such as smart cockpits. This development...
The patent war surrounding gallium nitride (GaN) compound semiconductors continues to escalate. Recently, power component leader Infineon intensified its patent infringement case...
Gallium Nitride (GaN) semiconductors, having made a strong debut with fast chargers for consumer electronics, are now finding fresh opportunities in AI servers, data centers, and...
On July 23, 2024, Infineon Technologies AG expanded its ongoing lawsuit in the U.S. District Court for the Northern District of California, adding claims against Innoscience (Zhuhai)...
During the Infineon Tech Day held in Taiwan, Infineon Technologies, an integrated device manufacturer (IDM), announced the release of a new PSoC Edge line of microcontroller units...
Infineon Technologies is working to maintain its leadership in the power semiconductor industry by implementing measured strategies for power semiconductors and wide-bandgap (WBG)...
In March and April 2024, the implementation unit of the US CHIPS and Science Act and the US Department of Commerce announced that Intel and TSMC received US$8.5 billion and US$6.6...
In March and April 2024, Intel and TSMC received substantial subsidies of US$8.5 billion and US$6.6 billion respectively for building plants in the US under the CHIPS and Science...
Amkor Technology and Infineon Technologies have signed a Memorandum of Understanding (MoU) to jointly promote sustainability and decarbonization methods across their supply chain.
Chip manufacturing is the primary source of the carbon footprint generated by electronic devices. To address this, German chip giant Infineon plans to calculate the carbon footprint...
