News tagged Intel at DIGITIMES

NEWS TAGGED INTEL

Wednesday 16 September 2026

Altera confidentially files for US IPO as AI chip demand fuels listing boom

Altera, the programmable-chip maker backed by Silver Lake and Intel, has confidentially filed for an initial public offering (IPO) in the...

Wednesday 16 September 2026

Apple, Intel links sharpen focus on Lens Technology's next glass growth markets

Lens Technology is pushing its precision-glass expertise into two higher-value markets that could reshape its growth profile: Apple-linked foldable devices and Intel-linked through-glass-via...

Wednesday 16 September 2026

Samsung reportedly taps TSMC for custom HBM base dies as new foundry dynamics emerge

The logic die at the bottom of a high-bandwidth memory (HBM) stack has become the semiconductor industry's newest contested territory...

Wednesday 16 September 2026

DIGITIMES Insight: Intel may lack a price edge over TSMC on SK Hynix HBM base dies

SK Hynix is reportedly considering Intel as an additional manufacturing source for high-bandwidth memory (HBM) base dies beginning with...

Monday 14 September 2026

Weekly news roundup: HBM4 strain, Intel price hikes and the next AI infrastructure buildout

AI demand remained the dominant force across semiconductors, memory, foundry and data-center infrastructure this week. Intel raised CPU prices while Qualcomm and MediaTek targeted...

Friday 11 September 2026

Altera eyes $2B IPO, from Intel carve-out to public debut

Chipmaker Altera is laying the groundwork for an initial public offering (IPO) that could raise over US$2 billion as early as late 2026. According to sources familiar with the matter...

Thursday 10 September 2026

Analysis: China chases EUV as chipmakers move to High-NA

The extreme ultraviolet (EUV) lithography race is splitting into two tracks. Intel has moved High-NA EUV into production, Samsung Electronics and SK Hynix are targeting DRAM production...

Tuesday 8 September 2026

Intel CPU prices reportedly rising 10% again as Qualcomm and MediaTek target IPC and IoT gaps

Intel's PC CPU prices have continued to rise since the end of 2025, and supply chain sources said the company is expected to raise them by another 10%. Its low-margin small-core line...

Friday 4 September 2026

Nvidia's Hugging Face terms pay out its chip rivals and reserve US$1 billion to keep the staff

The mechanics of Nvidia's US$12.93 billion purchase of Hugging Face say as much about the deal's purpose as the strategic case does: a tenth of the consideration is set aside to stop...

Thursday 3 September 2026

Intel pre-funds EMIB-T and CPU capacity, will address DRAM through partners rather than fabs

Intel's US$23 billion equity raise in August was pre-funding for a capacity build driven by demand and process confidence rather than distress, chief financial officer David Zinsner...

Wednesday 2 September 2026

Taiwan doesn't just want a quantum lab — it wants a quantum fab

Taiwan built the last computing era by manufacturing other people's designs. Ching-Ray Chang wants it to try the same trick with quantum computing, and he is arguing the window is...

Tuesday 1 September 2026

XCENA teams up with Samsung on rack-scale CXL memory; demos on Intel Xeon 6

South Korean chip startup XCENA is pushing CXL beyond memory expansion and toward a new layer of server computing, unveiling measured results for its MX1 computational memory device...

Tuesday 1 September 2026

SK Hynix explores Intel as second source for HBM base dies

SK Hynix is reportedly considering adding Intel Foundry as a second manufacturing source for high-bandwidth memory (HBM) base dies, a move that could reduce its reliance on TSMC as...

Monday 31 August 2026

Podcast highlights: Xiaomi's 3nm chip cap, HBM in Malaysia, and Nvidia's margin tradeoff

Can Xiaomi's in-house chip reach 2nm? Is HBM rerouting to Malaysia TSMC giving Intel a pass? Can Nvidia hold a 75% gross margin or protect market share? Ahead of Apple's September...

Thursday 27 August 2026

Google, MediaTek embrace advanced packaging diversification

Google and MediaTek are moving toward advanced packaging diversification, as Intel's embedded multi-die interconnect bridge (EMIB) gains traction after Google's TPU was confirmed to...

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