Apple Inc.'s first foldable iPhone, the iPhone Duo, went on sale in China on October 23, with limited initial supplies pushing some preorder delivery dates to late January 2027. The...
Oppo unveiled the international version of its Find X10 smartphone series in Spain on October 22 (Taiwan Standard Time), following the line's China launch in late September. The move...
Apple has raised its iPhone Duo shipment target by 44%, from 9.7 million to 14 million units over 12 months, as strong consumer demand for its first foldable iPhone prompts the company...
China's smartphone market rebounded in September 2026 after weak July and August shipments, as brands rolled out more new models. Shipments reached 21.86 million units, down nearly...
SpaceX's third quarter of 2026 reshaped the business. Its Super Intelligence (SI) segment, the compute and AI unit previously reported as Artificial Intelligence, generated more revenue...
Japan has successfully launched a spacecraft bound for the moons of Mars, gaining an early advantage over China in the international race to become the first country to return samples...
Thermaltake is targeting the growing edge AI market with a new workstation lineup. Chairman Kenny Lin said the company has transformed from a gaming components maker into an AI PC...
The Japan Aerospace Exploration Agency (JAXA) announced on October 18 that its H3 Flight No. 10 rocket, carrying the Martian Moons eXploration (MMX) spacecraft, had been transferred...
Apple has announced a new-product event called "Pro and tell" in Los Angeles on October 28, with the company widely expected to unveil its first MacBook Pro with a touchscreen. The...
Sandisk will be the exclusive provider of flash storage for Meta VR Glasses, supplying Meta-certified microSD Express memory cards and USB-C flash drives when the glasses launch in...
Chenming Hu co-invented the FinFET transistor with colleagues at the University of California, Berkeley, in the 1990s and became TSMC's first chief technology officer in 2001. Decades...
The foundations of TSMC's modern-day success can be traced back to a public call from the US Defense Advanced Research Projects Agency (DARPA) for innovative designs that could break...
South Korean semiconductor equipment maker Hanmi Semiconductor showcased its high-bandwidth memory (HBM) and AI chip packaging equipment at SEDEX 2026, including the TC Bonder 4 for...
Malaysia's push to move from assembling chips to owning the designs behind them has reached the point where it must find buyers. On October 16, the government unveiled six semiconductor...
