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Wednesday 11 December 2024
CMMT pushing into FOPLP product business
Polarizer specialist Cheng Mei Materials Technology (CMMT) is collaborating with customers on films, adhesives, and coatings for the fan-out panel-level packaging (FOPLP) backend...
Monday 2 December 2024
Tesla, BYD ramp up China incentives in end-of-year sales push
Electric car makers including Tesla and BYD have unleashed further discounts and incentives in China in a final push to meet annual sales targets.
Monday 18 November 2024
SK Siltron secures US$544 million loan to support SiC wafer production
SK Group's silicon wafer manufacturer SK Siltron has confirmed that it will receive a loan of US$544 million from the US Department of Energy (DOE) to invest in its silicon carbide...
Monday 28 October 2024
Alpha Intelligence creates unprecedented AI risk assessment model, foraying into Asian markets with its Taiwan experience
To keep abreast of advances in innovative financial technology (fintech), Taiwan's Financial Supervisory Commission is gradually loosening financial regulations, allowing banks to...
Wednesday 25 September 2024
Kioxia secures US$841 million loan to boost latest NAND production for AI and data centers
Kioxia, a leading player in the NAND flash industry, has secured a loan commitment of JPY120 billion (US$841 million) from major financial institutions. This financing will enable...
Wednesday 28 August 2024
Rapidus pursues US$690 million loan to achieve 2nm chip production by 2027
Rapidus, aiming to begin mass production of 2-nanometer chips in Japan by 2027, is seeking significant financial support for its trial production and eventual mass production.
Wednesday 27 March 2024
IC packaging materials supplier CWE obtains NT$3 billion syndicated loan
Chang Wah Electromaterials (CWE) has signed a five-year syndicated loan agreement for NT$3 billion (US$94 million) with 12 local banks in Taiwan, according to the semiconductor materials...
Wednesday 20 March 2024
Intel grabs away US$8.5 billion CHIPS Act money and a US$11 billion loan
The Biden-Harris Administration announced that the US Department of Commerce and Intel Corporation have reached a non-binding preliminary Memorandum of Terms (PMT) to provide up to...
Monday 26 February 2024
SK Siltron receives conditional commitment from DOE for US$544 million loan
SK Siltron CSS, a silicon carbide (SiC) wafer production company, recently announced that it has obtained a conditional loan commitment from the US Department of Energy (DOE) for...
Monday 5 February 2024
WT Group gets US$1.9 billion syndicated loan for acquisition
WT Group, the fourth-largest semiconductor component distributor in the world, has signed a contract with banks to obtain half of the capital needed to acquire its Canadian counterpart,...
Thursday 19 October 2023
Hai Long Project: Taiwan's largest offshore wind financing, targeting commercial operation by 2025
The Hai Long Offshore Wind Project recently celebrated its financing completion ceremony, marking the successful acquisition of over NT$117 billion in green financing over a period...
Monday 26 June 2023
Ford and SK On joint venture poised to receive US$9.2 billion loan to build battery plants
The US Department of Energy announced on June 22 that it plans to loan US$9.2 billion to BlueOval SK, the battery joint venture between Ford and South Korea-based SK On. The loan...
Thursday 13 April 2023
Winbond obtains NT$20 billion syndicated loan
Winbond Electronics has signed a seven-year syndicated loan agreement for NT$20 billion (US$656.3 million) with 11 local banks in Taiwan, according to the specialty DRAM and flash...
Tuesday 28 March 2023
LGD borrows KRW1 trillion from LG to expand OLED investments
LG Display (LGD) is borrowing KRW1 trillion (US$770 million) from LG Electronics and will use the loan for the growth of its OLED product business, according to LGD's recent announ...
Monday 21 November 2022
India roundup: ISMC Analog reportedly set to acquire bank loan for chip fab
As India faces an ecnomic downturn, shipments of PCs and smartphones declined for the third quarter of 2022. India's semiconductor fab investments is progressing slowly with ISMC...
CHT
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research