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    Friday 11 September 2026
    ASPEED plans December BMC price hikes to fuel server security footprint

    As demand for AI servers intensifies and supply chain bottlenecks continue to ease, shipment momentum for baseboard management controller...

    Friday 11 September 2026
    Rayzher rides semiconductor fab buildout to record revenue
    Rayzher Industrial, a high-tech factory gas supply system solutions provider, reported consolidated revenue of NT$369 million (approx. US$11.7 million) in August 2026, up 83.26% year-over-year...
    Thursday 10 September 2026
    MicroIP lands NT$630 million AI smart-building contract in northern Taiwan
    MicroIP said on Sept. 10 that it secured a systems integration contract worth about NT$630 million for a major AI smart residential project in northern Taiwan. The agreement is expected...
    Wednesday 9 September 2026
    Ability Enterprises August revenue hits 10-year high on AI vision, drones, robot cameras
    Ability Enterprise reported August 2026 revenue of NT$1.313 billion, its highest monthly level since December 2015, as three new product lines entered volume shipments. The Taiwanese...
    Wednesday 9 September 2026
    Foxtron clears another hurdle in the race to make SDVs globally compliant
    Foxtron has obtained ISO/SAE 21434 certification for road-vehicle cybersecurity engineering and ISO 24089 certification for road-vehicle software-update engineering following an assessment...
    Wednesday 9 September 2026
    Mature-node chip scramble may persist through 2028 as supply chain management becomes bargaining leverage
    Capacity for advanced semiconductor processes and packaging remains tight, while mature-node chips required for AI-related peripheral applications are also facing mounting supply pressure...
    Wednesday 9 September 2026
    China GPU developer Biren expands AI chip R&D into optical interconnects, advanced cooling
    Chinese GPU developer Biren Technology has teamed up with Shanghai University to establish an Integrated Circuit Intelligent Chip Joint Laboratory, expanding their cooperation into...
    Monday 7 September 2026
    JM-Applied sees gas equipment demand surge on AI expansion, order book exceeds NT$3 billion
    JM-Applied, a Taiwanese semiconductor gas equipment manufacturer and supply chain member for Micron and TSMC, said on September 4 that revenue in the first half of 2026 exceeded NT$600...
    Monday 7 September 2026
    Eaton expands AI data center stack from grid to chip
    As AI data centers scale rapidly, Eaton is expanding beyond traditional power management into modular power deployment, next-generation DC conversion and liquid cooling, positioning...
    Sunday 6 September 2026
    TWM, SYSTEX debut at smart building expo
    Taiwan Mobile announced that it is participating for the first time with Systex in the "2026 Build for NextGen – International Sustainable Intelligent Building & Intelligent...
    Friday 4 September 2026
    LB Semicon starts Qualcomm shipments as DDI dependence fades
    South Korean OSAT player LB Semicon has begun shipments to Qualcomm Inc., marking a key step in its effort to move beyond a business structure long centered on display driver ICs (DDI)...
    Wednesday 2 September 2026
    World Diamond Technology accelerates mass production of 300 mm diamond wafers

    As AI, high-performance computing (HPC), and advanced packaging continue to move toward higher levels of power integration, chip power consumption is rising rapidly....

    Tuesday 1 September 2026
    Apple reshuffles leadership, shifts Schiller out of App Store
    Apple has made another major management shake-up. After Tim Cook stepped down as CEO and was succeeded by John Ternus, formerly head of hardware engineering, veteran Phil Schiller...
    Tuesday 1 September 2026
    Nvidia targets HBM race with custom NVHBM, expands NVLink Fusion
    As trillion-parameter large language models (LLMs) and agentic AI become mainstream, the AI infrastructure bottleneck is shifting from raw compute power toward system-level integration...
    Tuesday 1 September 2026
    Samsung weighs HBM4 bonuses as memory, foundry teams align
    Samsung Electronics is using a cross-division "One Team" model to develop its sixth-generation high-bandwidth memory, HBM4, but the approach is creating a new challenge for the newly...
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    BIZ FOCUS
    Sep 11, 08:00
    DAS Expands in Taiwan and Unveils World First at SEMICON
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
    Thursday 10 September 2026
    Stress, Sleep, and Lifestyle Balance: Perspectives from Traditional Chinese Medicine
    Wednesday 9 September 2026
    IDA Partners with Taiwan's Semiconductor Industry to Advance Global Talent Strategy
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