SK Hynix is doubling down on diversifying its supply chain for thermal compression bonding (TCB) equipment, crucial for producing high-bandwidth memory (HBM), while Samsung Electronics...
Benefiting from a rapid recovery in memory market demand during the first half of 2025, memory packaging and testing companies are sharing in the gains. Although the US 90-day tariff...
As Nvidia prepares to begin supplying samples of its next-generation AI accelerator "Rubin," industry sources report that SK Hynix is accelerating shipments of sixth-generation high-bandwidth...
The US expanded semiconductor restrictions to include Nvidia's H20 chip, previously the only compliant AI processor available to Chinese buyers, as the Trump administration deepens...
China continues to lag behind memory giants SK Hynix, Micron, and Samsung Electronics in developing high bandwidth memory (HBM) technology. Although US export controls on semiconductor...
Canon Machinery, a subsidiary of Japan's Canon Inc., is intensifying its development of hybrid bonding technology as it seeks to expand beyond its conventional die-bonding equipment...
The recent increase in mature process DRAM prices is expected to boost Samsung Electronics' DRAM business revenue, offsetting the sluggishness in its high bandwidth memory (HBM) business...
AMD on June 12 officially confirmed that its next-generation AI accelerators—the Instinct MI350X and MI355X—will feature 12-high HBM3E memory supplied by Samsung and Micron...
As data centers face increasing demands for AI training and inference workloads, high-bandwidth memory (HBM) has become a critical competitive edge for memory manufacturers. Micron...
SK Hynix has unveiled a long-term roadmap for next-generation DRAM technologies, laying out a vision that aims to drive sustainable innovation over the next 30 years as the global...
Nvidia has reportedly tapped Micron Technology as the first supplier of its next-generation small outline compression attached memory module (SOCAMM) chips, putting the US-based memory...
As mass production of sixth-generation HBM4 nears, South Korean chip giants Samsung Electronics and SK Hynix are aggressively reconstructing their semiconductor equipment supply chains...
Chipmaker Micron Technology Inc. said it will spend about US$200 billion on US manufacturing, research and development, the latest company to pledge large-scale investments in the...
SK Hynix President and CEO Kwak Noh-jung warned that growing tariff-related uncertainty could heighten market volatility in the second half of 2025. He shared these views during the...
