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Monday 25 November 2024
Samsung's HBM3E availability remains uncertain for Nvidia's Blackwell
During Nvidia's earnings call for the third quarter of fiscal year 2025, CEO Jensen Huang expressed gratitude to supply chain partners including TSMC and SK Hynix for their contribution...
Friday 22 November 2024
HBM memory supply to scale in 2025
With the acceleration of Blackwell mass manufacturing, the capacity of HBM3E will greatly grow. According to industry estimates, after a twofold rise in HBM production in 2024, demand...
Thursday 21 November 2024
SK Hynix closes in on Samsung with NAND market share set to top 20%
SK Hynix's strategic focus on high-end NAND memory, coupled with rising AI-driven demand, is expected to push its annual market share above 20% in 2024, bringing it closer to industry...
Thursday 21 November 2024
GlobalFoundries cements Chips Act deal for US$1.5 billion grant
The Biden administration has finalized Chips Act incentives for GlobalFoundries (GF), awarding the chipmaker US$1.5 billion in grants to support US factories as part of a broader...
Tuesday 19 November 2024
Micron adopts pragmatic China strategy amid US tech restrictions
Micron Technology is taking a more pragmatic approach to its operations in China, aligning its strategy with Chinese government expectations while navigating US technology restrictions...
Friday 8 November 2024
Trump's win sets off race to complete Chips Act subsidy deals
The Biden administration is racing to complete Chips Act agreements with companies like Intel Corp. and Samsung Electronics Co., aiming to shore up one of its signature initiatives...
Friday 8 November 2024
Bolstered by US partnerships, Micron's HBM3E progress outpaces Samsung
The competition in the high bandwidth memory (HBM) market intensifies between South Korea's two major DRAM giants, Samsung Electronics (Samsung) and SK Hynix. Meanwhile, US manufacturer...
Friday 1 November 2024
Micron spotlights Taiwan's 2 core strengths in supply chain strategy – a DIGITIMES exclusive
Global tech giants are increasing their investments in Taiwan, with Micron leading as the largest foreign investor. Over its 30-year presence, Micron has invested more than NT$1 trillion...
Friday 1 November 2024
AUO to close NT$7.4bn Tainan plant sale to Micron by 2024's end
AUO has recently agreed to sell its Tainan plant to Micron for NT$7.4 billion (approx. US$228 million), with the transfer expected to be finalized by the end of 2024. AUO anticipates...
Monday 28 October 2024
Korean chipmakers lukewarm on India's semiconductor expansion
As the US persists with its chip restrictions on China, global semiconductor firms are increasingly eyeing India as a prime investment destination. Capitalizing on this trend, India...
Monday 28 October 2024
Weekly news roundup: Micron, Intel, Tesla hit by China's national security measures; SiC prices plunge as Chinese capacity soars
These are the most-read DIGITIMES Asia stories in the week of October 21 - October 25.
Friday 25 October 2024
Micron PCIe Gen5 SSDs earn spot on Nvidia GB200 NVL72 vendor list
Micron Technology has announced that its 9550 PCIe Gen5 E1.S data center SSDs have been qualified for Nvidia's recommended vendor list (RVL) for the NVIDIA GB200 NVL72 system and...
Friday 25 October 2024
NAND flash market faces cyclical downturn amid production adjustments
The NAND flash market is currently experiencing a cyclical downturn due to persistent oversupply conditions. Key factors contributing to this situation include weakening demand from...
Thursday 24 October 2024
Micron anticipates AI demand boost as EUV-based DRAM enters production in 2025
Micron Technology, which has fully allocated its HBM production capacity for calendar 2025, indicated that demand for AI will increase as it expands from cloud servers to consumer...
Thursday 24 October 2024
SK Hynix maintains edge in HBM3E, but HBM4 certification and Samsung's pursuit pose risks
SK Hynix will announce its financial results for the third quarter of 2024 on October 24. During its previous earnings call, the company indicated that shipments of its HBM3E products...