SK Hynix is expediting the development of 16-layer HBM3E (High Bandwidth Memory) to reinforce its leading position in the competitive HBM market, as challenges from rivals like Samsung...
Micron CEO Sanjay Mehrotra recently shared insights into the AI-powered PC market from a memory provider's perspective during the company's latest earnings call. He highlighted the...
The explosive growth of artificial intelligence (AI) has fueled a surge in demand for data centers, with Micron projecting the high-bandwidth memory (HBM) market to surpass US$25...
Amid rising geopolitical tensions, the global semiconductor sector is witnessing an intense chip war across multiple regions, with a critical shortage of skilled talent emerging as...
Despite a positive outlook for the memory market, driven largely by data centers, Micron anticipates Samsung Electronics' entry into the HBM market and is shifting toward higher-value...
Micron Technology's sales have nearly doubled year-over-year, driven by strong artificial intelligence (AI) demand, leading to a profitable fourth quarter of fiscal 2024. The company...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, is pleased to announce that its 3nm HBM3E Controller and PHY IP have been adopted by a leading Cloud Service Provider (CSP) and...
Samsung Electronics (Samsung) and SK Hynix are both preparing to mass-produce the new concept of low-power memory, LPCAMM. Experts anticipate a rapid increase in AI-enabled devices,...
Samsung Electronics is reportedly exploring using dry photoresist for its upcoming 6G 10nm-class DRAM (1c DRAM) to widen its lead in DRAM with its competitors, such as SK Hynix and...
Apple's first AI phone, the iPhone 16 series, has officially been released. To adapt to Apple Intelligence, the entire series features 8GB of memory capacity. As AI functions become...
Relevant officials stated that to encourage Taiwan-based IC design houses, the MOEA has offered generous subsidies, aiming for over 40% of Taiwanese IC design houses to adopt advanced...
Key AI chipmaking and high-bandwidth memory (HBM) technologies will be highlighted at SEMICON Taiwan 2024, where major manufacturers will gather to present their most recent develo...
Samsung Electronics has announced the successful qualification of its automotive LPDDR4X memory for use with Qualcomm Technologies' Snapdragon Digital Chassis. This memory is intended...
Leading panel makers AU Optronics (AUO) and Innolux are expected to end the year in the black, boosted by non-operating income as they sell their factories to TSMC and Micron, which...
