Zhen Ding Technology Group (ZDT), the world's largest printed circuit board (PCB) manufacturer, returned to SEMICON Taiwan 2025 to highlight how the AI boom is reshaping PCBs from...
Taiwan-based advanced packaging equipment provider C SUN Manufacturing, Ltd. (TWSE: 2467), now in its 60th year, is undergoing a critical transformation as it expands from its roots...
Driven by the growing demands of artificial intelligence (AI) and hyperscalers, advanced process technologies are accelerating innovation cycles. The supply chain indicates that in...
As the four major cloud service providers (CSPs) aggressively ramp up their presence in the AI computing market, Taiwan's printed circuit board (PCB) industry is experiencing a clear...
As demand for AI servers drives full production capacity, PCB manufacturer Gold Circuit Electronics (GCE) announced on September 5, 2025, that its board of directors approved a NT$1.6...
As the second half of 2025 ushers in the peak season for consumer electronics, Taiwanese PCB suppliers are preparing for new product launches from key clients like Apple. Despite...
The rapid advancement of GPU power is driving demand for faster, higher-frequency data links in AI servers and hyperscale data centers. With transfer rates pushing 32 gigatransfers...
Despite facing global end-market inventory adjustments and rising geopolitical uncertainties, Taiwan's printed circuit board (PCB) supply chain is shifting its capital expenditure...
Odisha emerged as a key player in India's semiconductor landscape at Semicon India 2025, securing multiple high-value investment commitments and unveiling ambitious manufacturing...
TSMC's CoWoS capacity remains in high demand, securing its dominant position in advanced semiconductor packaging with rumored gross margins nearing 80%. However, TSMC is proceeding...
The technology supply chain will gather for a series of exhibitions in the second half of 2025, including Taiwan's major PCB industry event, the TPCA Show, which will take place from...
Taiwan-based PCB manufacturer APCB is launching two new products in 2025, following significant capacity downsizing in 2024. However, the company noted that the new QSFP optical module...
Advanced packaging technologies are evolving at breakneck speed, with attention now shifting beyond wafer-level processes to panel and printed circuit board (PCB) platforms. A new...
Nvidia's new advanced packaging technology, Chip-on-Wafer-on-Platform (CoWoP), has moved into testing with engineering samples of its base printed circuit boards (PCBs) under verification...
AI servers have become a key growth driver for the global printed circuit board (PCB) industry. Companies specializing in advanced packaging IC substrates and high-layer count, high-density...
