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    ASE expands globally as Hanmi Semiconductor targets CoWoS packaging demand
    Jul 7, 18:18
    Kingsemi wins first commercial order for large-format panel-level packaging lithography tool
    Jul 7, 18:18
    Dongfeng Nissan seeks a turnaround amid weak Chinese auto market
    Jul 7, 18:18
    Apple's entry into foldable market boost supply chain orders despite cost pressure
    Jul 7, 18:18
    DRAM giants face US price-fixing lawsuit over HBM shift
    Jul 7, 18:18
    LG Innotek and LX Semicon reportedly enter Apple iPad OLED DDI supply chain
    Jul 7, 18:18
    NEWS TAGGED PRESIDENT
    Tuesday 7 July 2026
    Unimicron prices US$1.355 billion overseas depositary receipt offering

    Unimicron Technology has priced a large overseas depositary receipt sale that could affect global investors monitoring Taiwan's electronics...

    Tuesday 7 July 2026
    Taiwam showcases quantum computing breakthrough at biennial academician gathering, govt urges interdisciplinary collab

    Academia Sinica, Taiwan's premier national academic research institution, convened its 36th Convocation of Academicians from July 6...

    Friday 3 July 2026
    SAP names Verena Siow Asia-Pacific President

    Enterprise software company SAP announced on July 2 that it has appointed Verena Siow as president of the Asia-Pacific (APAC) region,...

    Thursday 2 July 2026
    AUO pushes AI-era transformation with executive reshuffle, launch of innovation institute
    Taiwanese optoelectronics specialist AUO announced organizational adjustments and senior executive appointments on July 1 as it continues to advance its business transformation. The...
    Wednesday 1 July 2026
    Gus Technology names Hota Group president as chairman
    Gus Technology has named Hota Group president Kuo-jung Shen as chairman after a June 30 shareholders' meeting, underscoring a deeper push into batteries, electric mobility, and energy...
    Tuesday 30 June 2026
    Yao Sheng bets on four new product lines, names Te-ching Shen as president
    Taiwanese electronic components manufacturer Yao Sheng Electronic held its 2026 annual shareholders meeting on June 25, noting that its transformation strategy in recent years has...
    Monday 29 June 2026
    Foxlink appoints Freddy Kuo president, targets AI factory transformation
    Cheng Uei Precision Industry (Foxlink) announced on June 24 that its board of directors has approved the appointment of Freddy Kuo as company president. Speaking publicly for the first...
    Saturday 27 June 2026
    ShunSin sees CPO potential, adds TSMC veterans as independents
    ShunSin, a Foxconn-affiliated packaging and testing company, held its 2026 annual general meeting, with chairman Shang-Yi Chiang presiding. Chiang said ShunSin will leverage its packaging,...
    Friday 26 June 2026
    Honyi International rebrands as Tianyi Water and Energy Solutions to seize water-power integration opportunities
    Following its rebranding from Honyi International to Tianyi Water and Energy Solutions, president Ching-chi Li said the company will leverage the resources of its parent group Lealea...
    Friday 26 June 2026
    Onsemi agrees to acquire Synaptics in US$7 billion all-stock deal
    Onsemi has agreed to buy Synaptics in an all-stock transaction valued at about US$7 billion, a deal that could reshape the edge AI landscape across automotive, industrial, and connected...
    Wednesday 24 June 2026
    SoftBank rejects space data centers and commits to Earth-based AI compute

    SoftBank Group said it will prioritize building large-scale terrestrial AI data-center capacity rather than pursuing space-based data...

    Tuesday 23 June 2026
    MediaTek issues official price hike notice, products facing supply constraints likely to increase first
    Taiwanese IC design leader MediaTek has sent a price hike letter to customers, signaling that the current wave of chip price increases is sweeping across the semiconductor market and...
    Monday 22 June 2026
    Intel CEO doubles down on advanced packaging with former SK Hynix chief's return
    Former SK Hynix CEO Lee Seok-Hee is set to return to Intel as executive vice president (EVP) of Intel's foundry business, strengthening Intel's push into advanced packaging technologies...
    Monday 22 June 2026
    Samsung sees ongoing SoC losses drag down System LSI's 2026 performance
    In a rare public admission during an internal briefing, Park Yong-In, president of the System LSI Business of the Device Solutions (DS) Division at Samsung Electronics, expressed concern...
    Saturday 20 June 2026
    Surging AI power demand pushes data centers toward higher-voltage designs

    As AI computing continues to scale, power systems are facing sharper load swings, along with rising requirements for power density and...

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    Research Report Database
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook