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Monday 19 January 2026
Micron sets 1γ as mainstream node for 2026 as HBM and SOCAMM2 ramp
With shipments of application-specific integrated circuits (ASICs) and XPUs expected to rise sharply in 2026, AI accelerators are set to continue relying on fifth-generation high-bandwidth...
Monday 19 January 2026
TSMT bets on DRAM modules to fuel 2026 growth as consumer demand cools
Taiwan Surface Mounting Technology Corp. said revenue returned to growth in 2025 after two consecutive years of decline, though rising prices and tight supply of key components are...
Monday 19 January 2026
India roundup: Acer bets on growing PC penetration
Acer and Lenovo are optimistic about India's consumer electronics sector as the global market slows due to rising memory prices.
Monday 19 January 2026
Advantest ATE lead times remain tight as AI and memory markets expand
As demand strengthens in markets such as GPUs and high-bandwidth memory (HBM), Japan-based Advantest said orders for semiconductor automated test equipment (ATE) remain stable, with...
Monday 19 January 2026
Taiwan PCB industry gearing up for record investment driven by AI cloud computing
Taiwan's printed circuit board (PCB) industry is entering a new growth cycle fueled by a surge in cloud artificial intelligence (AI) computing orders. Manufacturers are ramping up...
Monday 19 January 2026
Taiwan's DDI chipmakers fight for survival beyond displays

Taiwanese DDI vendors rode a post-pandemic growth wave, but demand turned increasingly uncertain in 2025. Weak consumer end markets, slowing...

Monday 19 January 2026
Young Fast Optoelectronics to integrate vertically, expand into gaming assembly and electronic paper modules by 2026
Touch panel manufacturer Young Fast Optoelectronics, which has shifted focus toward electromechanical products in recent years, plans to vertically integrate its optoelectronics division...
Monday 19 January 2026
Ardentec utilization rate rises through 2025 on chip testing demand from networking, automotive, and storage sectors
Semiconductor testing company Ardentec reported steady utilization growth through 2025, driven by strong chip-testing orders from the networking, automotive, and storage markets. The...
Sunday 18 January 2026
MGC expands into AI liquid cooling market
Meta Green Cooling (MGC) is making a comprehensive push into the AI liquid cooling sector, leveraging its unique full-spectrum capabilities. MGC chairman James Chen noted that, unlike...
Saturday 17 January 2026
Top 10 Chart: Taiwan's IC design sector ends 2025 with an AI-led split
Taiwan's IC design segment posted a visibly divergent finish in December 2025, with AI/HPC, data center, and enterprise storage-related suppliers closing the year strongly, while consumer...
Saturday 17 January 2026
Amkor to close longstanding Japan chip plant as EV demand slows

Amkor Technology, the US-based semiconductor packaging and testing company, said it will close its Hakodate plant in northern Japan by...

Saturday 17 January 2026
TSMC chair confirms long-term AI demand and commitment to US expansion
At its January 15, 2026, earnings call, TSMC chairman C.C. Wei addressed questions on the authenticity of AI demand, capital expenditure plans, and US capacity expansion. Wei stated...
Saturday 17 January 2026
Packaging and testing cluster expected to emerge as TSMC Arizona GigaFab expands
During TSMC's first earnings call of 2026, CEO C.C. Wei said that key metrics at its Arizona fabs are approaching the level of advanced manufacturing in Taiwan. Rising demand from...
Friday 16 January 2026
Quanta says AI industry faced three major waves in 2025, sees strong growth over next 2-3 years
Quanta Computer held its year-end banquet on the evening of January 15, 2026, during which company chairman Barry Lam highlighted three major waves that hit 2025. He named the tariff...
Friday 16 January 2026
Quanta's Yang sees triple-digit growth in 2026, no bubble concerns

Quanta Computer Executive Vice President and Quanta Cloud Technology President Mike Yang said on January 15 that the company's AI business...