Japanese electronic components giant Kyocera reported record revenue of JPY1.08 trillion (approximately US$6.83 billion) for the first half of fiscal 2026 (April to September 2026),...
Chipmakers are moving to secure production equipment for delivery as far ahead as 2029, as AI-driven fab expansion pushes some equipment lead times beyond two years and forces manufacturers...
South Korea should tie government support for new semiconductor fabs to commitments that benefit domestic chip designers, equipment makers, and packaging suppliers, a state-funded...
Taiwan's AI and semiconductor stocks have delivered substantial gains for foreign investors, who have recently taken profits, converted the proceeds into US dollars, and repatriated...
As military conflict in the Middle East cripples global energy infrastructure, the United States is emerging as the critical anchor for the world's high-tech manufacturing sector....
Japanese robot maker FANUC raised its fiscal year 2026 revenue forecast on October 23 as demand for AI and automation strengthened, putting sales on track to surpass JPY1 trillion...
HCLTech and Japan's Rapidus have inaugurated development centers in Bengaluru and Hubli, India, expanding their semiconductor engineering collaboration across Asia. The facilities...
India's semiconductor drive has largely been led by New Delhi, which selects projects for large central incentives while state governments add their own packages of land, infrastructure...
The US Department of Commerce has signed letters of intent with four companies to provide up to US$389 million in federal research and development awards under the CHIPS and Science...
Japanese Prime Minister Sanae Takaichi will finalize a five-year plan by the end of 2026 outlining an investment blueprint for 17 strategic sectors. The plan will prioritize semiconductors...
BOS Semiconductors is partnering with LG Electronics and HANA Micron to develop and commercialize chiplet-based automotive semiconductors in South Korea, connecting domestic AI chip...
The 27th Taiwan Printed Circuit Industry International Exhibition (TPCA Show 2026) opened in Nangang on October 20, with Vice President Hsiao Bi-khim calling on the PCB industry to...
Samsung Electro-Mechanics has secured a KRW360.5 billion (US$271.8 million) long-term contract to supply package substrates for memory semiconductors, strengthening its position in...
Intel has asked the Federal Communications Commission (FCC) for a waiver to the US ban on advanced foreign robots, citing worries that its machines will not receive equipment updates,...
German equipment maker Von Ardenne is entering the semiconductor industry with coating technology aimed at panel-level packaging, a segment where the choice among competing panel dimensions...
