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Tuesday 27 October 2026
US designates helium as critical material amid Middle East supply shock
As military conflict in the Middle East cripples global energy infrastructure, the United States is emerging as the critical anchor for the world's high-tech manufacturing sector....
Tuesday 27 October 2026
FANUC raises forecast as AI, automation demand drives record revenue
Japanese robot maker FANUC raised its fiscal year 2026 revenue forecast on October 23 as demand for AI and automation strengthened, putting sales on track to surpass JPY1 trillion...
Tuesday 27 October 2026
HCLTech and Rapidus open India centers to support semiconductor engineering
HCLTech and Japan's Rapidus have inaugurated development centers in Bengaluru and Hubli, India, expanding their semiconductor engineering collaboration across Asia. The facilities...
Tuesday 27 October 2026
Tamil Nadu adds independent chip subsidy route as Indian states vie for investment
India's semiconductor drive has largely been led by New Delhi, which selects projects for large central incentives while state governments add their own packages of land, infrastructure...
Friday 23 October 2026
US signs up to US$389 million in CHIPS R&D deals for power chips and fusion
The US Department of Commerce has signed letters of intent with four companies to provide up to US$389 million in federal research and development awards under the CHIPS and Science...
Thursday 22 October 2026
Japan sets execution plan for 17 growth strategies
Japanese Prime Minister Sanae Takaichi will finalize a five-year plan by the end of 2026 outlining an investment blueprint for 17 strategic sectors. The plan will prioritize semiconductors...
Thursday 22 October 2026
BOS, LG, and HANA Micron team up on Korean automotive chiplets
BOS Semiconductors is partnering with LG Electronics and HANA Micron to develop and commercialize chiplet-based automotive semiconductors in South Korea, connecting domestic AI chip...
Wednesday 21 October 2026
Taiwan PCB output set to top NT$1 trillion as VP touts AI opportunity
The 27th Taiwan Printed Circuit Industry International Exhibition (TPCA Show 2026) opened in Nangang on October 20, with Vice President Hsiao Bi-khim calling on the PCB industry to...
Wednesday 21 October 2026
Samsung Electro-Mechanics wins KRW360.5 billion memory substrate deal as AI demand drives expansion
Samsung Electro-Mechanics has secured a KRW360.5 billion (US$271.8 million) long-term contract to supply package substrates for memory semiconductors, strengthening its position in...
Tuesday 20 October 2026
Intel requests FCC waiver from US foreign robot ban, citing impact on US chipmaking
Intel has asked the Federal Communications Commission (FCC) for a waiver to the US ban on advanced foreign robots, citing worries that its machines will not receive equipment updates,...
Monday 19 October 2026
Von Ardenne's flexible equipment targets unsettled panel-level packaging market
German equipment maker Von Ardenne is entering the semiconductor industry with coating technology aimed at panel-level packaging, a segment where the choice among competing panel dimensions...
Thursday 15 October 2026
US urges chipmakers to use domestic capacity as CHIPS Act strategy shifts from fab subsidies to securing orders
Bill Frauenhofer, executive director of semiconductor investment and innovation at the US Department of Commerce, joined Entegris CEO David Reeder for a fireside chat at SEMICON West...
Thursday 15 October 2026
Vietnam's FPT courts Toyota Tsusho unit to sell its power chips in Southeast Asia, India
Vietnamese technology group FPT is lining up a second Japanese distribution channel for its in-house power chips, a move that would carry Vietnamese-designed semiconductors beyond...
Thursday 15 October 2026
Semiconductors to consume 30% of Taiwan's power by 2035
Rising demand for semiconductor wafer fabrication, memory, advanced packaging and high-end servers is driving a sharp increase in Taiwan's power consumption. Taipower estimates that...
Wednesday 14 October 2026
AI chip competition shifts to data-center efficiency as memory, interconnect limits bite
As demand for artificial intelligence computing accelerates, the competitive focus in semiconductors is shifting beyond single-chip speed to the efficiency of entire data centers....