ASML CEO Christophe Fouquet visited South Korea to mark the opening of the company's new campus in Dongtan, Hwaseong City, Gyeonggi-do province. The facility is designed to accelerate...
The Future Innovation Tech Expo (FIX) 2025 concluded its Global Media Awards by highlighting companies that have successfully moved from concept to execution. The awards focus on...
As global semiconductor competition intensifies between the US and China, a provocative proposal emerged from Seoul's National Assembly: Taiwan and South Korea should abandon decades...
The battery industry is emerging from a downturn, shifting from losses to profits. Experts say this turnaround is not solely due to renewed electric vehicle (EV) demand but is also...
South Korean prosecutors have launched a sweeping investigation into alleged leaks of Samsung SDI's prismatic battery technology, with suspicions pointing to cooperation between South...
Samsung Electronics is seeking to increase in-house production of key robotics components, with an eye on enhancing its adaptability in the robotics market. Industry experts interpret...
The 2025 Future Innovation Tech Expo, or FIX 2025, closed late last month after drawing more than 115,000 visitors to the EXCO convention center in Daegu. The event spotlighted South...
The evolution of artificial intelligence (AI) is transforming the semiconductor industry, shifting the focus from sheer compute power to memory-centric architectures. As AI models...
South Korea's two largest memory chipmakers, SK Hynix and Samsung Electronics, are reportedly finalizing supply agreements with Nvidia for next-generation high-bandwidth memory (HBM4),...
Samsung Electronics is betting big on artificial intelligence and foldable phones. The company hopes these technologies will drive what it calls a "second peak" in its smartphone...
Edge AI startup Anaflash has unveiled a new AI microcontroller built on Samsung Electronics' 28nm foundry process. The move marks another design win for Samsung as it works to revive...
China's DRAM maker CXMT plans to start mass production of fourth-generation high-bandwidth memory (HBM3) in 2026 using mass reflow molded underfill (MR-MUF) packaging, the same technology...
Hanmi Semiconductor announced it will release a dedicated device called the "Wide TC Bonder" by the end of 2026, designed specifically for next-generation high-bandwidth memory (HBM)...
