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Thursday 4 September 2025
Intel's Dalian plant officially renamed SK Hynix amid US export controls tightening
The US Department of Commerce announced on August 29, 2025, that it will revoke the "Validated End-User" (VEU) status previously granted to Samsung Electronics and SK Hynix for their...
Thursday 4 September 2025
Commentary: TSMC's Songjiang escape highlights Korean chipmakers' China trap
The US Department of Commerce's Bureau of Industry and Security (BIS) has revoked the "Validated End-User" (VEU) status for Samsung Electronics and SK Hynix, ending a key exemption...
Wednesday 3 September 2025
Commentary: Is Jensen Huang acting as Washington's AI envoy in Seoul's political theater?
South Korea's Chosun Daily reported on September 1, 2025, that Nvidia CEO Jensen Huang is set to attend the Asia-Pacific Economic Cooperation (APEC) summit in Gyeongju in...
Wednesday 3 September 2025
South Korea's manufacturing data offers advantage in improving physical AI precision
Physical AI has become a key focus in the manufacturing and IT industries, as AI applications extend from online environments into the physical world, leading companies to begin deploying...
Wednesday 3 September 2025
GCCS poised for growth in China+1 SiC substrate market
Taiwan's GCCS has become a preferred third-party supplier for global semiconductor and EV giants amid China's SiC substrate price wars. Chairman Chung-Chieh Chang expects long-term...
Wednesday 3 September 2025
South Korean semiconductor firms look to India, led by Samsung's expanding R&D presence
South Korea's semiconductor push into India is being spearheaded by major players such as Samsung Electronics, while smaller firms have shown limited investment despite growing int...
Wednesday 3 September 2025
SK Hynix installs first high-NA EUV lithography system at Icheon fab
SK Hynix announced that it has successfully assembled the industry's first high-NA extreme ultraviolet (EUV) lithography system for mass production at its M16 fabrication plant in...
Wednesday 3 September 2025
AI assesses stroke risk through smartphone audio recordings
Artificial intelligence (AI) is rapidly transforming diagnostic and treatment methods in healthcare. Ho Chun-yung (transliterated from Korean), a neurologist at South Korea's Yonsei...
Tuesday 2 September 2025
SK Hynix strikes pay deal, lifting average worker bonus to US$78,600

SK Hynix ended a protracted labor dispute by scrapping a ceiling on worker bonuses, easing the risk of strikes after nearly three months...

Tuesday 2 September 2025
SK Hynix expected to outpace Samsung, Micron in HBM share
SK Hynix is expected to retain more than half of the global high-bandwidth memory (HBM) market through at least 2027, cementing its role as Nvidia's top supplier while broadening...
Tuesday 2 September 2025
US strips Samsung, SK Hynix of China exemptions, dealing major blow to Korean chipmakers
The US Commerce Department plans to revoke long-standing waivers that have allowed Samsung Electronics and SK Hynix to operate their Chinese chip plants using American equipment....
Tuesday 2 September 2025
Samsung and SK Hynix VEU exemption revocation opens door for Micron and Chinese chipmakers
On August 29, 2025, local time, the US Department of Commerce (DOC) announced it will revoke the Validated End-User (VEU) exemptions previously granted to South Korean manufacturers...
Tuesday 2 September 2025
Samsung reportedly restarts investment in Taylor fab; Tesla chip mass production timeline revealed
Samsung Electronics will resume its investment in the foundry plant in Taylor, Texas. The previous delays caused by customer confirmation issues have reportedly been resolved, and...
Tuesday 2 September 2025
Korean media highlight Taiwan’s hard line in TSMC leak
Taiwan's prosecutors are pursuing a 14-year prison term in a high-profile TSMC trade secrets case, underscoring how Taipei views semiconductor technology leaks as threats to national...
Tuesday 2 September 2025
Hanwha Semitech advances fluxless bonding to address HBM packaging strains
As high-bandwidth memory (HBM) moves to taller stacks with denser chip-to-chip I/O connections, thermal compression bonding (TC bonder) technology is hitting bottlenecks. Hanwha Semitech...