The government-operated Southern Taiwan Science Park (STSP) has capitalized on the global AI surge and the thriving semiconductor sector, generating a record revenue of NT$1.31 trillion...
TSMC recently acquired Innolux's 5.5G LCD fab at the Southern Taiwan Science Park (STSP) for NT$17.14 billion (US$530.8 million), which includes factory buildings and associated facilities...
The just acquired 5.5G panel fab would enable TSMC to boost its overall production capacity for CoWoS packaging to 60,000 wafers per month in 2025, with a projected increase to 70,000-80,000...
At the South Taiwan Science Park (STSP) Administration Chief handover ceremony on June 16, National Science and Technology Council Minister Cheng-wen Wu announced Taiwan's plans to...
Driven by the leading semiconductor industry, all six major industries in the Southern Taiwan Science Park (STSP) have fully recovered. From January to April 2024, the park's total...
In 2023, the government-operated Southern Taiwan Science Park (STSP) achieved its third consecutive year of revenue exceeding NT$1 trillion (US$31.8 billion).
According to Taiwan's National Science and Technology Council (NSTC), in 2023, the total combined revenue of Taiwan's government-developed science parks, which include Hsinchu Science...
Fab toolmaker Marketech International has broken ground on a new plant at the Southern Taiwan Science Park (STSP), with completion expected for 2024, according to the Taiwan-based...
TSMC has become the primary revenue backer of the Southern Taiwan Science Park (STSP), as it is for the Hsinchu Science Park (HSP), which is nearly saturated with land, according...
The Southern Taiwan Science Park (STSP) has seen record revenues driven by the semiconductor industry, with the formerly leading optoelectronics and display panel industries generating...
Government-developed science parks in Taiwan, including Hsinchu Science Park (HSP), Southern Taiwan Science Park (STSP), and Central Taiwan Science Park (CTSP), saw a combined revenue...
TSMC has stepped up its pace of orders with backend equipment suppliers, as the foundry commences its chip-on-wafer-on-substrate (CoWoS) packaging capacity expansion plan, according...
TSMC has readied plans to build new CoWoS (Chip on Wafer on Substrate) capacity at its manufacturing complex in the Central Taiwan Science Park (CTSP) to meet a rapid surge in demand...
Taiwan is continuing to expand its semiconductor clustering scale by developing more dedicated science parks, defying doubts about whether the US Chips & Science Act – aimed...
United Microelectronics Corporation (UMC) held a groundbreaking ceremony for its Circular Economy & Recycling Innovation Center on March 17. Established at UMC's Fab 12A in Tainan,...
