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    NEWS TAGGED TECHNOLOGY
    Wednesday 27 May 2026
    Taiwan's quiet fix for GPS-denied drones and satellites
    At the Plug and Play May Summit in Sunnyvale, a Taiwanese startup called Aegiverse quietly made its case to US defense and aerospace investors — not with flashy slides or moonshot...
    Wednesday 27 May 2026
    Thunder Tiger, Elan eye defense and commercial drone markets

    Thunder Tiger said on May 26 that it has signed a memorandum of understanding (MoU) with Elan Microelectronics to jointly develop AI...

    Tuesday 26 May 2026
    LED maker Ennostar pivots to optical interconnects after high-value shift agin traction
    Ennostar Holdings' transformation has begun to show clear results, with chairman Paul Peng saying the company's "3+1" strategy is taking shape, as higher-value applications now account...
    Tuesday 26 May 2026
    Nvidia and Marvell CEOs to share Computex stage— How US$2 billion turned rivals into partners
    When Nvidia quietly wrote a US$2 billion check to Marvell Technology earlier this year, it was less a financial bet than a strategic maneuver — one that converted a potential...
    Tuesday 26 May 2026
    The US$16.5 Billion Bet: How Co-Packaged Optics Will Rewire AI's Backbone by 2030
    As AI clusters continue to scale, traditional interconnect architectures are facing new limits in bandwidth, power efficiency, and system integration. Co-Packaged Optics is emerging...
    Tuesday 26 May 2026
    Samsung's reported 900-layer V-NAND prototype puts NAND race with YMTC in focus
    The race to dominate next-generation NAND flash memory has long been measured in layers — and Samsung Electronics appears to be pulling ahead. The South Korean chipmaker has...
    Tuesday 26 May 2026
    E Ink brings BMW-backed color-changing e-paper car tech to Computex 2026

    E Ink will bring its BMW-backed color-changing e-paper vehicle technology to Computex 2026, showcasing the hood structure of the BMW iX3...

    Tuesday 26 May 2026
    Intel's Rio Rancho fab becomes test case for AI-era chip packaging
    Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on advanced packaging and glass substrate technologies as it positions...
    Tuesday 26 May 2026
    Huawei eyes AI storage breakthrough with DoB packaging, 245TB SSD roadmap
    Huawei has released its Data Storage 2030 white paper, setting out a technology roadmap for the global storage industry over the next five to...
    Tuesday 26 May 2026
    Analysis: Huawei's Tau Law signals a new semiconductor framework — with implications beyond China
    As the global semiconductor industry approaches the physical limits of transistor scaling, Huawei has proposed a new framework for the post-Moore era through its recently introduced...
    Tuesday 26 May 2026
    China pushes homegrown AI stack with local chips, LLMs

    Following the conclusion of the Trump-Xi meeting and amid continued delays in China approving imports of Nvidia H20 GPUs, China's National...

    Tuesday 26 May 2026
    Micron expands US DDR4 output as AI keeps global supply tight
    As Micron Technology's decision to restart large-scale DDR4 production in the US grabs global attention, memory-chip executives and analysts say the move is less a revival of aging...
    Tuesday 26 May 2026
    Lightmatter joins TSMC on COUPE for 3D optical engines
    AI computing's massive demand for infrastructure is making interconnect and laser technologies key to overcoming power and bandwidth limits, prompting silicon photonics unicorn Lightmatter...
    Tuesday 26 May 2026
    Samsung unveils industry-first 6K Odyssey gaming monitor as China ramps panel competition
    Samsung Electronics announced a new 2026 gaming monitor lineup that includes the industry's first 6K (6,144×3,456) gaming display, positioning the company to defend high-end...
    Tuesday 26 May 2026
    SK hynix unveils 'iHBM' thermal solution to boost AI performance

    SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs) within the high-bandwidth...

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    BIZ FOCUS
    Apr 28, 08:00
    AI anti-fraud solution wins virtual asset security hackathon
    Monday 27 April 2026
    SK hynix receives 2026 IEEE Corporate Innovation Award
    Monday 27 April 2026
    Anti-fraud hackathon winner showcases multi-dimensional tech-nology framework
    Friday 24 April 2026
    NewPower Named HPE 2026 Partner of the Year
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook