CONNECT WITH US
NEWS TAGGED TECHNOLOGY
Thursday 29 October 2026
Samsung targets physical AI as Lee Jae-yong leads robotics push
Samsung Electronics Chairman Lee Jae-yong marked his fourth anniversary as chairman on October 27, 2026, by visiting a robotics research center, where he reviewed humanoid robot technology...
Thursday 29 October 2026
Samsung EUV data leak case: researcher in university partnership indicted
Samsung Electronics' next-generation semiconductor process data was allegedly removed without authorization by a university-industry research partner in South Korea, raising concerns...
Thursday 29 October 2026
Nvidia's Rubin Ultra cooling: 0.1mm microchannels vs vapor chambers
As Nvidia introduces a new generation of AI chips each year, gains in computing performance are driving increasingly demanding thermal management requirements.
Thursday 29 October 2026
AUO's microLED setback in smartwatches, comeback in Peugeot cockpit
French automaker Peugeot has unveiled the all-electric RCZ Vision concept sports car with two transparent microLED displays in the cockpit, supplied by AUO. The screens showcase a...
Thursday 29 October 2026
Intel CTO: process gap with TSMC down to a few points, but scale still lags
Technology podcast host Dwarkesh Patel recently released a special episode after spending two days touring Intel's fabs and research laboratories and speaking with several technology...
Thursday 29 October 2026
Anduril, Qualcomm team up on domestic computing to rebuild the hardware supply chain
In an effort to reduce national security vulnerabilities tied to foreign electronics supply chains, defense technology startup Anduril Industries and chipmaker Qualcomm Technologies...
Thursday 29 October 2026
ASM's earlier growth target puts supply chain execution in focus
ASM International's stronger outlook suggests that investment in advanced chipmaking is accelerating demand for its deposition equipment faster than the company had previously planned...
Thursday 29 October 2026
Lenovo previews CES 2027 lineup focused on AI agents, hybrid AI
Lenovo Group announced that its annual global innovation event, Tech World, will return to CES 2027 in Las Vegas, taking place at Sphere as part of the keynote program. The event will...
Thursday 29 October 2026
Advantech opens Tustin HQ to strengthen North American R&D
Industrial PC maker Advantech has opened its new North American headquarters in Tustin, California, expanding local R&D, manufacturing and system integration capabilities. The...
Thursday 29 October 2026
Analysis: SpaceX–Tesla merger could reshape AI industry integration, capital allocation, US-China tech rivalry
Elon Musk recently confirmed the possibility of a merger between SpaceX and Tesla, signaling an ambition to redefine competition in the AI era beyond individual products and technological...
Thursday 29 October 2026
Kinsus explores AlN ceramics beyond glass for AI advanced packaging
Kinsus Interconnect Technology is exploring aluminum nitride (AlN) ceramics as a core material for substrates used in large-scale advanced packaging, seeking an alternative to glass...
Thursday 29 October 2026
Anthropic's IPO filing highlights China AI rivalry as model distillation, chip export controls emerge as key risks
US AI startup Anthropic has formally filed for an initial public offering (IPO) with the US Securities and Exchange Commission (SEC), identifying competitive pressure from Chinese...
Wednesday 28 October 2026
Ex-TSMC CTO says Taiwan's research institutes get too much funding and train too little talent
Taiwan directs too much public research and development (R&D) funding to its national research institutes, according to Chenming Hu, a former chief technology officer of Taiwan...
Wednesday 28 October 2026
SK Hynix bets on EUV to extend 6F-squared DRAM as CXMT pushes 4F-squared
SK Hynix plans to extend the life of its existing 6F-squared DRAM cell architecture through extreme ultraviolet (EUV) lithography and process improvements, keeping 4F-squared and three-dimensional...
Wednesday 28 October 2026
Kentec targets CSP opportunities with AIDC infrastructure integration
Kentec, a subsidiary of Kenmec Group, is shifting beyond its traditional role as a contract manufacturer of components to become a systems integration provider (SIP) for complete AI...