News tagged technology at DIGITIMES

NEWS TAGGED TECHNOLOGY

Thursday 3 September 2026

TIME AI 100 spotlights China's new AI guard, from Moonshot, Z.ai to AgiBot, Manus

TIME recently unveiled its 2026 list of the 100 most influential people in AI. Alongside leaders of major technology companies, the list includes a new generation of Chinese...

Wednesday 2 September 2026

Sandisk says HBF can match HBM bandwidth with up to 16x the capacity

Sandisk says its NAND-based High Bandwidth Flash (HBF) technology can match HBM bandwidth while providing eight to 16 times the capacity at a similar cost, positioning flash memory...

Wednesday 2 September 2026

EU EV battery recycling still lacks a profitable model

The European Union is pushing to strengthen domestic second-life battery production and recycling loops, but EV battery recycling still faces a contradiction: the technology is maturing,...

Wednesday 2 September 2026

Indium CEO: packaging, cooling and power are next AI bottlenecks

As AI and high-performance computing (HPC) continue to drive semiconductor advances, industry competition is shifting beyond chip performance toward packaging, cooling, assembly, and...

Wednesday 2 September 2026

TSMC moves into Baipu Industrial Park, boosts advanced packaging

TSMC will set up operations in Kaohsiung's Baipu Industrial Park, helping create Taiwan's first advanced packaging materials and equipment supply-chain cluster. Closely watched by...

Wednesday 2 September 2026

TSMC reportedly asks suppliers to develop 5μm HBM microbumps

TSMC has asked materials and equipment suppliers to develop 5-micrometer-class microbump bonding and underfill technology for advanced HBM packaging, according to ETNews,...

Wednesday 2 September 2026

Marvell sees silicon photonics scaling from late 2027, with Taiwan and TSMC at the center

Marvell SVP and chief technology officer Radha Nagarajan offered a clearer timeline for the commercialisation of co-packaged optics, or CPO, during a media briefing at Semicon Taiwan...

Wednesday 2 September 2026

Hardware isn't the problem — TSMC exec flags software, substrate gaps in 3D IC

Speaking at the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA) Global Summit on September 1, Jun He, TSMC Vice President of Advanced Packaging Technology and Service, noted that...

Wednesday 2 September 2026

Semicon Taiwan 2026 signals a broader race for AI-era semiconductor leadership

Semicon Taiwan 2026 will draw more than 1,300 companies and 4,300 booths to Taipei from September 2 to 4, setting new records as the industry show expands beyond chipmaking into packaging,...

Wednesday 2 September 2026

UMC targets 12-inch TFLN to break 400G SiPh bottleneck

As interconnect traffic in AI hyperscale data centers climbs, optical modules are moving toward the 1.6T and 3.2T generations. United Microelectronics Corporation (UMC), Taiwan's second-largest...

Wednesday 2 September 2026

Micro LED maker PlayNitride targets Micro LED optical communications within two years

Micro LED maker PlayNitride Inc. expects the technology to enter commercial optical communications applications within two years, expanding beyond displays into AI devices, data center...

Wednesday 2 September 2026

Innolux targets advanced packaging with debut of Chip Last tech

Driven by the rapid growth of AI, high-performance computing (HPC), and automotive electronics, semiconductor architecture is shifting toward high-efficiency chiplets and heterogeneous...

Wednesday 2 September 2026

World Diamond Technology accelerates mass production of 300 mm diamond wafers

As AI, high-performance computing (HPC), and advanced packaging continue to move toward higher levels of power integration, chip power consumption is rising rapidly....

Wednesday 2 September 2026

US solar module capacity to lead by 2027, but cell and wafer shortages pose major hurdles

The US is rapidly reshaping the cost structure of its solar supply chain under Section 232 of the Trade Expansion Act of 1962. According to a recent webinar hosted by Intertek CEA,...

Wednesday 2 September 2026

8 September Hsinchu seminar: Silicon photonics driving AI chains

As AI infrastructure drives demand for higher bandwidth, lower power consumption and faster connectivity, silicon photonics is becoming increasingly important to the...

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