China-based power semiconductor provider Byinka has announced the shipment of its 7th-generation Insulated Gate Bipolar Transistor (IGBT) to leading companies across industries such...

Micron Technology has disclosed that it is currently conducting sampling of its Multiplexed Rank Dual Inline Memory Modules (MRDIMM) for memory-intensive applications, including AI...

Despite occasional warnings from institutions about a potential GenAI bubble, a new survey reveals that this emerging technology is here to stay.

MediaTek, a leader in consumer electronics and communications, is looking to establish itself as a key player in the smart car and Electric Vehicle (EV) ecosystem while deepening...

As the AI era unfolds, the demand for memory solutions that maximize performance while minimizing power consumption is growing exponentially. Samsung Electronics is reportedly developing...

Hydrogen energy, lauded for its superior thermal properties and negligible carbon emissions, is garnering attention from governments, corporations, and investors as a pivotal component...

Glass processing service provider G-Tech Optoelectronics (GTOC) has reported strong sales growth for the second quarter of 2024, driven by automotive applications.

C. C. Wei, chairman and CEO of TSMC, introduced the concept of "Foundry 2.0" and provided additional information regarding the company's advanced 2nm and A16 process technologies...

TSMC announced that revenue and margins exceeded guidance in the second quarter of 2024, and it expects revenue for the third quarter to increase 9.5% sequentially at the midpoint.

Intel is set to launch a new initiative at the 2024 Paris Olympics and Paralympics that will introduce innovative AI applications built on Intel's hardware and software into the two...

China's Electric Vehicle (EV) technology has already matched that of Western countries, and now its autonomous driving technology is also catching up.

Generative AI is currently the hottest topic in the high-tech industry. To meet the massive computational power demands brought by generative AI, our clients are exploring various...

The monthly output of 3nm chips at TSMC will climb to 125,000 wafers in the second half of this year, up from 100,000 units currently, according to industry sources. The output ramp-up...

The next generation of memory technology for High-Performance Computing (HPC) is on the horizon with the upcoming finalization of the HBM4 (High-Bandwidth Memory) specifications by...

While SK Hynix, Samsung Electronics, and Micron Technology are locked in an intense technology race for the sixth-generation High Bandwidth Memory (HBM), HBM4, foundry giant TSMC...