Leading IC packaging and testing company, ASE, has been consistently highlighting silicon photonics (SiPh) as a future trend since the latter half of 2023. CEO Dr. Tien Wu stated...

Chunghwa Precision Test Tech (CHPT), a leading provider of chip testing and wafer probing solutions, expects significant growth in revenue and gross margin in the second half of 2024...

Since carriers adopted 5G, the technology has not stopped evolving. For example, the 5G Advanced Network Solutions and the research and development of radio frequency (RF) and baseband...

Electronic component distributor Macnica Anstek reported steady orders for automated testing in the second half of 2024, benefiting from strong CoWoS demand. The company expects its...

YTEC, a Taiwan-based technology company, has strategically pivoted its business focus in response to changing market dynamics. Facing a decline in demand for optoelectronic LEDs,...

In recent years, advanced packaging has become increasingly crucial in high-performance computing, and Chinese OSAT companies, particularly Tongfu Microelectronics, are determined...

JCET, a leading Chinese semiconductor packaging and testing services provider, has announced impressive financial performance for the first half of 2024. The company reported a significant...

Taiwan's lead frame manufacturers are showing signs of recovery, with a strategic focus on high-margin industries such as automotive electronics and high-end servers to boost profitability...

SEMICON Taiwan 2024, is set to take place on September 4, with over 200 industry leaders from the global high-tech and semiconductor sectors expected to attend.

Amid concerns in the AI server supply chain regarding Nvidia's delayed GB200 shipments, Lite-On Technology reports that its clients are continuing product testing, and shipments can...

Whether AI-powered smartphones will trigger a new wave of device upgrades has garnered significant attention across various sectors. Taiwan's wireless communication testing specialist,...

Packaging firm Xintec Technology is optimistic about upcoming demand for 3D sensing components packaging and 12-inch wafer testing in the third quarter, the traditional peak season...

LED equipment manufacturer FitTech is gearing up to begin contract production of CoWoS advanced packaging equipment in the fourth quarter of 2024.

Foxconn held an earnings call on August 14, where it discussed the progress of its 3+3 development strategy.

Backend house ChipMOS Technologies expects its capex-to-revenue ratio to rise from 15% to 20% in 2024, with increased investment in upgrading memory testing capabilities and adding...