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Tuesday 20 October 2026
Micro LED optical interconnect targets AI racks amid unsettled standards
Surging demand for optical interconnects in AI computing centers is pushing Micro LED technology into short-reach optical transmission inside data center racks. Differing views on...
Tuesday 20 October 2026
Malaysia says data center investors must fund transmission upgrades
Malaysia wants data center investors to bear the cost of transmission upgrades required by their projects, tying investment decisions more closely to local grid readiness. New applications...
Tuesday 20 October 2026
TiMotion targets robot market as Vietnam plant is set to open by year-end
Transmission systems integrator TiMotion Technology plans to begin trading on Taiwan's Emerging Stock Board on October 21 as it marks its 20th anniversary, with the company targeting...
Friday 16 October 2026
Nvidia unveils PTFE switch board at OCP, names Taiwan partners
Nvidia showcased the latest developments in its MGX server platform ecosystem at the OCP Global Summit 2026, unveiling for the first time a switch board sample using polytetrafluoroethylene...
Thursday 15 October 2026
Touch Taiwan 2027 expands tech scope with advanced packaging and SiPh shows
Touch Taiwan 2027 will take place on April 21–23, 2027, and will expand its scope with two dedicated co-located shows: the Advanced Packaging & Testing Expo and the Silicon...
Wednesday 14 October 2026
Largan chairman casts doubt on Micro LED links for AI data centers
Largan Precision chairman En-ping Lin has questioned the viability of Micro LED-based optical links for AI data centers, citing concerns over power consumption, size, and transmission...
Wednesday 14 October 2026
Cisco, Nvidia target high-speed optical interconnects with 4x USFP density
Cisco and Nvidia announced at the 2026 OCP Global Summit that they are jointly developing an ultra-dense small form factor pluggable (USFP) optical module designed to support 400Gb/s...
Wednesday 14 October 2026
China's AI chipmakers target 3D packaging, optical interconnects and software ecosystems
China's domestic AI chipmakers are shifting their competitive focus from individual GPU performance to system-level integration as AI models grow increasingly complex. Three priorities—3D...
Monday 12 October 2026
Sigurd, Winstek align optical testing push as AI demand shifts toward connectivity
Optical communications is becoming a key global bottleneck as AI workloads expand, and Sigurd is positioning itself to benefit. The IC test and packaging company said demand is rising...
Monday 12 October 2026
MAtek September 2026 revenue hits record for 7th straight month
MAtek, a leading semiconductor testing company, reported September 2026 revenue of NT$569 million (approx. US$17.8 million), up 12.31% year-over-year. Revenue for the first nine months...
Thursday 8 October 2026
China pushes six-network buildout as AI strains power links
China is accelerating construction of its so-called "six networks" — water, a new power grid, computing, next-generation communications, urban underground pipelines, and logistics...
Thursday 8 October 2026
MediaTek's US push will shape its AI networking race
In recent years, MediaTek has continued to chase opportunities in AI networking infrastructure. Beyond its established strength in wireless, it has also expanded wired collaboration...
Tuesday 6 October 2026
Taiwan bets on SiPh, CPO to tackle AI data center power bottlenecks
Taiwan's National Science and Technology Council (NSTC) has launched two research programs targeting silicon photonics (SiPh) and next-generation AI data center power systems, seeking...
Tuesday 6 October 2026
Can satellites share power?— Star Catcher puts an orbital grid to the test
As in-orbit AI computing, Earth observation, and defense missions expand rapidly, satellites are demanding more power, turning energy supply into an emerging challenge for the growing...
Monday 5 October 2026
DIGITIMES Insight: AI data demand surges as power and cooling become new bottlenecks
As the number of AI computing transistors integrated within a single CoWoS package rises rapidly, DIGITIMES observes that moving massive volumes of data to compute chips fast...