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Monday 20 July 2026
Oracle's New Mexico data center reportedly hits cost overruns

Oracle's US$165 billion data center project in New Mexico is running into higher-than-expected costs due to local concerns about its...

Monday 20 July 2026
Tai-Saw leverages frequency-component portfolio to expand into optical communications, LEO satellites and drones

As frequency-control components move toward higher frequencies and smaller form factors, Tai-Saw Technology is leveraging synergies...

Friday 17 July 2026
South Korean suppliers ramp up hybrid bonding R&D beyond HBM5
As high-bandwidth memory (HBM) stacks add more layers, requirements for chip-to-chip bonding accuracy and signal transmission efficiency are becoming more demanding.
Tuesday 14 July 2026
Commentary: Huawei builds NPO alliance to shape CPO-era optical interconnect standards

The AI race is expanding from computing power to data transmission, making optical interconnects a critical battleground for next-generation...

Monday 13 July 2026
Taiwan's auto parts makers pivot to high-tech as AI cooling, chip equipment demand surges

Taiwan's automotive parts makers are accelerating their transformation into high-tech suppliers as the global expansion of advanced...

Friday 10 July 2026
JPC Connectivity June revenue hits a new high on AI data center demand
AI data centers and faster interconnects are lifting demand for JPC Connectivity, with the cable and connector maker posting record June revenue and stronger quarterly results. The...
Thursday 9 July 2026
HIWIN and Hiwin Mikrosystem post record June sales on semiconductor and robotics demand
HIWIN and its subsidiary Hiwin Mikrosystem posted record June 2026 revenue as demand from semiconductors, industrial automation and robotics stayed strong. The Taiwan-based motion...
Thursday 9 July 2026
Apple's Broadcom deal extension shows wireless independence remains a distant dream

Apple's decision to extend its wireless transmission and RF chip supply agreement with Broadcom through 2031 signals that its shift...

Thursday 9 July 2026
Analysis: AI data centers face mounting power hurdles as Taiwan grid strain deepens

Taiwan's AI data center push is exposing a wider global problem: artificial intelligence needs vast, reliable power, but grids, permits,...

Tuesday 7 July 2026
Exclusive: Geckos bets on AI materials beyond nano copper powders and CPO waveguides
As generative AI drives rapid growth in high-performance computing (HPC) demand, the semiconductor industry is shifting from process-node competition to materials competition. Geckos...
Friday 3 July 2026
Competing Paths in Data Center Optics: XPO Could Beat CPO to Mass Production in 2027
DIGITIMES notes that Arista Networks unveiled XPO at The Optical Fiber Communication Conference and Exhibition 2026 (OFC 2026). Unlike CPO, which is associated with more disruptive...
Wednesday 1 July 2026
China's price war cuts humanoid robot hand costs in half — but precision parts resist

Competition in China's humanoid robot market is driving down prices for dexterous hands and other key parts, with implications for...

Monday 29 June 2026
Johor's power grid faces mounting strain as data centre pipeline expands
Malaysia's southern state of Johor could see data centers account for about 40% of its electricity demand by 2035, highlighting mounting pressure on power infrastructure as the region...
Thursday 25 June 2026
IntelliEPI targets record 2026 revenue amid InP substrate shortages
Compound semiconductor epitaxial wafer maker IntelliEPI said AI-driven high-speed transmission demand continues to lift the indium phosphide (InP) market, and it expects revenue to...
Thursday 25 June 2026
MediaTek, Google reportedly deepen ASIC ties as SerDes race hits 448G
MediaTek is reportedly strengthening its partnership with Google in ASICs, a move that could increase the scale of future orders and carry implications for AI infrastructure worldwide...