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Friday 21 August 2026
TXC pivots to AI infrastructure as 1.6T optical modules surge
Quartz component leader TXC is targeting AI and automotive applications as demand grows for faster data transmission, with 1.6T optical modules expected to see explosive growth in...
Friday 21 August 2026
Column: Is 800V really 'high voltage'? —AI data centers revive an old power debate
High-voltage direct current (HVDC) is currently one of the hottest areas of technology and product development for AI data centers. It is not only the first layer of what Nvidia CEO...
Thursday 20 August 2026
High-end PCB supply tightens as CCL expansions face delays
As AI applications demand faster data transmission from PCBs, M8 and higher-grade copper-clad laminate (CCL) materials are becoming increasingly mainstream in server boards. The shift...
Thursday 20 August 2026
Rising demand for CPO, SiPh reshapes semiconductor testing
As chip power consumption, transmission speed and architectural complexity increase, testing has shifted from being a final pre-shipment quality gate to an earlier stage in product...
Wednesday 19 August 2026
TBI Motion books orders into 2027, steps deeper into humanoid robotics

TBI Motion Technology returned to profit in the second quarter of 2026, with strong demand extending order visibility into 2027. The...

Monday 17 August 2026
Lightmatter sets optical interconnect blueprint as AI hits copper wall

AI data centers are approaching a physical limit: as scale-up architectures stretch across multiple racks and SerDes speeds near 448G,...

Thursday 13 August 2026
GaAs gains ground in short-reach AI optics as InP constraints mount
As AI workloads push data center interconnects from 800G toward 1.6T, indium phosphide (InP) has become a critical material for high-speed optical links, particularly for longer-distance...
Thursday 13 August 2026
Lightmatter white paper targets fragmented supply chain, barriers to photonic interconnect deployment
Bijan Nowroozi, Head of Ecosystem Development at Lightmatter, announced at the OCP APAC Summit 2026 that the company has released an infrastructure white paper aimed at building a...
Wednesday 12 August 2026
OCP APAC 2026: Cloud AI's growth hits a new bottleneck— networking, not compute

At the 2026 OCP APAC Summit, debate over networking architectures in cloud AI data centers sharpened as industry players said the main...

Tuesday 11 August 2026
TSMC affiliate VisEra scales AI optics with 1.6T silicon photonics
VisEra, the TSMC-affiliated optical components supplier, is expanding into AI optical interconnects and silicon photonics, with its MicroLens products for 800G pluggable transceivers...
Thursday 6 August 2026
Dark fiber essential for next-gen distributed AI centers

All-photonic networks (APN) are emerging as critical infrastructure for 6G, AI computing and smart cities. Nvidia's plan to expand...

Wednesday 5 August 2026
Airoha optical comms revenue doubles as broadband lands CSPs
Airoha sees faster growth ahead as AI infrastructure, optical networking, and wireless edge products expand across global supply chains. The chip designer said its 2026 product mix...
Tuesday 4 August 2026
MediaTek sees SerDes 448G as copper's final battleground
The question of where the limits of cloud AI high-speed interconnects will fall has been a major market focus over the past six months. MediaTek addressed the issue for the first time...
Monday 3 August 2026
AI infrastructure orders extend PCB expansion race
Global demand for AI infrastructure is rising, and as order visibility improves, the PCB supply chain has launched a marathon of factory expansion. Upstream copper-clad laminate (CCL)...