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Monday 29 June 2026
Johor's power grid faces mounting strain as data centre pipeline expands
Malaysia's southern state of Johor could see data centers account for about 40% of its electricity demand by 2035, highlighting mounting pressure on power infrastructure as the region...
Thursday 25 June 2026
IntelliEPI targets record 2026 revenue amid InP substrate shortages
Compound semiconductor epitaxial wafer maker IntelliEPI said AI-driven high-speed transmission demand continues to lift the indium phosphide (InP) market, and it expects revenue to...
Thursday 25 June 2026
MediaTek, Google reportedly deepen ASIC ties as SerDes race hits 448G
MediaTek is reportedly strengthening its partnership with Google in ASICs, a move that could increase the scale of future orders and carry implications for AI infrastructure worldwide...
Wednesday 24 June 2026
Syncomm accelerates AIoT push on wireless audio strength
Syncomm Technology has built solid momentum in wireless audio transmission chips and modules and is now accelerating its shift into AIoT applications across energy monitoring, elder...
Tuesday 23 June 2026
Wafer Works unveils golden triangle expansion to boost AI, optical, and SiC wafer capacity
Wafer Works announced after its June 18, 2026, shareholders meeting that it launched a "golden triangle" expansion plan to deepen silicon wafer product lines and support fast-growing...
Monday 22 June 2026
ASMedia launches second transformation plan, targets revenue doubling, AI server market expansion
High-speed transmission IC design company ASMedia Technology held its annual shareholders meeting on June 17, completing a full board reshuffle. ASMedia president Che-Wei Lin stated...
Thursday 18 June 2026
SiC cuts AI data center costs; 5% efficiency gain saves US$5 billion
Power is now compute, and it is becoming a major driver of AI data center build costs. Renesas technical director Mu-Sen Lin said traditional data centers rely on low-voltage AC (LVAC),...
Thursday 18 June 2026
Mirle Automation names CEO as chair

Mirle Automation announced that chairman Houng Sun will step down and hand the role to chief executive officer Shih-Tung Lin, as the...

Thursday 18 June 2026
Interview: MicroLED and SiPh eye 3.2T AI data race
The AI wave is rapidly reshaping the global semiconductor supply chain, and that upheaval is opening a new growth chapter for Taiwan's LED industry. As Taiwan's LED makers move away...
Tuesday 16 June 2026
Supply security over cost: Google leads CSP charge to diversify InP substrate sourcing

China has recently eased controls on some indium phosphide (InP) substrates, relieving a bottleneck in optical communications capacity...

Sunday 7 June 2026
AI cooling lifts heat spreader shipments at Niching
AI-driven high-speed computing and data transmission are driving up chip performance and cooling requirements worldwide, and Niching Industrial Corp. said its acquisition of Ming June...
Friday 5 June 2026
Hiwin targets logistics automation with Dexterity dual-arm robot
Motion control component maker Hiwin made its first cross-sector appearance at COMPUTEX 2026, showcasing a full technology stack spanning precision transmission, actuator modules,...
Thursday 4 June 2026
Commentary: Wired or wireless, connectivity steals the spotlight at Computex 2026
Computex 2026 was again dominated by the latest computing chips, with Nvidia's RTX Spark drawing heavy attention and debate. Yet another theme is moving closer to the centre of the...
Thursday 4 June 2026
Huawei's Tau Law shifts AI chip race to glass substrates, advanced packaging
Huawei's recently proposed "Tau Law" suggests that reducing signal transmission distance, combined with heterogeneous integration and system-level optimisation, can enhance computing...
Tuesday 2 June 2026
Twoway Group sees three years of growth from North America DOCSIS 4.0 upgrade cycle
Twoway Group held its shareholders meeting on June 1, during which shareholders approved the company's 2025 financial statements and profit distribution plan.