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Tuesday 10 November 2026
KHGEARS posts record October revenue as new product shipments continue
Precision gearmaker KHGEARS International reported October 2026 consolidated revenue of NT$283 million (US$8.62 million), up 19.08% year on year and a monthly record. Revenue for the...
Tuesday 10 November 2026
Intel targets silicon photonics, in-memory computing beyond GPUs
As the global semiconductor industry continues to focus on Nvidia, Intel is looking beyond GPUs to determine where next-generation computing architectures will go. In an interview...
Tuesday 10 November 2026
ePaper manufacturer E Ink to buy manufacturing plant in Taiwan for NT$2.78 billion, teams with Taiflex on AI materials
E Ink Holdings' board on November 6 approved buying land and factory buildings in Taoyuan's Guanyin Industrial Park from Chung Hwa Pulp for NT$2.78 billion (US$84.63 million) before...
Monday 9 November 2026
Robots spur transmission makers to target customized niches
Taiwan's machinery industry has gained strong momentum in recent years, with robust demand for semiconductors, AI applications, industrial automation and smart manufacturing driving...
Thursday 5 November 2026
oToBrite and Yuan build robot vision chain for Nvidia platform
As the Physical Intelligence and autonomous vehicle markets heat up, oToBrite is partnering with Yuan High-Tech Development to integrate its 3D binocular stereo vision camera module...
Wednesday 4 November 2026
High-speed optical communications drive demand for mSAP competition among Taiwan PCB makers
As AI computing clusters continue to expand, data centers are demanding higher transmission speeds and greater bandwidth. To overcome the manufacturing bottlenecks of traditional high-density...
Tuesday 3 November 2026
Sumitomo Electric raises InP substrate capacity target to 4.5 times 2024 levels by FY2029
Surging demand for optical communications driven by AI and data center expansion has prompted Japan's Sumitomo Electric Industries to accelerate production capacity expansion for indium...
Monday 2 November 2026
Exclusive: Metal adhesion poses challenge for aluminum nitride in AI optics
As AI and large-scale data center buildouts drive up data transmission speeds, heat is becoming increasingly concentrated in key components. This has drawn attention to ceramic substrates...
Saturday 31 October 2026
AUO targets major revenue contribution from optical engines, glass core substrates within 2 to 3 years
AUO is accelerating its strategic push into optical communications and advanced semiconductor packaging, establishing optical engines and glass core substrates (GCS) as its two primary...
Thursday 29 October 2026
LandMark orders surpass 2026 revenue; capacity to expand sixfold
AI is driving strong demand for silicon photonics, but LandMark Optoelectronics' planned sixfold capacity expansion over two years still falls short of customer requirements. The optical...
Thursday 29 October 2026
DIGITIMES Insight: Kinsus Tech identifies three challenges for larger AI chip packages
Surging demand for AI computing is driving advanced packaging toward larger form factors, according to Ting-Hao Lin, R&D vice president at Kinsus Interconnect Technology, speaking...
Tuesday 27 October 2026
Ennostar's optical push could add new growth engine for 2027 and onward
Ennostar Holdings is expanding into optical communications as Micro LED and Micro VCSEL products move into customer sample-validation stages. The company expects the business to enter...
Tuesday 27 October 2026
DIGITIMES Insights: AI servers move toward 800V DC as vertical power delivery promises higher efficiency, lower transmission losses
AI server power architectures are evolving toward high-voltage distribution and point-of-load voltage conversion, according to DIGITIMES Intelligence.
Thursday 22 October 2026
Khgears targets humanoid robot joints, eyes 2027 mass production
Precision gearmaker Khgears International is expanding into humanoid robot joint components and expects its newly developed differential reducer to enter mass production in 2027. The...
Thursday 22 October 2026
High-end ASIC demand drives TGV adoption as TPK weighs further Taiwan expansion
As advanced packaging technology evolves, traditional copper-clad laminates (CCL) are increasingly running up against signal transmission and thickness limitations. Through-glass via...