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Monday 19 October 2026
Terafab exposes Tesla's growing tensions with Samsung and TSMC
Tesla's dealings with Samsung and Taiwan Semiconductor Manufacturing Co. (TSMC) are highlighting tensions between chip designers and foundries as demand for AI processors accelerates...
Monday 19 October 2026
SK Hynix advances chip inspection technology as 3D memory pushes conventional metrology to its limits
SK Hynix is strengthening its metrology and inspection (MI) capabilities as the transition toward 3D DRAM architectures and increasingly complex NAND stacking creates new challenges...
Monday 19 October 2026
Taiwan plans 25 gas-fired units to secure power for 10 years
Taiwan's Ministry of Economic Affairs plans to add 25 gas-fired power units with a combined capacity of 26GW to meet rising electricity demand from the semiconductor industry and AI...
Monday 19 October 2026
Hanmi targets 2027 Wide TC Bonder launch, expands 2.5D AI chip packaging lineup
South Korean semiconductor equipment maker Hanmi Semiconductor showcased its high-bandwidth memory (HBM) and AI chip packaging equipment at SEDEX 2026, including the TC Bonder 4 for...
Monday 19 October 2026
AUO expands AI businesses as it seeks its next growth curve
AUO is expanding its push into AI-related businesses, including augmented reality (AR) glasses, low-Earth-orbit (LEO) satellite antennas, optical communications, and advanced semiconductor...
Monday 19 October 2026
TSMC's only South Korean VCA partner ASICLAND eyes AI chip growth via Taiwan R&D
South Korean ASIC design solutions provider ASICLAND showcased its proprietary AxHub AI chip design and verification platform at SEDEX 2026 as it seeks to accelerate custom chip development...
Monday 19 October 2026
US defense startups turn to Taiwan for local production partnerships
US defense companies are increasingly setting up partnerships in Taiwan, moving beyond component procurement to joint development, system integration, local manufacturing, maintenance...
Monday 19 October 2026
EU eyes AI defense as it tests China's open-weight models
The European Union is strengthening its response to cybersecurity risks posed by artificial intelligence, planning to use automated measures to accelerate incident response while testing...
Monday 19 October 2026
Chenming Hu urges universities to 'find the solutions', targets world-class Taiwan semiconductor sector
Academia Sinica academician Chenming Hu has published an autobiography titled Find the Solutions, taken from the words on a crystal plaque presented to him by then TSMC chairman...
Monday 19 October 2026
Weekly news roundup: Tata's Dholera fab faces test; how Intel's CEO helped reshape its comeback
This week's coverage (October 12 to October 18, 2026) highlights semiconductor capacity, AI infrastructure, and the commercialization challenges behind ambitious technology strategies...
Monday 19 October 2026
Space solar outsourcing heats up as Taiwan targets non-SpaceX players
As advances in aerospace technology lower the barriers to launching and building low-Earth orbit (LEO) satellites, emerging satellite operators worldwide are driving demand for outsourced...
Monday 19 October 2026
South Korea's TelePIX wins global satellite contracts, targets 2027 launch of AI-powered optical payload
South Korean space AI solutions provider TelePIX is accelerating the development of high-resolution optical payloads and onboard AI technologies, with plans to launch its next-generation...
Monday 19 October 2026
Taiwan seeks international quantum collaboration in critical 5-year push
Taiwan's National Science and Technology Council (NSTC) has opened applications for the country's second five-year quantum technology program lasting from 2027 to 2031, with international...
Monday 19 October 2026
Breaking free from keyword constraints: How GeoGraph elevates job matching

Generative AI is rapidly transforming modern work environments and recruitment practices. Traditional search frameworks built solely around job titles, categories, and...

Saturday 17 October 2026
TSMC's 3nm Kumamoto plan wins Japan's approval, qualifying for up to US$4.1 billion in aid
On October 16, Japan's Ministry of Economy, Trade and Industry (METI) approved a revised plan from Taiwan Semiconductor Manufacturing Co. (TSMC) to build 3nm logic chips at its second...