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Friday 16 October 2026
Manus returns to China's AI agent race with US$500 million reset
As Manus, one of China's more distinctive AI startups, became entangled in the high-profile unwinding of its acquisition by Meta, the startup's failed attempt to capture opportunities...
Friday 16 October 2026
China's YMTC targets 9,600 MT/s with 4F² DRAM design
China's Yangtze Memory Technologies (YMTC) is developing a next-generation 4F² DRAM design targeting data transfer speeds of 9,600 megatransfers per second (MT/s), expanding beyond...
Friday 16 October 2026
LG Innotek eyes 2027 chip substrate growth as Big Tech supply talks continue
South Korea's LG Innotek expects its semiconductor substrate business to improve in 2027 as it pursues long-term supply agreements (LTAs) with major technology companies and prepares...
Friday 16 October 2026
LINE Taiwan pushes AI services as it marks 15 years and deepens anti-fraud role
LINE Taiwan marked its 15th year in the market with a strategy shift that signals broader ambitions beyond messaging. The company is expanding into AI-powered daily services, aiming...
Friday 16 October 2026
Qualcomm advances complete AI infrastructure platform as agentic AI reshapes competition
Qualcomm has historically provided standard chips primarily through its Snapdragon product line, serving a broad range of end customers. After officially launching its Dragonfly data...
Thursday 15 October 2026
FIC Group opens Malaysia plant as optical module capacity targets 18 SMT lines
FIC Group opened its PRO3C (Malaysia) Sdn. Bhd. manufacturing facility in Johor, Malaysia, on October 15, expanding its optical communications production footprint in Southeast Asia...
Thursday 15 October 2026
SK Hynix reportedly ties US NAND fab plan to approval for chip equipment exports to China
SK Hynix is seeking US approval to ship additional American chipmaking equipment to its NAND flash facility in Dalian, China, linking the request to a potential investment in a new...
Thursday 15 October 2026
China's AMEC targets 60% of high-end chip equipment market with US$1.94 billion R&D plan
Chinese semiconductor equipment maker AMEC plans to develop 102 new equipment models over the next three to five years, backed by nearly CNY13 billion (≈ US$1.94 billion) in...
Thursday 15 October 2026
Samsung reportedly completes 4F² DRAM development as China's CXMT targets year-end launch
Samsung Electronics has reportedly completed development of next-generation 4F² DRAM technology and is aligning commercialization with customer requirements, even as China's ChangXin...
Thursday 15 October 2026
TSMC's AI-fuelled profit streak hits sixth straight record in 3Q26, but 2nm expansion weighs on margins
On October 15, 2026, TSMC reported its sixth consecutive quarter of record net profit, with third-quarter earnings rising 68.7% year-over-year to NT$763.06 billion (approx. US$23.6...
Thursday 15 October 2026
Commentary: Huawei's 2027 Kirin roadmap — can LogicFolding overcome chipmaking constraints?
On October 13, Huawei unveiled the detailed architecture of its Kirin 9050 Pro chip for the first time at its Lianqiu Lake research center in Shanghai, outlining advances in LogicFolding...
Thursday 15 October 2026
Column: 3D memory could redraw chip competition, weaken US sanctions on China
In October 2022, the US Bureau of Industry and Security (BIS) imposed a package of export restrictions on China, including controls on equipment and components for manufacturing 3D...
Thursday 15 October 2026
Analysis: Apple HomeView faces hurdles in smart-home adoption
Apple launched the HomeView smart display at its "Welcome Home" event on October 13, priced at US$299. It's scheduled to debut in eight countries: the US, the UK, Canada, Australia,...
Thursday 15 October 2026
Analysis: GlobalFoundries' calculus behind US$2 billion entry into TSMC's CoWoS ecosystem
GlobalFoundries (GF) has reached a multiyear manufacturing agreement with TSMC to expand silicon interposer capacity at its Malta fab in New York, supplying TSMC's Chip-on-Wafer-on-Substrate...
Thursday 15 October 2026
Taiwan Perovskite Solar Corp. deploys AI to optimize R&D, explore smart energy applications
Taiwan Perovskite Solar Corp. (TPSC) showcased its theme, "PEROVSKITE AI," at Energy Taiwan 2026, highlighting a two-way synergy between artificial intelligence and perovskite technology...