Global supply chain: China market

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Saturday 11 July 2026

SunplusIT clears Intel and AMD eUSB hurdle, starts thermal imaging shipments ahead of July listing

Sunplus Innovation Technology (SunplusIT) said on July 9, 2026, that it is preparing to become a listed company in mid-July 2026 and outlined its view on market conditions in the second...

Saturday 11 July 2026

China's display makers raise billions to close the OLED gap — and South Korea is watching

Chinese display panel and materials companies are tapping capital markets to fund next-generation OLED, oxide and Mini LED technologies, drawing close attention from South Korea's...

Saturday 11 July 2026

Amtran posts 13% 1H26 revenue growth citing product mix shift

Amtran Technology reported a June 2026 consolidated revenue of NT$2.5 billion (US$78.0 million), up 23% from a year earlier, as the Taiwanese display and peripherals maker said its...

Saturday 11 July 2026

Mobilint touts NPU for physical AI, with CEO urging South Korea to accelerate development

South Korean AI semiconductor startup Mobilint is gaining traction in physical AI with its neural processing units (NPU) for edge devices, as the AI boom spreads from cloud computing...

Friday 10 July 2026

China's temporary helium export ban signals fears of a prolonged Middle East supply squeeze

China moved on July 10 to wall off its domestic supply of helium, a gas with no substitute in chipmaking and medical imaging, in a step that suggests Beijing does not expect Middle...

Friday 10 July 2026

Largan samples CPO product in July 2026, eyes GC edge

Largan said on July 9, 2026, that it will formally begin sampling fiber array (FA) products for a mass-production customer in July, while chairman En-Ping Lin outlined the company's...

Friday 10 July 2026

Samsung plans new PC chip in push beyond smartphones

Samsung Electronics is developing a new chip for personal computers (PCs) as its System LSI business seeks growth beyond smartphone processors, according to ET News and the...

Friday 10 July 2026

Smartphone financing set to cover 42% of India sales in 2026

India's smartphone buyers are increasingly turning to financing, a shift that could shape device sales patterns in other price-sensitive...

Friday 10 July 2026

Insight: TSMC's 2nm lead widens, Intel 14A slips beyond 2030, Samsung 4nm fills on HBM4 demand

Samsung Electronics' preliminary earnings have shaken financial markets. Drawing on a report from a US brokerage, DIGITIMES Intelligence...

Friday 10 July 2026

Asus June revenue tops NT$100 billion as AI servers drive growth outlook

Asus reported June 2026 group revenue of NT$106.72 billion (US$3.3 billion), crossing the NT$100 billion threshold for the first time, as strong demand for AI servers continued to...

Friday 10 July 2026

TSMC CoWoS output reportedly to reach at least 200K wafers in 2027

TSMC is accelerating advanced packaging capacity expansion as supply remains tight, with market chatter indicating its CoWoS monthly...

Friday 10 July 2026

JCET sets US$1.4bn capex for AI packaging expansion as China orders stay strong

JCET plans to invest about CNY10 billion (approx. US$1.4 billion) in fixed assets in 2026, sharply increasing spending on AI-driven advanced packaging, automotive electronics and selected...

Friday 10 July 2026

Meta bets on price to crack AI model market, testing whether frontier intelligence stays premium good

Meta Platforms' decision to start charging developers for its most advanced AI model is less a product launch than a wager on where the economics of artificial intelligence (AI) are...

Friday 10 July 2026

Apple drives 70% surge in edge AI smartwatch sales as health features gain traction

Shipments of smartwatches with edge AI features leaped 70% in the first quarter of 2026, with Apple overwhelmingly leading the charge,...

Friday 10 July 2026

Huawei joins China Mobile, Baidu to build China's first NPO optical interconnect standard

Huawei has joined more than 20 Chinese technology companies and research bodies to launch OPEN NPO, the country's first multi-source agreement...

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