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Wednesday 2 June 2021
Korea firms to increase capex for 5G infrastructure in 2021-2022, says Digtimes Research
The amounts of capex set by Korea's top-three telecom operators, SK Telecom (SKT), Korea Telecom (KT) and LG U+, in 2021 and 2022, respectively, will be higher than those seen in...
Wednesday 2 June 2021
AiP, 3D IC packaging increasingly adopted for 5G mmWave, HPC chips
With more mmWave-capable and HPC chip designs being developed, AiP, 3D stacking and other advanced packaging technologies will be increasingly needed for commercial applications,...
Wednesday 2 June 2021
Over 50% of next-gen iPhones to support 5G mmWave technology
More than 50% of Apple's next-generation iPhone devices slated for launch in the latter half of 2021 reportedly will support 5G mmWave technology, according to industry sources.
Monday 31 May 2021
Intel announces new CPUs and 5G module at Computex 2021
Intel has announced two new additions to the lineup of 11th Gen Intel Core processors and introduced its first 5G product for the next generation of PC experiences, Intel 5G Solution...
Friday 28 May 2021
Acer intros new Chromebook, notebook series for WFH users
Acer has introduced a new lineup of Chromebooks, gaming and ultra-thin notebooks targeted at users working and learning from home.
Friday 28 May 2021
ABF substrate suppliers see clear order visibility through 2023
Taiwan ABF substrate makers have been running their production lines at full capacity, with new orders unlikely to be fulfilled until 2023, according to industry sources.
Friday 28 May 2021
Android camp slow in adopting mmWave
Chinese vendors have yet to release mmWave 5G models and corresponding infrastructure construction in China remains slow, according to industry sources.
Wednesday 26 May 2021
Global 200mm fab capacity to grow at record pace, says SEMI
Semiconductor manufacturers worldwide are on track to boost 200mm fab capacity by 950,000 wafers, or 17%, from 2020 through 2024 to reach a record high of 6.6 million wafers per month,...
Tuesday 25 May 2021
ASE promotes embedded die packaging for automotive electronics
Backend house ASE Technology will have its in-house developed embedded die technology, dubbed "Advanced Embedded Active System Integration (aEASI)," mainly applied to processing automotive...
Tuesday 25 May 2021
Taiwan testing houses gearing up for AiP, 3nm chips
Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all kicked off R&D for more advanced 3nm-made chips, while also...
Tuesday 25 May 2021
Pure-play foundries expanding capacity with prepayments from clients
TSMC and other Taiwan-based pure-play foundries intend to carry out their capacity expansion projects cautiously and progressively to avoid the risk of overcapacity.
Monday 24 May 2021
Solidworks expects surging sales from cloud computing business in 2021
Solidworks, a developer of 3D engineering CAD software under Dassault Systemes, expects its sales from cloud computing-related businesses in 2021 to surge 6- to 7-fold from a year...
Monday 24 May 2021
CCL makers on track for capacity expansions
Taiwan's CCL makers Iteq and Elite Material (EMC) are gearing up to build additional capacity as demand from clients has outstripped their maximum capacity supply since the start...
Monday 24 May 2021
China well positioned to emerge as key player in IoT, says GlobalData
To counter the geopolitical challenge and reduce its dependence on the US, China is accelerating investment in next-generation enabling technologies. Against this backdrop, the country...
Friday 21 May 2021
5G growing rapidly despite component shortages, says Strategy Analytics
Radio component revenue reached an all-time high in 2020, according to Strategy Analytics, which expects revenue to grow through 2025.