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Tuesday 20 October 2020
Chipbond, OSE form alliance for flash, 5G RF modules packaging
Display driver IC backend specialist Chipbond Technology and memory modules backend and EMS service provider Orient Semiconductor Electronics (OSE) have formed a long-term strategic...
Tuesday 20 October 2020
Equipment makers optimistic about demand from passive component sector
Equipment suppliers are optimistic about demand coming from the passive component sector, where leading players including Yageo and Walsin Technology have plans for capacity expans...
Tuesday 20 October 2020
China 5G phone shipments to top 150 million units in 2020
Sales of 5G phones in China, already in full swing, are expected to gain a further boost in fourth-quarter 2020 thanks to higher than expected pre-orders for iPhone 12 lineup received...
Tuesday 20 October 2020
Taiwan IC design houses gearing up for 5G smartphone market boom
Taiwan-based IC design houses are gearing up for a boom in 5G smartphone shipments starting the fourth quarter of 2020, according to industry sources.
Tuesday 20 October 2020
Dialog licenses non-volatile ReRAM technology to Globalfoundries for 22FDX platform
Dialog Semiconductor and Globalfoundries have entered into an agreement in which Dialog licenses its conductive bridging RAM (CBRAM) technology to Globalfoundries, according to the...
Tuesday 20 October 2020
SK Hynix to acquire Intel NAND memory biz
Intel and SK Hynix have signed an agreement under which the latter would acquire the former's NAND memory and storage business for US$9 billion, according to the companies.
Monday 19 October 2020
China PCB makers poised for new stage of competition with Taiwan peers
With Taiwan sustaining its firm leadership in the global PCB industry, China has been fast catching up due to its heavy capital expenses over the past five years, and PCB makers in...
Friday 16 October 2020
China to step up construction of small 5G base stations in 2021
Telecom operators in China, after slowing down construction of 5G base stations in fourth-quarter 2020, are expected to reactivate new infrastructure projects in 2021 with focus placed...
Friday 16 October 2020
China 5G subscriber market keeps growing, says Digitimes Research
The 5G subscriber market has continued growing steadily in China, with its 5G connected devices in use on track to grow to 185 million units by year-end 2020, having reached 66 million...
Friday 16 October 2020
Tape COF substrate demand falling, likely to rebound in 1Q21
Tape COF substrate demand has been falling thanks partly to insufficient foundry support for LCD driver ICs, and may not pick up until the first quarter of 2021, prompting some makers...
Thursday 15 October 2020
TSMC expects 2020 revenue to rise 30%
TSMC expects to post revenues of between US$12.4 billion and US$12.7 billion in the fourth quarter of 2020, which is a 3.4% sequential increase at the midpoint. Gross margin and operating...
Thursday 15 October 2020
Win Semi enters LiDAR scanner supply chain for new 5G iPhones
GaAs foundry Win Semiconductor and its backend partners including Elite Advanced Laser (eLaser) are engaged in production of VCSEL chips for ToF-based LiDAR scanner for the iPhone...
Thursday 15 October 2020
Taiwan PCB makers obtain 60% of SLP orders for new iPhones
Zhen Ding Technology, Compeq Manufacturing and Unimicron Technology have together landed nearly 60% of total substrate-like PCB (SLP) orders placed by Apple for its new iPhone 12...
Wednesday 14 October 2020
Global notebook shipment forecast, 2021 and beyond
Notebook shipments are expected to grow over 20% on year in 2020 thanks to demand from stay-at-home activities in the wake of the coronavirus outbreak.
Wednesday 14 October 2020
IDMs, III-V players gearing up for GaN-on-SiC RF, PA components
International IDMs are keenly developing GaN-on-SiC RF and PA components to tap immense opportunities from communication applications, and Taiwan's III-V players including foundry...