Intel has announced that its first glass substrate for next-generation advanced packaging will enter mass production between 2026 and 2030.

Intel's China-specific version of its Habana Gaudi 2 AI processor has seen a sharp rise in demand, according to industry sources.

The Taiwan Printed Circuit Association (TPCA) and the Thailand Trade and Economic Office (TTEO) recently jointly held the inaugural "Thai Student PCB Job Fair" aiming to help Taiwanese...

Alberto Sangiovanni-Vincentelli, professor and Edgar L. and Harold H. Buttner Chair of Electrical Engineering and Computer Science Department at the University of California, Berkeley,...

Noida-based Sahasra Electronic Solutions, an affiliate with Sahasra Group, intends to launch the first made-in-India computer motherboard in November.

With SoftBank-backed IP giant Arm launching a blockbuster IPO (initial public offering) on the US Nasdaq market on September 14 at a unit share price of US$51, its CEO Rene Haas bears...

Huawei's progress in successfully producing self-developed chips may have inspired another Chinese smartphone brand company's decision to restart its smartphone system-on-chip (SoC)...

In the face of the semiconductor industry's downturn, GlobalWafers continues to maintain a strong performance, achieving record-high combined revenue in the first half of 2023. However,...

When the world is de-globalizing, it is the best time for Taiwan to re-connect to the global market. When a Taiwan-based IC distributor is moving toward the European and American...

IC packaging leadframe suppliers are bracing for on-year profit decreases in 2023, as demand for automotive chips cannot offset the impact of diminishing consumer chip demand, according...

Competition between the Arm architecture and open-source instruction set architecture (ISA) RISC-V has heated up recently and become a focal point as TSMC invests in Arm. Premium...

IC design firms are aware of a rising pattern of Chinese clients shifting orders to domestic competitors in favor of homegrown chips, according to industry sources in Taiwan.

Gaming continues to be one of the key competitive points of flagship smartphone SoC design in 2023, rather than generative AI as previously emphasized, according to sources.

Taiwanese IC distributor WT Microelectronics has entered into a definitive agreement to acquire all of Future Electronics' shares in an all-cash transaction valued at US$3.8 billion,...

Before 2022, one 6-inch SiC wafer without epitaxy produced by European and US foundries cost about US$1,000. While the quote has stayed at the same level for several years, it might...