Infineon is touting its recently released QDPAK and DDPAK top-side cooling (TSC) packages for high-voltage MOSFETs and other power devices, stating the solutions would enable customers...

The vast stretch of land lying a kilometer north of the German city of Grossenhain, Saxony has long been a part of the country's military history: at the onset of World War 1, the...

The decision by AUO to close a 5G LCD fab, the 5A, by the end of 2023 is part of the panel maker's plans to consolidate production lines and devote more resources to developing new...

Both Samsung Electronics and Intel are having difficulty obtaining orders for 3nm as well as sub-3nm chips, while TSMC continues to grow its client base in the process segment, according...

Nvidia has just released its midrange gaming GPU, RTX 4070, but its backend partners have yet to see the client show intention of scaling up production for the RTX 40 series, according...

Semiconductor materials supplier Topco Scientific remains optimistic about its sales growth this year.

Worldwide sales of semiconductor manufacturing equipment increased 5% from US$102.6 billion in 2021 to an all-time record of US$107.6 billion last year, SEMI, the industry association...

Niche-market memory IC design house Elite Semiconductor Memory Technology (ESMT) started seeing shipments of memory known-good dies (KGD) pick up in March, which the company views...

The global semiconductor market reached US$575.1 billion in 2022, but the figure only covers the IC design and IDM sectors. The entire semiconductor value chain should come close...

As semiconductor trade and investments are increasingly restricted between the US and China, Pat Gelsinger's first-ever visit to China as Intel's CEO underscores the chip giant's...

Despite a recent surge in short-lead-time orders for LCD Touch and Display Driver Integration (TDDI) is supporting inventory replenishment needs, overall sales in the consumer electronics,...

With its importance significantly highlighted during the Russia-Ukraine war, low-earth orbit (LEO) satellite communications will usher in enormous business opportunities for III-V...

Arm and Intel Foundry Services (IFS) have announced a multigeneration collaboration in which chip designers will be able to build low-power system-on-chips (SoC) using Intel 18A technology...

Semiconductor backend packaging and testing and mobile phone power amplifier (PA) companies agree that visibility for large-scale orders is still unclear going into the second quarter...

China's focus on the development of mature-node process technology for ICs may provide it with a bargaining advantage, according to industry observers.