The Rise of Malaysia

ICT and semiconductor industry's growing interest in Malaysia.

The US-China trade war has resulted in many companies seeking non-Chinese production sites as alternatives.

Malaysia is receiving increased interest from the ICT and semiconductor industries and emerging as a viable destination for production relocation.

DIGITMES Asia provides basic users with unlimited access to toll-free articles. Sign up for free subscription now to continue your reading!

Subscribe Now

IN THE NEWS

Monday 4 May 2026

SEMICON SEA 2026 highlights Malaysia's push to scale semiconductor assembly, testing and packaging

SEMICON SEA 2026 convened from May 5 to 7 at the Malaysia International Trade and Exhibition Center in Kuala Lumpur to showcase Malaysia's expanding role in the global semiconductor...

Sunday 26 April 2026

BizLink expands optical interconnect push, sees uncertain CPO ramp timing

The artificial intelligence boom continues to drive demand for related hardware, particularly as server power delivery and high-speed...

Friday 24 April 2026

BizLink builds Southeast Asia manufacturing network with distinct roles across key markets

Driven by geopolitical shifts and supply chain restructuring, Southeast Asia has become an important destination for Taiwanese electronics...

Tuesday 21 April 2026

BYD reassesses Malaysia factory project as talks stall with the government

In August 2025, the Chinese electric vehicle (EV) maker BYD announced plans to build a completely knocked-down (CKD) assembly plant at the...

Thursday 16 April 2026

SkyeChip IPO signals Malaysia's push into high-value chip design

Malaysia-based semiconductor design firm SkyeChip has appointed Maybank Investment Bank and CIMB Investment Bank as underwriters for its planned Main Market listing, according to a...

Wednesday 15 April 2026

China chip tool imports shift to Southeast Asia as US tightens export controls

China's imports of semiconductor manufacturing equipment from Southeast Asia surged in 2025, surpassing direct shipments from the US,...

Thursday 9 April 2026

ChipX targets AI data center market with photonics, power chips ahead of Malaysia fab

Semiconductor startup ChipX is moving to commercialize silicon photonics and high-voltage power chip technologies for artificial intelligence (AI) data centers, as it advances plans...

Wednesday 1 April 2026

Malaysia defends EV policy as BYD weighs assembly pullout

Malaysia's EV industrial policy is creating tension with foreign automakers, as export-driven and localization rules prompt BYD to reassess a planned plant. At the same time, authorities...

Monday 30 March 2026

Passive component maker Tai-Tech wins US client, scales Malaysia plant for AI server, EV demand

Taiwan inductor maker Tai-Tech has begun mass production at its Malaysia plant, targeting customers shifting supply chains away from China...

Thursday 26 March 2026

China's H3C expands server exports to ASEAN and Central Asia as global AI compute demand rises

As countries tighten controls on advanced chips and AI computing demand surges, how China secures compute resources matters globally. DIGITIMES Research reports H3C, a top Chinese...

Friday 20 March 2026

Malaysia chipmakers monitor helium supply risks as Middle East tensions weigh Qatar output

Malaysia's semiconductor industry is closely monitoring helium supply risks amid escalating tensions in the Middle East, though companies have not yet reported operational disrupti...

Friday 20 March 2026

Lynas's samarium oxide debut in Malaysia strengthens supply chain alternative to China

Lynas Rare Earths has achieved first production of samarium oxide at Lynas Malaysia, expanding its range of separated heavy rare earth oxides to three and reinforcing its status as...

Thursday 19 March 2026

Fitipower opens Malaysia R&D center to boost global innovation and support

Fitpower officially inaugurated its new office in Puchong Financial Corporate Center (PFCC), Selangor, Malaysia, this week, marking the launch of its Malaysian subsidiary. The move...

Thursday 19 March 2026

Intel to expand EMIB capabilities in Malaysia amid Section 232 probe uncertainty

Intel's advanced packaging complex in Malaysia is expected to begin operations later this year, Prime Minister Datuk Seri Anwar Ibrahim said, as the company advances its assembly and...

Wednesday 18 March 2026

Chipbond sets sights on SiPh and LPO for next phase of growth

Display driver IC (DDIC) packaging leader Chipbond outlined three key growth drivers at its recent earnings call that are expected to support its core driver IC business despite industry...

1/47 pages